Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a metal containment wall and a solder layer in which the metal containment wall includes a cavity and the solder terminal contacts the metal containment wall in the cavity, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects the routing line and the pad, etching the metal base to reduce contact area between the metal base and the routing line and between the metal base and the metal containment wall, and providing a solder terminal that includes the solder layer.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is adjacent to the bumped terminal and extends laterally beyond the bumped terminal and the filler, and the filler contacts the bumped terminal in a cavity that extends through the bumped terminal.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pad. The metal containment wall includes a cavity, and the solder terminal contacts the metal containment wall in the cavity and is spaced from the routing line.

Abstract: A method of making a semiconductor chip assembly is disclosed. The semiconductor chip assembly is made by attaching a semiconductor chip to a multi-layer build-up substrate with a metal-based core carrier. The build-up substrate layers provide routing functions while the metal-based core carrier provides critical mechanical support for the semiconductor assembly. The metal-based core carrier is sacrificial and is eventually removed with the build-up substrate remaining.

Abstract: The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.

Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then grinding the bumped terminal to expose the filler.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal pillar includes tapered sidewalls with first and second sidewall portions and a spike, and the first and second sidewall portions are concave arcs that are adjacent to one another at the spike.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line.

Abstract: A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanically attaching the conductive trace to the chip such that the conductive trace overlaps the pad and the conductive adhesive contacts and is sandwiched between and electrically connects the conductive trace and the pad, and then removing a portion of the conductive adhesive such that the conductive adhesive still contacts and is sandwiched between and electrically connects the conductive trace and the pad and the conductive adhesive no longer electrically connects the conductive trace to a conductor external to the chip.

Abstract: A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar, providing a second semiconductor chip assembly that includes a second chip, a second conductive trace and a second encapsulant, wherein the second encapsulant includes a second aperture, and then positioning the first and second assemblies such that the first assembly overlaps the second assembly and the first metal pillar extends into the second aperture.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The pillar extends into an opening in the ground plane, the solder joint contacts and electrically connects the pillar and the ground plane, and the ground plane is electrically connected to the pad.

Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects the routing line and the pad, and etching the metal base to form a metal pillar with a tip adjacent to the trench.

Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects the routing line and the pad, etching the metal base to form a metal pillar with a tip adjacent to the trench, and providing a contact terminal that includes the pillar etch mask and is a permanent part of the assembly.

Abstract: A method of making a semiconductor chip assembly includes providing a metal base that includes a metal plate and a metal layer, providing a routing line that contacts the metal layer and an etch mask that contacts the metal plate, providing a semiconductor chip that includes a conductive pad, mechanically attaching the chip to the routing line, electrically connecting the routing line to the pad, and etching the metal base using a first wet chemical that is selective of the metal plate and then a second wet chemical etch that is selective of the metal layer and the etch mask to form a pillar from an unetched portion of the metal base that contacts the routing line.

Abstract: A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on opposite sides of the lead, and the wire bonds contact the same side of the lead.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electrically connected to the pad.

Abstract: A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a routing line, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip, then etching the metal base, forming an interconnect in a via, and forming a connection joint in an opening, wherein the via extends through the insulative base, the opening extends through the insulative base, the interconnect extends through the insulative base and is electrically connected to the routing line, and the connection joint electrically connects the routing line and the pad. Preferably, the opening extends through an insulative adhesive that attaches the routing line to the chip.

Abstract: A three-dimensional stacked semiconductor package device includes first and second semiconductor package devices and a conductive bond. The first device includes a first insulative housing, a first semiconductor chip and a first lead that is bent outside the first insulative housing. The second device includes a second insulative housing, a second semiconductor chip and a second lead that is flat outside the second insulative housing. The conductive bond contacts and electrically connects the leads.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line extends laterally from the pillar towards the chip, the pillar includes tapered sidewalls, and the chip and the pillar are embedded in the encapsulant and extend vertically beyond the routing line in the same direction.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electrically connected to the pad.