Patents Assigned to CO
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Publication number: 20240310683Abstract: A display panel is provided. The display panel includes a substrate and a plurality of subpixels arranged on the substrate at intervals. Each of the subpixels includes a control area and a pixel area. The display panel in the pixel area includes a storage capacitor disposed on the substrate, a pixel electrode disposed on a side of the storage capacitor away from the substrate, and an isolation layer disposed between the storage capacitor and the pixel electrode. In the pixel area, the storage capacitor is provided with a through hole, and a projection of the through hole on the substrate at least partially overlaps with a projection of the pixel electrode on the substrate.Type: ApplicationFiled: May 28, 2023Publication date: September 19, 2024Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventor: Dongming SU
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Publication number: 20240310876Abstract: A flexible display device is provided, including: a housing, a flexible display screen, a support member and a sliding-roller. The support member is located between the flexible display screen and the sliding-roller, and is configured for driving the flexible display screen to be rolled on the sliding-roller. The sliding-roller is rotatable and is arranged in the housing. The flexible display device further includes a limiting structure provided between the support member and the housing for maintaining a gap between the flexible display screen and the housing. A display terminal is further provided.Type: ApplicationFiled: June 29, 2022Publication date: September 19, 2024Applicant: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Lijuan Zhao, Junhuan Liu, Lupeng Bian
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Publication number: 20240310940Abstract: A touch display device, including: a touch display substrate, provided with a display region and a non-display region provided adjacent to the display region, wherein the non-display region is provided with a display bonding region and a touch bonding region; and a flexible circuit board, provided with a touch signal line, a touch chip and a display signal line, wherein the touch signal line is connected with the touch chip, the flexible circuit board is bound with the touch display substrate in the display bonding region and the touch bonding region, the touch chip is connected to the touch bonding region through the touch signal line, and the display signal line is connected to the display bonding region; where the touch chip, the touch signal line and the touch bonding region are provided on a same side of the display signal line.Type: ApplicationFiled: November 19, 2021Publication date: September 19, 2024Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Zewen LI, Wenxiao NIU, Hengzhen LIANG, Xu LU, Lianbin LIU, Zhiqiang WANG, Rendong LI, Yu WANG
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Publication number: 20240311400Abstract: A traffic restriction identification method includes: determining prohibition marking lines based on lane-level data; determining a first lane group corresponding to a longitudinal prohibition marking line included in the prohibition marking lines; determining a second lane group and a third lane group adjacent to the first lane group based on the first lane group and the longitudinal prohibition marking line; and determining whether a path-level traffic restriction exists based on a connectivity of the first lane group with the second lane group and the third lane group.Type: ApplicationFiled: February 25, 2022Publication date: September 19, 2024Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.Inventors: Qiulin Chen, Jiachen Dong
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Publication number: 20240309550Abstract: An epitaxial reaction device includes: a conveying apparatus and at least one reaction apparatus. The reaction apparatus includes a high-temperature reaction chamber, a gas supply module, and a gas extraction module. The high-temperature reaction chamber is used for providing an environmental condition required during wafer processing. The gas supply module and the gas extraction module are oppositely provided in the high-temperature reaction chamber. The gas supply module is used for supplying reaction gas to the high-temperature reaction chamber, and the gas extraction module is used for extracting residual gas. The conveying apparatus is provided on the high-temperature reaction chamber and located on a same side as the gas supply module. The conveying apparatus is used for taking out and placing the wafer.Type: ApplicationFiled: May 22, 2024Publication date: September 19, 2024Applicant: Shenzhen Naso Tech Co LtdInventors: Yunzhang XIAO, Shuaishuai HUANG, Lianghui LIU, Fang YANG, Jiaming LIU, Xin XU, Junhui JING, Bingan CHEN, Guofang ZHONG
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Publication number: 20240311005Abstract: A data compression method is disclosed. The data compression method is applied to a flash memory device having a flash memory medium. The data compression method includes: reading at least two pieces of cold data in the flash memory medium; compressing the at least two pieces of cold data in the flash medium, so as to obtain at least two pieces of compressed data; splicing the at least two pieces of compressed data, so as to generate at least one write unit; and writing each of the at least one write unit into the flash memory medium.Type: ApplicationFiled: May 29, 2024Publication date: September 19, 2024Applicant: Shenzhen Dapu Microelectronics Co., Ltd.Inventors: Juming LIAO, Xueming CAO, Yuanpeng MA, Ying YANG
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Publication number: 20240312935Abstract: A bonding semiconductor device according to at least one embodiment is formed by bonding a first chip and a second chip, and includes a chip region and a partition region. A bonding pad formed by bonding a first bonding pad of the first chip and a second bonding pad of the second chip may be provided in the chip region. A separation pattern portion in which a first base layer of a first pattern portion of the first chip and a second base layer of a second pattern portion of the second chip are entirely separated from each other to have an inner space may be provided in the partition region.Type: ApplicationFiled: September 14, 2023Publication date: September 19, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Joo Hee JANG, Kwangjin MOON, Seokho KIM, Soonwook KIM, Kunsang PARK
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Publication number: 20240314614Abstract: Embodiments of this application disclose a communication method and a communication apparatus. The method in embodiments of this application includes: A terminal device performs first-type measurement on a first reference signal, to obtain a first measurement result. The terminal device sends the first measurement result to a network device. The terminal device performs second-type measurement on a second reference signal based on the first measurement result, to obtain a second measurement result. The terminal device sends the second measurement result to the network device. It can be learned that, according to the foregoing technical solution, the terminal device reports the second measurement result to the network device, and the network device does not need to trigger, by using downlink control information, the terminal device to report the measurement result, so that signaling overheads and latency overheads are reduced.Type: ApplicationFiled: May 27, 2024Publication date: September 19, 2024Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Shitong Yuan, Xi Zhang, Bo Fan
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Publication number: 20240315045Abstract: A semiconductor device may include a substrate including a first impurity region and a second impurity region; a first word line in a region of the substrate with the first impurity region on one side of the first word line and the second impurity region on an other side of the first word line; a bit line connected to the first impurity region; a first conductive pattern connected to the second impurity region; a first partial electrode and a second partial electrode on the first conductive pattern; a first dielectric layer in contact with an upper surface of the first partial electrode and an upper surface of the second partial electrode; and a common electrode on the first dielectric layer. An area of the upper surface of the first partial electrode may be different from an area of the upper surface of the second partial electrode.Type: ApplicationFiled: October 26, 2023Publication date: September 19, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Jungmin PARK, Ji-Sung KIM, Hanjin LIM, Hyungsuk JUNG
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Publication number: 20240312908Abstract: A semiconductor device includes a substrate including a cell array region and a connection region in a first direction and a stack structure including electrode layers and inter-electrode insulating layers alternately stacked in a second direction, the electrode layers including first electrode layers and second electrode layers alternately stacked, each of the first electrode layers includes a first connection portion in the cell array region and a first front end and a first back end spaced apart from each other in a third direction in the connection region and positioned at the same level as each other, the first front end and the first back end are connected to the first connection portion, the first front end has a first protrusion protruding toward the first back end, and the first protrusions of the first front ends do not overlap the second electrode layers.Type: ApplicationFiled: October 11, 2023Publication date: September 19, 2024Applicant: Samsung Electronics Co., Ltd.Inventor: Seokcheon BAEK
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Publication number: 20240312412Abstract: A pixel includes a plurality of transistors and an organic light emitting diode, in which the transistors include a first transistor to control an amount of current flowing to the organic light emitting diode and additional transistors are connected to the first transistor or the organic light emitting diode, the first transistor is a Low Temperature Poly-Silicon (LTPS) thin film transistor, and one or more of the other transistors are oxide semiconductor transistors.Type: ApplicationFiled: May 24, 2024Publication date: September 19, 2024Applicant: Samsung Display Co., Ltd.Inventors: Ji Hyun KA, Won Kyu KWAK, Han Sung BAE
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Publication number: 20240312416Abstract: A pixel circuit, a driving method and a display device. The pixel circuit includes a light emitting element, a driving circuit, an energy storage circuit, an initialization circuit, and a compensation control circuit; the display period of the pixel circuit includes a refresh frame and a retention frame; the refresh frame and the retention frame respectively include a set phase and a light emitting phase set successively; the initialization circuit is configured to control provide the initial voltage to the first terminal and/or the second terminal of the driving circuit under the control of the initial control signal provided by the initial control terminal, in the refresh frame and the retention frame, at least in the set phase. The present disclose improves hysteresis and improves the display effect.Type: ApplicationFiled: June 29, 2022Publication date: September 19, 2024Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Tianyi CHENG, Meng LI, Zhongliu YANG
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Publication number: 20240308772Abstract: A combination weighing apparatus (1) according to an embodiment has a control unit (51) that performs combination calculation based on a plurality of weight values acquired by acquisition units (71 to 7n) and discharges a combination of articles having a preset target weight value from hoppers (61 to 6n); a discharge chute (9) that receives the articles discharged from the hoppers (61 to 6n), has a conveyance surface (9B) having a plurality of openings (9D) smaller than the article, and discharges the articles downstream while sliding the articles on the conveyance surface (9B); and a moisture recovery mechanism (20) that is disposed below the openings in the discharge chute (9) and recovers moisture passing through the openings (9D) in the discharge chute (9) from an inside to an outside of the conveyance surface (90) and falling from the discharge chute (9).Type: ApplicationFiled: March 12, 2024Publication date: September 19, 2024Applicant: Ishida Co., Ltd.Inventor: Yujiro OBAYASHI
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Publication number: 20240309033Abstract: Embodiments provide an organometallic compound, a light-emitting device including the organometallic compound, and an electronic apparatus including the light-emitting device.Type: ApplicationFiled: August 22, 2023Publication date: September 19, 2024Applicant: Samsung Display Co., Ltd.Inventors: Sujin Shin, Iljoon Kang, Sungbum Kim, Eunyoung Lee, Hyunjung Lee, Jinhee Ju
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Publication number: 20240309305Abstract: A permeable membrane support having a removable permeable membrane is disclosed The permeable membrane support includes a lower support having a hollow cylinder shape with an outer diameter smaller than an inner diameter of a plate well so to be accommodated in the plate well, wherein the lower support includes: an upper end having a first opening and a lower end having a second opening; an inner wall extending between the upper and lower ends and having an open channel defined therein and extending therebetween and communicating with the first and the second openings; a support surface portion extending inwardly from an inner surface of a lower end of the inner wall and having a central opening defined therein constituting the open channel; an upper support including: a cylindrical lower member constructed to be partially accommodated in the lower support; a pair of opposing wings constructed to be supported on a top of the plate well; and a deformable beam portion extending upwardly from an upper circumfereType: ApplicationFiled: February 19, 2024Publication date: September 19, 2024Applicant: ST1 CO., LTD.Inventors: Yong Jun YOON, Byung Jun KO
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Publication number: 20240309481Abstract: Disclosed is a low-cost hot-rolled steel plate for high temperature enameling. In addition to Fe and inevitable impurities, the plate further comprises a chemical composition in mass percentage as follows: C: 0.03-0.12%, Si: 0.1-0.5%, Mn: 0.3-1.5%, P: 0.03-0.10%, Al: 0.02-0.10%, Cr: 0.01-0.20%, Cu: 0.01-0.30%, N: 0.007-0.020%, and B: 0.0006-0.003%. The low-cost hot-rolled steel plate for high temperature enameling does not contain Ti, Nb, and V. The chemical composition further satisfies: P×(N?14×B/11)×103>0.3, and in the calculation, P, N, and B are respectively substituted with the numerical value before the percent sign in the mass percentage of the corresponding chemical element. Further disclosed is a manufacturing method for a low-cost hot-rolled steel plate for high temperature enameling, which comprises the following steps: (1) smelting and casting; (2) heating; (3) hot rolling: controlling the rough rolling temperature at above 850° C., the finish rolling start temperature at 900-1050° C.Type: ApplicationFiled: February 9, 2022Publication date: September 19, 2024Applicant: BAOSHAN IRON & STEEL CO., LTD.Inventors: Shuangcheng WANG, Quanshe SUN
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Publication number: 20240309778Abstract: A continuous flow engine skid component contains a matrix material to improve the overall properties of the continuous flow engine skid component. The continuous flow engine skid component is part of a continuous flow engine skid or is adapted to be part of a continuous flow engine skid, wherein the continuous flow engine skid is adapted to fixate a continuous flow engine in a specified position, wherein the continuous flow engine skid component contains a matrix material, wherein the matrix material contains a nonmetal inorganic or organic matrix.Type: ApplicationFiled: January 14, 2022Publication date: September 19, 2024Applicant: Siemens Energy Global GmbH & Co. KGInventor: Andreas Graichen
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Publication number: 20240309915Abstract: A bearing shunt includes a metal washer, a conductive washer made from a carbon fiber mesh, and a metal cover. The metal washer includes a first annular surface, a lip protruding axially from the first annular surface, and a first plurality of lubricant flow holes. The conductive washer includes a second annular surface contacting the first annular surface and a second plurality of lubricant flow holes aligned with the first plurality of lubricant flow holes. The metal cover is disposed radially inside of the lip and contacts the conductive washer. The metal cover includes a third plurality of lubricant flow holes aligned with the first plurality of lubricant flow holes.Type: ApplicationFiled: March 17, 2023Publication date: September 19, 2024Applicant: Schaeffler Technologies AG & Co. KGInventors: Guihui Zhong, Venkata Kottapalli, James Brown, Joseph T. Griffin, John Tate
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Publication number: 20240310203Abstract: An electromagnetic coupling sensing device includes a frequency generation module, a first resonant module, a second resonant module, and an echo acquisition and processing module. The first resonant module generates a primary resonant signal based on the frequency setting signal generated by the frequency generation module. The second resonant module couples with the first resonant module through a coupling capacitance to generate a secondary resonant signal based on the primary resonance signal. The second resonant module includes a coil. A ferrite is provided in the coil and a height of the coil is higher than the ferrite. The coil is capable of carrying a weight to be measured to deform such that an intrinsic frequency of the electromagnetic coupling sensing device changes. The echo acquisition and processing module collects the secondary resonant signal and outputs a voltage signal changing according to the intrinsic frequency.Type: ApplicationFiled: August 24, 2023Publication date: September 19, 2024Applicant: SMYZE INTELLIGENCE TECHNOLOGY (SHANGHAI) CO., LTDInventor: Fang ZHENG
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Publication number: 20240310215Abstract: A food thermometer includes a thermometer housing, a temperature sensor, a communication circuit and an antenna. The thermometer housing comprises a probe portion and a handle portion connected to one end of the probe portion, and at least part of the probe portion is to be inserted into food; the handle portion is an insulator, at least part of the probe portion has a metal structure; and the temperature sensor is arranged in the thermometer housing and configured to sense and obtain temperature information, the communication circuit is electrically connected to the temperature sensor and configured to transmit the temperature information to the outside through the antenna, the antenna is arranged at the handle portion and insulated, and spaced apart, from the probe portion, the communication circuit is arranged in the handle portion and connected to the antenna.Type: ApplicationFiled: December 8, 2023Publication date: September 19, 2024Applicants: Zhuhai Megain Technology Co., Ltd., OURSALE TRADING INCInventors: Hua WANG, Haiji QIU, Yifeng CAI, Xiaoling TAO, Chunsheng YANG, Xungui WANG, Huayou LI, Xiangui TU