Abstract: Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.

Abstract: Linear semiconductor handling systems provide more balanced processing capacity using various techniques to provide increased processing capacity to relatively slow processes. This may include use of hexagonal vacuum chambers to provide additional facets for slow process modules, use of circulating process modules to provide more processing capacity at a single facet of a vacuum chamber, or the use of wide process modules having multiple processing sites. This approach may be used, for example, to balance processing capacity in a typical process that includes plasma enhanced chemical vapor deposition steps and bevel etch steps.

Abstract: A substrate processing apparatus is presented having a transport chamber defining substantially linear substrate transport paths, a linear array of substrate holding modules, each communicably connected to the chamber. The substrate transport has at least one transporter capable of holding and moving the substrate on more than one substantially linear substrate transport paths. The transport chamber having different transport tubes at least one of which is sealable at both ends of the transport tube and configured to hold an isolated atmosphere different from that of the transport tubes, each of the different transport tubes having one of the substrate transport paths located therein different from another of the transport paths located in another of the transport tubes, and being communicably connected to each other, where at least one of the transport tubes is configured to provide uninterrupted transit of the substrate transport through the transport tubes.

Abstract: A substrate transport apparatus including a drive section having at least one drive shaft and at least two scara arms operably coupled to the at least one drive shaft, the at least one drive shaft being a common drive shaft for the at least two scara arms effecting extension and retraction of the at least two scara arms, wherein the at least two scara arms are coupled to each other so that, with the at least one drive shaft coupled to the at least two scara arms, rotation of the drive shaft effects extension and retraction of one of the at least two scara arms substantially independent of motion of another of the at least two scara arms.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: A substrate transport apparatus including a peripheral wall having an inner surface that defines a substrate transport chamber capable of holding an isolated atmosphere, at least one substantially ring shaped motor having at least one stator module located within the peripheral wall, between the inner surface and an adjacent outer surface of the peripheral wall and at least one rotor suspended substantially without contact within the transport chamber such that a surface of the peripheral wall encompassed by the ring shaped motor is configured for attachment thereto of a predetermined device and at least one substrate transport arm connected to the at least one rotor and having at least one end effector configured to hold at least one substrate.

Abstract: In a system having a number of semiconductor processing modules sharing a common vacuum environment, a mid-entry load lock is provided to permit insertion and removal of wafers into the vacuum environment at a point between various other robotic handlers, process modules, and load locks. This arrangement permits increased flexibility in scheduling when multiple wafers are processed concurrently.

Abstract: Substrate processing apparatus having a chamber, a generally linear array of process modules, a substrate transport, and a drive system. The chamber is capable of being isolated from the outside atmosphere. Each process module of the array is communicably connected to the chamber to allow a substrate to be transferred between the chamber and process module. The substrate transport is located in and is movably supported from the chamber. The transport is capable of moving along a linear path defined by the chamber for transporting the substrate between process modules. The drive system is connected to the chamber for driving and moving the transport along the linear path. The chamber comprises a selectable number of chamber modules serially abutted to defined the chamber. Each module has an integral portion of the drive system.

Abstract: A system for condition monitoring and fault diagnosis includes a data collection function that acquires time histories of selected variables for one or more of the components, a pre-processing function that calculates specified characteristics of the time histories, an analysis function for evaluating the characteristics to produce one or more hypotheses of a condition of the one or more components, and a reasoning function for determining the condition of the one or more components from the one or more hypotheses.

Abstract: An ionization gauge that measures pressure has an electron source that emits electrons, and an anode that defines an ionization space. The gauge also includes a collector electrode to collect ions formed by an impact between the electrons and a gas and to measure pressure based on the collected ions. The electron source is dynamically varied in emission current between a plurality of emission levels dependent on pressure and a second parameter other than pressure. The ionization gauge may also vary various operating parameters of the gauge components according to parameters stored in a non-volatile memory and selected by a user.

Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier so the at least one substrate transport carrier is capable of being coupled to the load port interface without lifting the at least one substrate transport carrier off the carrier holding station. The carrier holding station is arranged to provide a substantially simultaneous swap section for substantially simultaneous replacement of the substrate transport carrier from the carrier holding station.

Abstract: Substrate processing apparatus having a transport chamber, a linear array of substrate holding modules alongside the transport chamber, and a substrate transport located in the chamber. The chamber can hold an isolated atmosphere, and defines more than one substantially linear transport paths extending longitudinally along the transport chamber. The transport in the chamber is capable of transporting the substrate along the linear transport paths. The transport has a transporter capable of holding and moving the substrate. The transporter interfaces a wall of the transport chamber for moving along at least one of linear paths. The transport chamber has interfaces for mating with other substrate holding modules at opposite ends of the transport chamber. Each interface has an opening through which at least one of the more than one linear transport paths extends, and the transport chamber has a selectably variable longitudinal length between the interfaces.

Abstract: A cryogenic refrigerator has a refrigeration cylinder and at least two displacers. Each displacer reciprocates in the refrigeration cylinder and moves refrigeration gas through the refrigeration cylinder. A regenerator cools the refrigeration gas, and gas control valves admit high pressure gas into the refrigeration cylinder and exhaust gas from the refrigeration cylinder. The refrigerator also has linear motors operatively connected to displacers, and the linear motors drive the displacers in reciprocating movement. A position sensor is provided to determine a parameter of the displacers during reciprocation. A controller is operatively connected to the linear motors to control the linear motors. The controller controls a parameter of the two displacers during reciprocation. The parameter can be stroke length, stroke speed, stroke phase or another parameter of the displacer for temperature control of the cryogenic refrigerator. The cryogenic refrigerator may also include a device to remove vibration.

Abstract: A substrate transport apparatus including a drive section having at least one drive shaft and at least two scara arms operably coupled to the at least one drive shaft, the at least one drive shaft being a common drive shaft for the at least two scara arms effecting extension and retraction of the at least two scara arms, wherein the at least two scara arms are coupled to each other so that, with the at least one drive shaft coupled to the at least two scara arms, rotation of the drive shaft effects extension and retraction of one of the at least two scara arms substantially independent of motion of another of the at least two scara arms.

Abstract: A control system includes a clustered architecture having a master controller, a central control section including one or more first remote controllers under direct control of the master controller, and a distributed control section including a cluster controller controlled by the master controller. The cluster controller controls the activities of one or more second remote controllers. Each of the first and second remote controllers are utilized to drive one or more axes.

Abstract: A substrate processing system including a housing for housing at least part of a processing device, at least one target affixed to the processing device, the processing device having a first processing device reference point in a known relationship with the at least one target, at least one transmitter located within the housing and configured to transmit an identification signal identifying the at least one transmitter to the at least one target and a controller operably connected to the at least one target and the at least one transmitter, the controller being configured to receive data signals, based on the identification signal, from one of the at least one target and the at least one transmitter and control an operational characteristic of the processing device, based on the data signals.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.

Abstract: A method and apparatus for measuring gas pressure by combining an ionization gauge with at least one other vacuum sensor. Nonvolatile memory coupled to the vacuum gauge contains calibration parameters unique to each individual sensor based on factory calibration. The nonvolatile memory may contain calibration parameters for a heat-sensitive vacuum sensor to compensate for the temperature gradients generated by the ionization gauge. The calibration parameters are a function of calibration data determined when the ionization gauge is both on and off. The nonvolatile memory may store a window of measurement data of the vacuum gauge that is updated at predetermined time intervals and in response to an event, such as an error event, to aid in investigating the cause of vacuum gauge malfunction or failure.

Abstract: A substrate processing apparatus having a transport apparatus, at least one sensor connected to the transport apparatus and a controller. The transport apparatus is adapted for transporting the substrate between processing stations of the processing apparatus. The sensor is capable of sensing the substrate transported by the transporting apparatus. The sensor is arranged for sending at least one signal in response to sensing the substrate. The controller is communicably connected to the sensor and arranged to determine alignment of the substrate in at least two directions, angled relative to each other, relative to a predetermined location. The controller is capable of determining alignment from the at least one signal identifying no more than two points on the substrate and independent of radial variances between substrates.