Patents Assigned to Cooler Master Co., Ltd.
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Patent number: 11092147Abstract: The disclosure provides a magnetically driven pump which including a base, a spacer sleeve, a cover, a stator assembly and a rotor assembly. The base has a first accommodation space. The spacer sleeve is mounted to the base and partially located in the first accommodation space. The spacer sleeve has a second accommodation space not connected to the first accommodation space. The cover has through holes. The cover is mounted to the base, and the through holes are connected to the second accommodation space. The stator assembly is sleeved on the spacer sleeve and located in the first accommodation space. The rotor assembly includes a shaft, an impeller and a magnet assembly. Two ends of the shaft are rotatably disposed on the cover and the spacer sleeve, the shaft is partially located in the second accommodation space, and the impeller and the magnet assembly are fixed on the shaft.Type: GrantFiled: December 18, 2019Date of Patent: August 17, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Wen-Hsien Lin, Chiu Yu Yeh
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Publication number: 20210222955Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. The second continuity plate comprises a second continuity plate attachment surface having a third elevated continuity channel. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir.Type: ApplicationFiled: July 22, 2020Publication date: July 22, 2021Applicant: COOLER MASTER CO., LTD.Inventor: Jen-chih CHENG
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Patent number: 11041778Abstract: A configurable leak detection system comprising a leak detection device and at least a leak detection covering comprising a leak detection region having a first and second electrode and at least an attachable region is provided. The first and second electrodes are disposed spaced apart and fixed in firm contact with the covering. The system is attached onto liquid cooling systems, bases, and/or fluid conduits. When liquid is leaked onto the covering, the liquid is absorbed therein, until the dampened region extends over some point on each of the first and second electrodes. An electrical current is conducted, providing a low resistance path therebetween. An impedance change is detected, an alert means is generated, and the leak detection device is reset. More than one configurable leak detection system is attached onto systems, bases and/or fluid conduits via the at least an attachable region, and then electrically coupled together.Type: GrantFiled: July 1, 2020Date of Patent: June 22, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Chu yi Kuo, Wen hong Chen, Chun hsien Chen
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Publication number: 20210180703Abstract: The disclosure provides a control valve which includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.Type: ApplicationFiled: March 1, 2021Publication date: June 17, 2021Applicant: COOLER MASTER CO., LTD.Inventors: Shui-Fa TSAI, Sy-Chi KUO, Hsin-Hung CHEN
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Patent number: 11029738Abstract: A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.Type: GrantFiled: December 17, 2018Date of Patent: June 8, 2021Assignee: COOLER MASTER CO., LTD.Inventor: Shui-Fa Tsai
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Patent number: 11031316Abstract: The disclosure provides a retainer which is configured to be mounted on and fix heat dissipation module onto chip platform. The retainer includes pressing portion, first and second latching portions. The first latching portion includes flat portion and flexible curved portion, the flexible curved portion is connected between the pressing portion and the flat portion, long side of the flat portion is substantially perpendicular to a long side of the pressing portion. The second latching portion is connected to the pressing portion. A long side of the second latching portion is substantially perpendicular to the long side of the pressing portion. The first portion and the second latching portion are configured to be detachably engaged at two opposite sides of the chip platform so as to deform the flexible curved portion and utilize the flexible curved portion to enhance a pressing force applied to the heat dissipation module.Type: GrantFiled: September 30, 2019Date of Patent: June 8, 2021Assignee: COOLER MASTER CO., LTD.Inventor: Yan-Sian Jheng
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Publication number: 20210168968Abstract: A liquid cooling heat exchange apparatus has a water block set and a liquid pump module. The water block set has a heat transfer surface configured to exchange heat with a cooling liquid. The liquid pump module is securely mounted on the water block set and has a flow-directing containment area and pumps. The flow-directing containment area forms flow-directing containment recesses and the pumps correspond to the flow-directing containment recesses. Therefore, pumps are connected in series or parallel so that the pumps can juxtapose with each other, which lessens the entire thickness and allows the liquid cooling heat exchange apparatus to be utilized in a narrow space. Besides, with the connected pumps, an amount and a speed of the flow may be increased and dissipate more heat. Even if part of the pumps malfunctions, the remaining pump(s) can maintain a basic amount and speed of the flow.Type: ApplicationFiled: February 5, 2021Publication date: June 3, 2021Applicant: COOLER MASTER CO., LTD.Inventor: Shui-Fa TSAI
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Publication number: 20210156399Abstract: A liquid-cooling heat dissipation device including a base and two pumps. The base has a first inlet and a first outlet. The two pumps are disposed on the base and connected to the first inlet and the first outlet in a parallel arrangement.Type: ApplicationFiled: April 20, 2020Publication date: May 27, 2021Applicant: COOLER MASTER CO., LTD.Inventors: Tsung-Wei LIN, Shui-Fa TSAI
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Publication number: 20210148646Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.Type: ApplicationFiled: January 26, 2021Publication date: May 20, 2021Applicant: COOLER MASTER CO., LTD.Inventors: Chien-Hung SUN, Te-Hsuan CHIN, Lei-Lei LIU
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Patent number: 11009031Abstract: A fan includes a metal plate, multiple cylindrical coils, a frame and an impeller. Multiple teeth annularly arranged and connected with each other are formed on the metal plate. Each cylindrical coil is arranged between adjacent teeth, and each end of the cylindrical coil is arranged toward corresponding tooth. The frame is arranged on a surface of the metal plate and extended along an edge of the metal plate. A flow channel and an air outlet connected to the flow channel are formed by the frame. The impeller is arranged in the flow channel. A stator structure of the fan is simplified by forming the teeth on the metal plate.Type: GrantFiled: November 26, 2018Date of Patent: May 18, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Fu-Lung Lin, Shih-Wei Huang, Ai-Quan Wan
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Publication number: 20210131743Abstract: A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.Type: ApplicationFiled: January 12, 2021Publication date: May 6, 2021Applicant: COOLER MASTER CO., LTD.Inventors: Chien-Hung SUN, Te-Hsuan CHIN
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Patent number: 10976787Abstract: This disclosure relates to an external liquid cooling device including at least one radiator, at least one airflow generator, a water block and a mount head module. The at least one airflow generator and the water block are respectively disposed at two adjacent sides of the at least one radiator. The mount head module includes two connectors which are respectively connected to the at least one radiator and the water block via piping. The mount head module and the water block are respectively located at two opposite sides of the at least one radiator.Type: GrantFiled: January 23, 2019Date of Patent: April 13, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Chien-Liang Lin, Wen-Hsien Lin
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Patent number: 10975876Abstract: A cooling device includes a frame including a base portion and a barrel portion connected to the base portion, a fan assembly including a hub and a plurality of fan blades connected to the hub, the fan assembly rotatably coupled to the frame via at least one bearing positioned between the barrel part and the hub, a driving assembly disposed on the frame, and a decorative plate having a marking and a column coupled thereto and extending therefrom. The decorative plate is coupled to the base portion using the column and is stationary with respect to the fan assembly. The cooling device further includes a light assembly disposed on the driving assembly and emitting light that illuminates the marking.Type: GrantFiled: April 19, 2019Date of Patent: April 13, 2021Assignee: COOLER MASTER CO., LTD.Inventor: Fu-Lung Lin
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Patent number: 10969024Abstract: The disclosure provides a control valve which includes a valve body having an inner space and a valve gate. The valve gate is movably located inside the inner space of the valve body and the valve gate has at least one main channel having two valve ports opposite to each other, and each of the valve ports of the main channel has a plurality of circular holes and a curved hole, where the circular holes are arranged in a line and the curved hole is connected to one of the circular holes that is located at an end of the line. The control valve has a lower flow rate limit which is greater than zero.Type: GrantFiled: June 26, 2018Date of Patent: April 6, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Shui-Fa Tsai, Sy-Chi Kuo, Hsin-Hung Chen
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Publication number: 20210088288Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: ApplicationFiled: December 4, 2020Publication date: March 25, 2021Applicant: COOLER MASTER CO., LTD.Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
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Publication number: 20210080190Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.Type: ApplicationFiled: November 25, 2020Publication date: March 18, 2021Applicant: COOLER MASTER CO., LTD.Inventor: Jen-Chih CHENG
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Patent number: 10935326Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.Type: GrantFiled: June 18, 2019Date of Patent: March 2, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Chien-Hung Sun, Te-Hsuan Chin, Lei-Lei Liu
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Patent number: 10935050Abstract: The disclosure provides a mount bracket which is configured for a fan. The mount bracket includes a button plate, a frame and a plurality of vibration-absorbing components. The button plate is mounted with a motor mount. The frame surrounds the button plate, and the frame has an inner lateral surface and an outer lateral surface. A plurality of fixing structures protrude from the outer lateral surface of the frame. The inner lateral surface of the frame and an outer lateral surface of the button plate form an annular gap therebetween. The vibration-absorbing components are spaced apart from each other and located in the annular gap, and the vibration-absorbing components are located between and connected to the outer lateral surface of the button plate and the inner lateral surface of the frame.Type: GrantFiled: August 31, 2018Date of Patent: March 2, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Fu-Lung Lin, Chien-Heng Lai, Shi-Man Xu
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Patent number: 10932391Abstract: A liquid cooling heat exchange apparatus has a water block set and a liquid pump module. The water block set has a heat transfer surface configured to exchange heat with a cooling liquid. The liquid pump module is securely mounted on the water block set and has a flow-directing containment area and pumps. The flow-directing containment area forms flow-directing containment recesses and the pumps correspond to the flow-directing containment recesses. Therefore, pumps are connected in series or parallel so that the pumps can juxtapose with each other, which lessens the entire thickness and allows the liquid cooling heat exchange apparatus to be utilized in a narrow space. Besides, with the connected pumps, an amount and a speed of the flow may be increased and dissipate more heat. Even if part of the pumps malfunctions, the remaining pump(s) can maintain a basic amount and speed of the flow.Type: GrantFiled: January 23, 2019Date of Patent: February 23, 2021Assignee: COOLER MASTER CO., LTD.Inventor: Shui-Fa Tsai
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Publication number: 20210048011Abstract: The disclosure provides a magnetically driven pump which including a base, a spacer sleeve, a cover, a stator assembly and a rotor assembly. The base has a first accommodation space. The spacer sleeve is mounted to the base and partially located in the first accommodation space. The spacer sleeve has a second accommodation space not connected to the first accommodation space. The cover has through holes. The cover is mounted to the base, and the through holes are connected to the second accommodation space. The stator assembly is sleeved on the spacer sleeve and located in the first accommodation space. The rotor assembly includes a shaft, an impeller and a magnet assembly. Two ends of the shaft are rotatably disposed on the cover and the spacer sleeve, the shaft is partially located in the second accommodation space, and the impeller and the magnet assembly are fixed on the shaft.Type: ApplicationFiled: December 18, 2019Publication date: February 18, 2021Applicant: COOLER MASTER CO.,LTD.Inventors: Wen-Hsien LIN, Chiu Yu YEH