Abstract: A substrate processing apparatus has a frame and a load port connected to the frame and adapted to mate a substrate transport container to the frame. The apparatus has transportable storage that is adapted to be removably connected to the frame and fit beneath the load port. The storage may be an enclosure housing electrical, mechanical, or electromechanical devices of the substrate processing apparatus.

Abstract: The presence of a workpiece on an end effector of a vacuum robotic handler is detecting using any of a number of non-contact techniques in which some or all of the detection hardware is positioned outside a vacuum chamber that encloses the vacuum robotic handler. Various deployments include laser beam breaking, analysis of radar reflection signals, or analysis of radio frequency identification tag signatures. By providing non-physical couplings between hardware inside and outside of a vacuum environment, integrity of the vacuum is improved. These non-contact techniques are further adapted as described herein to multi-wafer and multi-end effector environments so that independent detection of multiple wafers (e.g., for each end effector) can be performed.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: A substrate transport apparatus comprising a drive mechanism, a movable arm assembly, and an end effector with an active edge gripper. The apparatus is configured to avoid the need to provide cables to the end effector for power or communication. In one aspect, the gripper is actuated when a motion sensor senses motion of the end effector. In another aspect, communication signals are wirelessly transferred to the end effector to control the active gripper. In another aspect, power is wirelessly transferred to the end effector to power actuation of the gripper.

Abstract: A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: An apparatus including a controller, a workpiece transport in communication with the controller having a movable portion and a transport path, and a multi-dimensional position measurement device including at least one field generating platen attached to the movable portion and at least one sensor group positioned along the transport path and in communication with the controller, the field generating platen is configured for position measurement and propelling the movable portion, each sensor in the at least one sensor group is configured to provide but one output signal along a single axis corresponding to a sensed field generated by the at least one field generating platen and the controller is configured calculate a multi-dimensional position of the movable portion based on the but one output signal of at least one of the sensors in the at least one sensor group, the multi-dimensional position including a planar position and a gap measurement.

Abstract: A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.

Abstract: A robot assembly for transporting a substrate is presented. The robot assembly having a first arm and a second arm supported by a column, the first arm further having a first limb, the first limb having a first set of revolute joint/line pairs configured to provide translation and rotation of the distalmost link of the first limb in the horizontal plane. The assembly further having a second arm further having a second limb, the second limb comprising a second set of revolute joint/link pairs configured to provide translation and rotation of a distalmost link of the second limb in the horizontal plane. The first limb and second limb further having proximal revolute joints having a common vertical axis of rotation and a proximal inner joint housed in a common housing.

Abstract: In accordance to an exemplary embodiment of the disclosed embodiments, a substrate aligner apparatus is presented, the substrate aligner apparatus having a frame adapted to allow a substrate transporter to transport a substrate to and from the aligner apparatus, an inverted chuck capable of holding the substrate and movably connected to the frame by a chuck driveshaft engaged to the inverted chuck for moving the inverted chuck relative to the frame and effecting alignment of the substrate, a sensing device located between the chuck and chuck driveshaft for detecting a position determining feature of the substrate, and a substrate transfer mechanism movably connected to the frame and located inside the frame below the inverted chuck for moving the substrate from the inverted chuck to the substrate transporter.

Abstract: A method for positioning substrates in a substrate processing apparatus having a substrate alignment device, a first substrate transport apparatus and a second substrate transport apparatus, includes calibrating the substrate alignment device with a motion of the first substrate transport apparatus, and calibrating a coordinate system of the second substrate transport apparatus with the substrate alignment device.

Abstract: Linear semiconductor handling systems provide more balanced processing capacity using various techniques to provide increased processing capacity to relatively slow processes. This may include use of hexagonal vacuum chambers to provide additional facets for slow process modules, use of circulating process modules to provide more processing capacity at a single facet of a vacuum chamber, or the use of wide process modules having multiple processing sites. This approach may be used, for example, to balance processing capacity in a typical process that includes plasma enhanced chemical vapor deposition steps and bevel etch steps.

Abstract: Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.

Abstract: Aspects of the invention are found in a heat exchanger. The heat exchanger includes a fluid inlet manifold, a fluid outlet manifold, a plurality of heat transfer channels configured to communicate with the fluid inlet manifold and the fluid outlet manifold, and packing located within the fluid inlet manifold. Further aspects of the invention are found in a refrigeration system. The refrigeration system includes a compressor and at least one heat exchanger coupled to the compressor. The at least one heat exchanger includes a header, packing located in the header, and a heat transfer channel. The heat transfer channel is configured to receive fluid passing through the header and the packing.

Abstract: In accordance to an aspect of the disclosed embodiments, a substrate transport apparatus is provided. The substrate transport apparatus includes a frame defining a chamber, at least one stator module embedded at least partly into a peripheral wall of the chamber, the at least one stator module defining an axis of rotation. The substrate transport apparatus further includes at least one rotor substantially concentrically disposed relative to the at least one stator module about the axis of rotation, the at least one rotor being configured to interface with the at least one stator module and being suspended by a respective one of the at least one stator module substantially without contact within the chamber. The substrate transport apparatus further includes at least one substrate transport arm connected to the at least one rotor and having at least one end effector configured to hold at least one substrate.

Abstract: An automated storage system for storing large quantities of samples in trays includes a storage compartment, a tray shuttle compartment abutting the storage compartment on one side and a plurality of independent modules on the other side. The modules perform processing of samples that are retrieved from the storage compartment by a tray shuttle, including extraction of selected samples from retrieved source trays and transfer of the selected samples into a separate, destination tray that can be further processed or removed from the system for use. The independent operation of the modules permits handling and processing to be performed simultaneously by different modules while the tray shuttle accesses additional samples within the storage compartment. In one embodiment, a vertical carousel is used to vertically align a desired tray with the tray shuttle, while the tray shuttle operates within a horizontal plane.

Abstract: A cluster tool has a transfer chamber, and a load lock chamber. An adaptor is configured to be coupled between the transfer chamber and the load lock chamber. The adaptor has an adaptor housing with an interior space including an entrance with a first valve and an exit with a second valve. The adaptor housing forms a substrate path through the interior space. The first valve connects the interior space and the load lock chamber. The second valve connects the interior space and the transfer chamber. A cryogenic surface is associated with the adaptor. Other pumps can be associated with the adaptor, such as, for example, a turbo pump, or water vapor pump. The cryogenic surface is configured to selectively evacuate the interior space. A wafer is adapted to be moved through the first valve and through the adaptor housing along the path. The wafer is moved through the exit and into the transfer chamber once the second valve is opened. This adaptor can be applied to the process chamber as well as the load lock.

Abstract: A substrate processing apparatus including a transport chamber having an end and defining more than one substantially linear substrate transport zone where each transport zone extends longitudinally along the transport chamber between opposing walls of the transport chamber and at least one of the more than one substantially linear substrate transport zones is configured as a supply zone for enabling transport of substrates from the end and at least one of the more than one substantially linear substrate transport zones is configured as a return zone for enabling transport of substrates to the end, and at least one substrate transport located in and movably mounted to the transport chamber for transporting substrates along the more than one substantially linear substrate transport zone, where each substrate transport zone is configured to allow the at least one substrate transport to move from one transport zone to another transport zone.

Abstract: A process chamber with integrated pumping including a process chamber, refrigerators and arrays, or pumping surface, that are integral to the process chamber.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: An apparatus for gripping a substrate on its peripheral edge including a substrate support having proximate and distal ends, at least one distal rest pad disposed at the distal end, the at least one distal rest pad includes a back stop portion and is configured to support the peripheral edge of the substrate, at least one proximate rest pad disposed at the proximate end, the at least one proximate rest pad being configured to support the peripheral edge of the substrate, and an active contact member assembly disposed at the proximate end, the active contact member assembly including a pusher member, a contact member and a rotatable coupling member that are reciprocably movable towards the distal end for urging the substrate against the back stop portion, the contact member being rotatably secured to the pusher member and free to rotate about an axis of the rotatable coupling member.