Patents Assigned to Bridge Semiconductor Corporation
  • Patent number: 8003415
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides the vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive.
    Type: Grant
    Filed: September 13, 2009
    Date of Patent: August 23, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Chia-Chung Wang, Charles W. C. Lin
  • Patent number: 7993983
    Abstract: A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, then forming an encapsulant that covers the chip, then grinding the encapsulant without grinding the chip and then grinding the encapsulant and the chip such that the encapsulant and the chip are laterally aligned.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: August 9, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventor: Charles W. C. Lin
  • Patent number: 7951622
    Abstract: A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, the signal post and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conduct
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: May 31, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 7939375
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: February 28, 2010
    Date of Patent: May 10, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
  • Patent number: 7932165
    Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, then etching the bumped terminal to expose the filler, then forming an insulative base, and then grinding the insulative base to expose the filler.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: April 26, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Cheng-Chung Chen
  • Patent number: 7901993
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: March 8, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 7833827
    Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then forming an insulative base that covers a peripheral portion of the bumped terminal.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: November 16, 2010
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Cheng-Chung Chen
  • Publication number: 20100259322
    Abstract: A readout circuit. The readout circuit includes a charge amplification circuit and an analog-to-digital conversion circuit. The analog-to-digital conversion circuit is connected to the charge amplification circuit.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 14, 2010
    Applicant: Bridge Semiconductor Corporation
    Inventors: Joseph R. Acquaviva, Arif Ahmed
  • Publication number: 20100258348
    Abstract: An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 14, 2010
    Applicant: Bridge Semiconductor Corporation
    Inventors: Joshua Ziff, Joseph R. Acquaviva, Chien Hung Wu, William Jan, Charles Buenzli, Nelson Kuan
  • Patent number: 7811863
    Abstract: A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a metal pillar on the routing line, forming an encapsulant that covers the chip and the metal pillar, grinding the encapsulant without grinding the metal pillar, then grinding the encapsulant and the metal pillar such that the encapsulant and the metal pillar are laterally aligned, and then attaching a heat sink to the metal pillar.
    Type: Grant
    Filed: February 1, 2009
    Date of Patent: October 12, 2010
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, David M. Sigmond
  • Publication number: 20100214742
    Abstract: A memory module has a good heat sinking effect. Each chip on the memory module has a surface exposed in the air. Or, a thermal pad can further adhere to the surface of the chips. Thus, the heat sinking effect of the memory module is improved; and an easy and convenient producing method is obtained.
    Type: Application
    Filed: May 7, 2008
    Publication date: August 26, 2010
    Applicant: Bridge Semiconductor Corporation
    Inventors: Charles W.C. Lin, Wei-Kuang Pan, Chia-Chung Wang
  • Patent number: 7750483
    Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and an enlarged plated contact terminal, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, the metal pillar is welded to the routing line and includes a ball bond and a stem, and the plated contact terminal is plated on the stem.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: July 6, 2010
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Cheng-Chung Chen
  • Patent number: 7656031
    Abstract: The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: February 2, 2010
    Assignee: Bridge Semiconductor Corporation
    Inventors: Cheng-Chung Chen, Chia-Chung Wang, Chin Hock Tan, Charles W. C. Lin
  • Publication number: 20090284932
    Abstract: The present invention thermally enhanced package with embedded metal slug and patterned circuitry discloses a thermal enhanced package with an embedded metal slug that can be easy directly assembled to the printed circuit board to significantly improve package's thermal dissipation efficiency through the assistance of metal traces in the application board.
    Type: Application
    Filed: March 18, 2009
    Publication date: November 19, 2009
    Applicant: Bridge Semiconductor Corporation
    Inventor: Charles W.C. LIN
  • Patent number: 7538415
    Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative base. The routing line contacts the bumped terminal and the filler and extends laterally beyond the bumped terminal and the filler, the filler contacts the bumped terminal in a cavity that extends into the bumped terminal, and the insulative base contacts the routing line and the bumped terminal.
    Type: Grant
    Filed: February 17, 2007
    Date of Patent: May 26, 2009
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Cheng-Chung Chen
  • Patent number: 7494843
    Abstract: A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a thermal conductor on the chip, forming an encapsulant that covers the chip and the thermal conductor, grinding the encapsulant without grinding the thermal conductor or the chip and then grinding the encapsulant and the thermal conductor without grinding the chip such that the encapsulant and the thermal conductor are laterally aligned.
    Type: Grant
    Filed: December 26, 2006
    Date of Patent: February 24, 2009
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 7459385
    Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line is adjacent to the bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then grinding the bumped terminal to expose the filler.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: December 2, 2008
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Cheng-Chung Chen, Cheng-Lien Chiang
  • Patent number: 7453140
    Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative base. The routing line contacts the filler and extends laterally beyond the filler, and the filler contacts the insulative base in an aperture that extends through the insulative base.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: November 18, 2008
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Cheng-Chung Chen
  • Patent number: 7446419
    Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line and includes stacked metal balls that are welded together.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: November 4, 2008
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 7425759
    Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line contacts the bumped terminal and the filler and extends laterally beyond the bumped terminal and the filler, and the filler contacts the bumped terminal in a cavity that extends through the bumped terminal.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: September 16, 2008
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Cheng-Chung Chen