Abstract: An automated system and method for determining flip chip connections involves generating a first projection that includes representations of bumps arranged over a core of the flip chip and generating a second projection that includes representations of I/O pads arranged around the core. The first projection is generated by drawing a line through each bump between a location of the flip chip and an outer portion of the flip chip and marking a location where the line terminates at the outer portion with a representation of the bump. The outer portion of the flip chip is traversed, and the first projection is generated based on the order in which bump representations are encountered. The second projection is generated by drawing a line through each I/O pad between a location of the flip chip and an outer portion of the flip chip and marking a location where the line terminates at the outer portion with a representation of the I/O pad.

Abstract: A system, method, and computer program product is disclosed for performing electrical analysis of a circuit design. A voltage-based approach is described for performing two-stage transient EM-IR drop analysis of an electronic design. A two-stage approach is performed in some embodiments, in which the first stage operates by calculating the voltage at certain interface nodes. In the second stage, simulation is performed to simulate the circuit to concurrently obtain the current at the interface nodes.

Abstract: A memory mapping system for compactly mapping dissimilar memory systems and methods for manufacturing and using same. The mapping system maps a source memory system into a destination memory system by partitioning the source memory system and disposing memory contents within the partitioned source memory system into the destination memory system. In one embodiment, the mapping system factorizes a source data width of the source memory system in terms of a destination data width of the destination memory system to form at least one data sub-width. A source memory sub-region is defined for each data sub-width. The memory contents associated with each source memory sub-region are disposed within the destination memory system in a side-by-side manner across selected destination memory registers of the destination memory system. The mapping system thereby can compactly map the memory contents into the destination memory system without a loss of valuable memory space.

Abstract: In one embodiment of the invention, a method of analyzing a circuit design is disclosed. In the method of analyzing a circuit design, a circuit is levelized into multiple levels. Circuit simulations of elements at a level are determined using circuit simulators, one for each element and in parallel in level order. Topological circuit loops may be removed from the circuit. Circuit simulation of the circuit may be performed on the circuit using the circuit simulations determined by the circuit simulators at each level of the circuit.

Abstract: Disclosed are methods and systems for providing a constraint-driven environment for implementing a physical design of an electronic circuit with automatic snapping. In some embodiments, the method identifies or creates an incomplete layout. The method identifies an object and constraints for the object. The method then identifies an approximate position for the object in the layout and automatically snaps the object to a drop location based on the approximate position while complying with relevant constraint(s). The method may further align an object with another object with some spacing in between in some embodiments. The method may also perform automatic layer-to-layer snapping between two sets of objects such as cell instances, each having at least one object on multiple layers.

Abstract: A method and apparatus for generating user clocks in a prototyping system is disclosed. A prototyping system has a plurality of programmable logic chips that are each programmed with one or more partition of a prototyped circuit design. For a circuit design having multiple user clock signals, each partition uses some or all of the user clocks. A reference clock signal is externally generated, and received by each of the programmable logic chips. Using a phase-locked loop, a plurality of in-phase higher frequency clock signals are generated from the reference clock signal. The user clock signals are then generated from these higher frequency signals using a plurality of divider circuits. Reset circuitry implemented in one of the programmable logic chips transmits a common reset signal to the divider circuits, maintaining the phase relationship of each user clock across the programmable logic chips.

Abstract: A method is provided to evaluate whether one or more test patterns is power safe for use during manufacturing testing of an integrated circuit that includes a nonuniform power grid and that includes a scan chain, the method comprising: assigning respective toggle count thresholds for respective power grid regions of the non-uniform power grid; and determining whether respective numbers of toggles by scan elements of the scan chain within one or more respective power grid regions meet respective toggle count thresholds for the one or more respective regions during at least one scan-shift cycle in the course of scan-in of a test pattern to the scan chain.

Abstract: Systems, apparatus, and methods of static timing analysis for an integrated circuit design in the presence of noise are disclosed. The integrated circuit design may be partitioned into a plurality of circuit stages. A timing graph including timing arcs is constructed to represent the timing delays in circuit stages of the integrated circuit design. A model of each circuit stage may be formed including a model of a victim driver, an aggressor driver, a victim receiver, and a victim net and an aggressor net coupled together. For each timing arc in the timing graph, full timing delays may be computed for the timing arcs in each circuit stage.

Abstract: Certain circuit models include design parameters that reflect user choices and statistical parameters that reflect modeling uncertainty. For each performance goal (e.g., a one-sided performance goal), a closest point of failure in the statistical parameters is used to identify a statistical corner that characterizes a specified tolerance for that performance goal. Adjusting the design parameters to improve performance for these corners improves overall performance and corresponding yields.

Abstract: State retention cells of a test circuit embedded in an electrical circuit are interconnected to form one or more scan chains. The scan chains are interconnected so that unknown states, or X-states, are shifted through the scan chains in an order other than the order in which the states were captured by the state retention cells of the scan chain. Such reordering of response states in individual scan chains may be used to align the X-states across multiple scan chains to achieve higher test compression scan register circuit testing.

Abstract: A user is presented with a simulation environment within which the user is provided a choice to select between parasitic simulation modes of varying accuracy, the modes including a mode without parasitics and a plurality of modes including parasitics with a varying degree of accuracy. A selection from among the modes is received from the user and simulation test are performed at the selected degree of accuracy.

Abstract: A method to create an integrated circuit that includes digital and analog components comprising: displaying on a computer system display, user input to the computer system that specifies parameter information to determine a binding between an analog circuit design component and a digital circuit design component; saving the user specified parameter information within a file that also specifies at least a portion of the analog circuit design; associating the analog circuit design component a first design block of an integrated circuit that also includes a second digital design block coupled to the first design block; using parameter information to determine a binding between the first analog circuit design component and the first digital circuit design component; saving the determined binding in computer readable storage media.

Abstract: A method of extracting capacitance from a layout record includes imposing voltages on conductors in a layout record, and determining a total charge for each of the conductors to obtain a capacitor element for the conductors. A method of extracting capacitance from a layout record includes matching a configuration of conductors in a layout record against a reference pattern, and determining an extracted capacitance for the conductors based at least in part on the reference pattern. A method of extracting capacitance from a layout record includes providing a layout record of a circuit design, the layout record having data representing conductors and metal fill, and extracting capacitance to determine a set of capacitors between the conductors, the set of capacitors accounting for the metal fill.

Abstract: Disclosed are method, system, and computer program product for a method and system for a fast and stable placement/floorplanning method that gives consistent and good quality results. Various embodiments of the present invention provide a method and system for approximate placement of various standard cells, macro-blocks, and I/O pads for the design of integrated circuits by approximating the final shapes of the objects of interest by one or more probability distribution functions over the areas for the objects of interest with improved runtime and very good stability. These probability distributions are gradually localized to final shapes satisfying the placement constraints and optimizing an objective function.

Abstract: The present invention provides a method for compensating infidelities of a process that transfers a pattern to a layer of an integrated circuit, by minimizing, with respect to a photomask pattern, a cost function that quantifies the deviation between designed and simulated values of circuit parameters of the pattern formed on a semiconductor wafer.

Abstract: A method and system for dynamically injecting errors to a user design is disclosed. In one embodiment, the user design having internal states and parameters is run in a design verification system. A reconfigurable design monitor monitors a plurality of error conditions based on the internal states and parameters of the user design and generates a trigger event when a predefined error condition is met. The reconfigurable design monitor transmits a trigger event to an error injector. The error injector injects dynamic errors associated with the triggering event to the user design via a control path to test the user design under the predefined error condition.

Abstract: A method of timing analysis of an integrated circuit (IC) design with a partition block including an original clock signal with a pair of clock paths having an external common point outside the block boundary is disclosed, including receiving a netlist of the partition block of a hierarchical IC design, analyzing a pair of clock paths having the external common point to determine first and second clock ports at the boundary of the partition block; and for the first and second clock ports, creating launch and capture clocks, making exclusive clock groups of the launch clock and the capture clock for opposing clock ports to avoid the launch and capture clocks for each port affecting other internal data paths within the partition block, and associating common path pessimism removal information with a source latency of the capture clock to adjust timing at an end point of the internal data path.

Abstract: According to some embodiments, a method is provided for simulating an analog and mixed-signal circuit design comprising an analog circuit segment connected to a digital circuit segment at a connection point, the method comprising: inserting a bi-directional interface element at the connection point, wherein the analog circuit segment connects to an analog port of the bi-directional interface element and the digital circuit segment connects to a digital port of the bi-directional interface element; and operating the bi-directional interface element such that the bi-directional interface element detects a signal direction and, according to the signal direction, either converts a first analog signal received from the analog port to a first digital signal for the digital port while maintaining a first signal strength of the first analog signal, or converts a second digital signal received from the digital port to a second analog signal for the analog port while maintaining a second signal strength of the second d

Abstract: A system and method are provided for actuating static and dynamic analysis tools in parametrically intercoupled manner for synergistic optimization of an electronic system design. The system and method execute a timing designer process for selectively actuating the static analysis tool to conduct timing analysis based on at least one predetermined timing model and generate a plurality of estimated values for certain signal parameters to be in compliance with predetermined timing constraints. A signal exploration process is executed to receive the estimated values from the timing designer process and configure the resources of the dynamic analysis tool responsive thereto. The signal exploration process actuates the dynamic analysis tool to conduct electrical integrity analysis based on transient simulation and generate a plurality of simulated values for signal parameters. The simulated values are back annotated to the timing designer process for timing closure.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of a multi-die integrated circuit (IC) design layout. The thermal analysis produces a temperature distribution for analyzing internal properties of each die within the multi-die design and for analyzing thermal interactions between two or more dies of the design based on an internal configuration of the two or more dies. Therefore, in some embodiments, the temperature distribution shows a temperature distribution for each die and the individual temperature distributions show varying temperature across each of the dies. Some embodiments reduce the number of iteration required to perform the thermal analysis by constructing a high quality preconditioner based on thermal conducting segments introduced to model thermal effects at the boundaries between two dies.