Abstract: Linear semiconductor handling systems provide more balanced processing capacity using various techniques to provide increased processing capacity to relatively slow processes. This may include use of hexagonal vacuum chambers to provide additional facets for slow process modules, use of circulating process modules to provide more processing capacity at a single facet of a vacuum chamber, or the use of wide process modules having multiple processing sites. This approach may be used, for example, to balance processing capacity in a typical process that includes plasma enhanced chemical vapor deposition steps and bevel etch steps.

Abstract: A refrigerator system or cryopump includes a first refrigerator having at least first and second stages, and a second refrigerator. A thermal coupling between the first stage of the first refrigerator and a cold end of the second refrigerator is restricted to maintain a temperature difference between the cold end of the second refrigerator and the first stage of the first refrigerator. The refrigerator system or cryopump also includes a radiation shield in thermal contact with the cold end of the second refrigerator, and a condensing surface, spaced from and surrounded by the radiation shield, and in thermal contact with a second stage, e.g., coldest stage, of the first refrigerator. The restricted thermal coupling can be configured to balance the cooling load on the two refrigerators.

Abstract: A method for positioning substrates in a substrate processing apparatus having a substrate alignment device, a first substrate transport apparatus and a second substrate transport apparatus, includes calibrating the substrate alignment device with a motion of the first substrate transport apparatus, and calibrating a coordinate system of the second substrate transport apparatus with the substrate alignment device.

Abstract: A system for accessing data remotely from a network. In one embodiment, the system comprises a first network interface card permitting data transfer between a local network and an intermediate network; a second network interface card permitting data transfer between intermediate network and a remote network; and a module located within the intermediate network, through which all data transferring between the first network and the third network must pass. Information transmitted by the remote network may or may not be received and acted upon by the local network depending on a set of predetermined criteria applied by the intermediate network.

Abstract: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: A substrate processing system including a housing for housing at least part of a processing device, at least one target affixed to the processing device, the processing device having a first processing device reference point in a known relationship with the at least one target, at least one transmitter located within the housing and configured to transmit an identification signal identifying the at least one transmitter to the at least one target and a controller operably connected to the at least one target and the at least one transmitter, the controller being configured to receive data signals, based on the identification signal, from one of the at least one target and the at least one transmitter and control an operational characteristic of the processing device, based on the data signals.

Abstract: A substrate processing apparatus having a station for loading and unloading substrates from the apparatus, includes an aperture closure for sealing a loading and unloading aperture of the station, a fluidic magazine door drive for removing a door of a substrate magazine and thus opening the substrate magazine and for operating the aperture closure to open the aperture, and sensor for mapping vertical locations of substrates mounted to the magazine door of the drive. The fluidic magazine door drive may include an encoder different from the sensor, the encoder being configured for determining the vertical location of the sensor.

Abstract: A gripper apparatus for removing and replacing objects such as containers or vials in an array of containers has a gripper head which extends downward from a support arm, a planetary gear assembly mounted in the gripper head including at least three planet gears, and at least one gripping pin extending downward from each planet gear and projecting beyond a lower end of the gripper head. A drive motor drives the planetary gear assembly to rotate the planet gears in opposite directions, moving the pins inward and outward along predetermined paths to grip and carry an object and release the object when in a desired location.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.

Abstract: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

Abstract: A reticle manipulating device comprising a housing capable of having a controlled environment wherein at least one processing module is connected to the housing and capable of processing a reticle. A transport apparatus is connected to the housing for transporting the reticle between the at least one module to another portion of the housing. At least one module is removably connectable to the housing and at least one module has an interface adapted for removably coupling the module to the housing. One module being selectable for connection to the housing from a number of different interchangeable module each having a different predetermined characteristic and being capable of connection to the housing.

Abstract: A system of moving magnets for sealing a container may include a plurality of moveable magnets disposed near a perimeter of a container door and a rotatable linkage hub positioned within the perimeter of the container door. In addition, the system may include a plurality of control linkages connecting each of the plurality of moveable magnets to the linkage hub so that rotating the linkage hub causes the control linkages to move the moveable magnets between a sealed position and an open position. Alternatively, the moveable magnets may be connected to each other by a magnet positioning mechanism to physically move the magnets along a path near the perimeter. A plurality of static magnets may be disposed near an opening sized to receive the container door and positioned to form a magnetic seal with the moveable magnets when the moveable magnets are positioned at the sealed position.

Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers. A four-axis robot arm is disclosed, capable of linear translation, rotation and articulation, and z-motion.

Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

Abstract: A cryogenic refrigerator has a refrigeration cylinder and at least two displacers. Each displacer reciprocates in the refrigeration cylinder and moves refrigeration gas through the refrigeration cylinder. A regenerator cools the refrigeration gas, and gas control valves admit high pressure gas into the refrigeration cylinder and exhaust gas from the refrigeration cylinder. The refrigerator also has linear motors operatively connected to displacers, and the linear motors drive the displacers in reciprocating movement. A position sensor is provided to determine a parameter of the displacers during reciprocation. A controller is operatively connected to the linear motors to control the linear motors. The controller controls a parameter of the two displacers during reciprocation. The parameter can be stroke length, stroke speed, stroke phase or another parameter of the displacer for temperature control of the cryogenic refrigerator. The cryogenic refrigerator may also include a device to remove vibration.

Abstract: The present invention relates to a radio-frequency identification communications system, RFID communications system, for monitoring the inventory of a live storage system, comprising at least one first and one second stationary RFID antenna (5, 6) for transmitting data; and an RFID transponder (2) attached to an object or a group of objects (1), wherein the RFID transponder (2) electronically stores a code of the object or the group of objects (1), and wherein the first RFID antenna (5) is placed in an input region, and the second RFID antenna (6) is placed in an output region of a storage track of the live storage system, in order to register the object or the group of objects (1) on the basis of the code of the RFID transponder (2).

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract: A bypass thermal adjuster, which may be placed between two robots, provides a chamber for isolation and thermal control of wafers while permitting other wafers to be passed through the adjuster by the robots.