Abstract: A reflective optical element (17), in particular for an illumination optical unit of a projection exposure apparatus includes: a structured surface (25a) that preferably forms a grating structure (29), and a reflective coating (36) that is applied to the structured surface (25a). The reflective coating (36) covers the structured surface (25a) discontinuously, and the reflective optical element (17) has at least one protective layer (37) that covers the structured surface (25a) continuously. Also disclosed are an illumination optical unit (4) for a projection exposure apparatus (1) including at least one reflective optical element (17) of this type, to a projection exposure apparatus (1) including an illumination optical unit (4) of this type, and to a method for producing a protective layer (37) on a reflective optical element (17) of this type.

Abstract: An optical assembly has an optical element for influencing the beam path in a projection exposure apparatus and an actuator device for deforming the optical element. The actuator device has at least one photostrictive component and at least one light source. The photostrictive component is mechanically coupled to the optical element for the transmission of a tensile and/or compressive force in order to deform the optical element. The light source is configured for targeted illumination of the photostrictive component in order to induce the tensile and/or compressive force in the photostrictive component.

Abstract: A method for qualifying a mask for a lithography system, the mask having measurement points for detecting critical dimensions of the mask, comprising: first detection of critical dimensions of the mask at the measurement points, the first detection taking place sequentially and the duration of the first detection defining a measurement time period; determining reference measurement points from the measurement points, the number of reference measurement points being less than the number of measurement points; second detection of the at least one critical dimension of the mask at the reference measurement points; determining a deviation between the first and the second detected critical dimension at each of the reference measurement points; and applying a determined temporal profile of the correction factor to the at least one critical dimension to obtain a corrected critical dimension of the mask, and also a corresponding device for qualifying a mask for a lithography system.

Abstract: A field facet system for a lithography apparatus comprises: an optical element which comprises an elastically deformable facet portion having a light-reflecting optically active surface; and at least one actuating element for introducing a bending moment into the facet portion to deform the facet portion to change a radius of curvature of the optically active surface. The facet portion is curved in an arched manner in a plan view of the optically active surface. The rigidity of the facet portion as viewed along a longitudinal direction of the facet portion is variable so that a normal vector oriented perpendicularly to the optically active surface tilts exclusively about a spatial direction when the bending moment is introduced into the facet portion.

Abstract: A method of heating an optical element in a microlithographic projection exposure apparatus and an optical system includes using a heating arrangement to introduce a heating power into the optical element. The heating power is regulated based on a setpoint value. The setpoint value is varied over time during the operation of the projection exposure apparatus. Varying the setpoint value for the heating power comprises a simulation of the effects of changes in the heating power relative to the actual value thereof based on a model for the thermal behavior of the optical element.

Abstract: The disclosure provides an optical system, having a first optical control loop, which is set up to regulate a position and/or spatial orientation of a first optical element relative to a first module sensor frame, and a first module control loop, which is set up to regulate a position and/or spatial orientation of the first module sensor frame relative to a base sensor frame. Related components and methods are also provided.

Abstract: A facet assembly is a constituent part of a facet mirror for an illumination optical unit for projection lithography. The facet assembly has a facet with a reflection surface for reflecting illumination light. A facet main body of the facet assembly has at least one hollow chamber. A reflection surface chamber wall of the hollow chamber forms at least one portion of the reflection surface. An actuator control apparatus of the facet assembly is operatively connected to the hollow chamber for the controlled deformation of the reflection surface chamber wall. The result is a facet assembly that is usable flexibly as a constituent part of a facet mirror equipped therewith within an illumination optical unit for projection lithography.

Abstract: A micromirror array is a constituent part of an illumination-optical component of a projection exposure apparatus for projection lithography. A multiplicity of micromirrors are in groups in a plurality of mirror modules, each of which has a rectangular module border. The mirror modules are in module columns. At least some of the module columns are displaced with respect to one another along a column boundary line so that at least some of the mirror modules adjacent to one another over the boundary line are arranged displaced with respect to one another. Their module border sides running transversely to the boundary line are not aligned flush with one another. This micromirror array can have a relatively standardized production and can have a relatively small reflection folding angle on the object if the micromirror array represents a final illumination-optical component upstream of a reflective object to be illuminated.

Abstract: A method for maintaining a projection exposure apparatus comprising at least two modules and a reference element, wherein the modules are referenced to the reference element, comprises: removing a module; attaching a service module to or in the vicinity of the projection exposure apparatus; referencing the service module to the reference element of the projection exposure apparatus; and implementing a maintenance measure with the aid of the service module.

Abstract: Measurement method for interferometrically determining a shape of a test object (14) surface (12) includes arranging a first diffractive optical element (30, 130, 230) in an input wave (18) beam path, to generate a first test wave (34) with a wavefront that is adapted to a desired shape of the optical surface, detecting a first interferogram generated by the first test wave after interaction with the test object surface, arranging a different diffractive optical element (32, 232) in the input wave beam path for generating a further test wave with a wavefront which is adapted to the desired shape of the optical surface, the first and the further diffractive optical elements differing in their respective diffraction structure configurations, capturing a further interferogram generated by the further test wave after interaction with the test object surface, and determining the surface shape of the test object by calculating the two interferograms.

Abstract: An optical component has a diffraction structure for diffractively influencing a direction of emergence of light of at least one wavelength incident on the optical component. The diffraction structure includes at least two diffraction substructures superimposed in at least one portion of the optical component and having first positive diffraction structures and first negative diffraction structures. A first diffraction substructure has first positive diffraction structures and first negative diffraction structures arranged to have a symmetry following a first symmetry condition. A second diffraction substructure has second positive diffraction structures and second negative diffraction structures arranged to have a second symmetry condition differing from the first symmetry condition.

Abstract: The present application relates to a device for determining placements of pattern elements of a reflective photolithographic mask in the operating environment thereof, wherein the device comprises: (a) at least one first means configured for determining surface unevenness data of a rear side of the reflective photolithographic mask and/or surface unevenness data of a mount of the reflective photolithographic mask in a measurement environment that does not correspond to the operating environment; (b) at least one second means configured for determining placement data of the pattern elements in the measurement environment; and (c) at least one computing unit configured for calculating the placements of the pattern elements of the reflective photolithographic mask in the operating environment from the determined surface unevenness data of the rear side and/or of the mount and the determined placement data.

Abstract: A projection exposure apparatus for semiconductor lithography comprises an optical element and a temperature recording device for detecting a temperature on a surface of the optical element via electromagnetic radiation emanating from the surface of the optical element. The temperature recording device can comprise a filter for filtering the electromagnetic radiation.

Abstract: A device (20) for detecting a temperature on a surface (15) of an optical element (14) for semiconductor lithography. The device includes an optical element (14) having a face (16) irradiated with electromagnetic radiation (7, 8, 43), a temperature recording device (21), and a temperature controlled element (22) configured to be temperature-controlled and arranged so that the predominant proportion of the intensity of the thermal radiation (25.2) detected by the temperature recording device and reflected by reflection at the surface of the optical element is emitted by the temperature-controlled element. Also disclosed are an installation (1) for producing a surface (15) of an optical element (14) for semiconductor lithography and a method for producing a surface (15) of an optical element (14) of a projection exposure apparatus (30), wherein the surface is temperature-controlled and the surface temperature is detected during the temperature control.

Abstract: An optical assembly of a projection exposure apparatus for semiconductor lithography comprises an optical element and an actuator for deforming the optical element. The actuator is subjected to a bias voltage by a controller that is present. A projection exposure apparatus for semiconductor lithography comprises an optical assembly. A method for operating an actuator for deforming an optical element for semiconductor lithography comprises subjecting the actuator to a bias voltage by a controller.

Abstract: An optical assembly reduces a spectral bandwidth of an output beam of a laser. The assembly includes a beam-expanding optical unit within a laser resonator. The latter serves to increase a beam cross section of a resonator-internal laser beam in at least one expansion cross-sectional dimension such that at least one resonator-internal expansion laser beam section arises. The assembly also includes an optical grating in a retroreflective arrangement for the resonator-internal laser beam. A beam-limiting stop acts in the expansion cross-sectional dimension and is arranged in the beam path of the expansion laser beam section. This yields an optical assembly in which unwanted thermal effects on account of optical components of the optical assembly heating during laser operation due to a local power density of the resonator-internal laser beam are reduced or avoided.

Abstract: An arrangement of a microlithographic imaging device includes a first component, a second component and a connection unit of a connection device. The connection unit is configured to cooperate with the first component in a connection region between the first and second components. The connection unit is configured to cooperate, in a mounted state, with a tensioning unit of the connection device in a tensioning direction. The tensioning unit cooperates with the second component to connect the first and second component to one another in the connection region. The connection unit includes a main body. The insert is inserted in a receiving cutout in the main body and connected to the main body to transfer forces in the tensioning direction. The insert is configured to cooperate with the tensioning unit to connect the first and second components to one another in the connection region.

Abstract: A projection exposure apparatus has a vibration damper with a holder and a mass that is connected to the holder via a damping element. The vibration damper comprises a temperature control device for the temperature control of the damping element. The disclosure also relates to a method for designing a vibration damper.

Abstract: An insert for a source chamber of an EUV radiation source has a pressure stage and, spaced apart from it, a stop.

Abstract: The present application relates to a method for disposing of excess material of a photolithographic mask, wherein the method comprises the following steps: (a) enlarging a surface of the excess material; (b) displacing the enlarged excess material on the photolithographic mask using at least one first probe of a scanning probe microscope; and (c) removing the displaced enlarged excess material from the photolithographic mask.