Abstract: An ionization gauge to measure pressure and to reduce sputtering yields includes at least one electron source that generates electrons. The ionization gauge also includes a collector electrode that collects ions formed by the collisions between the electrons and gas molecules. The ionization gauge also includes an anode. An anode bias voltage relative to a bias voltage of a collector electrode is configured to switch at a predetermined pressure to decrease a yield of sputtering collisions.

Abstract: A control system includes a clustered architecture having a master controller, a central control section including one or more first remote controllers under direct control of the master controller, and a distributed control section including a cluster controller controlled by the master controller. The cluster controller controls the activities of one or more second remote controllers. Each of the first and second remote controllers are utilized to drive one or more axes.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.

Abstract: A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads.

Abstract: A dual arm robot assembly has two arms each having a set of joint/link pairs that, in conjunction with an actuator assembly, define at least three degrees of freedom to provide independent horizontal translation and rotation of a distalmost link. A vertical motion mechanism is also provided.

Abstract: A semiconductor workpiece processing apparatus having a first chamber, a transport vehicle, and another chamber. The first chamber is capable of being isolated from an outside atmosphere. The transport vehicle is located in the first chamber and is movably supported from the first chamber for moving linearly relative to the first chamber. The transport vehicle includes a base, and an integral semiconductor workpiece transfer arm movably mounted to the base and capable of multi-access movement relative to the base. The other chamber is communicably connected to the first chamber via a closable opening of the first chamber. The opening is sized to allow the transport vehicle to transit between the first chamber and the other chamber through the opening.

Abstract: A programming interface for a hardware system includes an embedded layer for programmatic access to a physical realization of hardware, a simulation system for simulation of the hardware, and a diagnostics engine that analyzes and compares feedback data from the simulation system and the physical realization. The programming interface may be usefully employed, for example, in the design, purchase, and deployment of robotics for semiconductor manufacturing.

Abstract: A sensing mechanism includes a magnetic source, a magnetic flux sensor, a sensor backing on which the magnetic source and flux sensor are mounted, and a ferromagnetic target, where the magnetic source, magnetic flux sensor, and ferromagnetic target are positioned to form a magnetic circuit from the magnetic source to the target, from the target to the sensor, and returning to the magnetic source through the sensor backing.

Abstract: A substrate processing apparatus has a substrate transport apparatus for transporting substrates, a sensor, and a control system. The processing apparatus is adapted to effect relative movement between the substrate and the sensor. The processing apparatus is further adapted to determine a position of the substrate by sensing the substrate with the sensor.

Abstract: A system for condition monitoring and fault diagnosis includes a data collection function that acquires time histories of selected variables for one or more of the components, a pre-processing function that calculates specified characteristics of the time histories, an analysis function for evaluating the characteristics to produce one or more hypotheses of a condition of the one or more components, and a reasoning function for determining the condition of the one or more components from the one or more hypotheses.

Abstract: A substrate processing apparatus has a frame and a load port connected to the frame and adapted to mate a substrate transport container to the frame. The apparatus has transportable storage that is adapted to be removably connected to the frame and fit beneath the load port. The storage may be an enclosure housing electrical, mechanical, or electromechanical devices of the substrate processing apparatus.

Abstract: A load port including a frame defining a load port opening, a substrate carrier interface connected to the frame and configured to removably couple with a substrate carrier shell, a load port door configured to interface with a substrate carrier door, the load port door being movably coupled to frame and having a first position substantially blocking the load port opening, and a second position where the load port opening is substantially unblocked by the load port door, and a door coupling member without moving parts, located on the load port door configured to releasably couple with a corresponding member without moving parts on the substrate carrier door, wherein activation of the door coupling member effects coupling between the load port door and substrate carrier door and a passive release of the substrate carrier door from the substrate carrier shell.

Abstract: A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.

Abstract: A helium management control system for controlling the helium refrigerant supply from a common manifold supplies a plurality of cryogenic refrigerators with an appropriate helium supply. The system employs a plurality of sensors to monitor and regulate the overall refrigerant supply to deliver an appropriate refrigerant supply to each of the cryogenic refrigerators depending on the computed aggregate cooling demand of all of the cryogenic refrigerators. An appropriate supply of helium is distributed to each cryopump by sensing excess and sparse helium refrigerant and redistributing refrigerant accordingly. If the total refrigeration supply exceeds the total refrigerant demand, or consumption, excess refrigerant is directed to cryogenic refrigerators which can utilize the excess helium to complete a current cooling function more quickly.

Abstract: Shields for feedthrough pin insulators of a hot cathode ionization gauge are provided to increase the operational lifetime of the ionization gauge in harmful process environments. Various shield materials, designs, and configurations may be employed depending on the gauge design and other factors. In one embodiment, the shields may include apertures through which to insert feedthrough pins and spacers to provide an optimal distance between the shields and the feedthrough pin insulators before the shields are attached to the gauge. The shields may further include tabs used to attach the shields to components of the gauge, such as the gauge's feedthrough pins. Through use of example embodiments of the insulator shields, the life of the ionization gauge is extended by preventing gaseous products from a process in a vacuum chamber or material sputtered from the ionization gauge from depositing on the feedthrough pin insulators and causing electrical leakage from the gauge's electrodes.

Abstract: A reticle manipulating device comprising a housing capable of having a controlled environment wherein at least one processing module is connected to the housing and capable of processing a reticle. A transport apparatus is, connected to the housing for transporting the reticle between the at least one module to another portion of the housing. At least one module is removably connectable to the housing and at least one module has an interface adapted for removably coupling the module to the housing. One module being selectable for connection to the housing from a number of different interchangeable module each having a different predetermined characteristic and being capable of connection to the housing.

Abstract: A sensing mechanism includes a magnetic source, a magnetic flux sensor, a sensor backing on which the magnetic source and flux sensor are mounted, and a ferromagnetic target, where the magnetic source, magnetic flux sensor, and ferromagnetic target are positioned to form a magnetic circuit from the magnetic source to the target, from the target to the sensor, and returning to the magnetic source through the sensor backing.

Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier at the load port interface. The carrier holding station is arranged to provide a fast swap section for replacement of the substrate transport carrier from the carrier holding station.

Abstract: A semiconductor workpiece processing system having at least one processing apparatus for processing workpieces, a primary transport system, a secondary transport system and one or more interfaces between first transport system and second transport system. The primary and secondary transport systems each have one or more sections of substantially constant velocity and in queue sections communicating with the constant velocity sections.