Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: A liquid cooling device is provided with a heat dissipating assembly and a pump assembly. The heat dissipating assembly has a plate and a cover. The plate has a connecting surface and a sinking surface opposite each other. The connecting surface has a connecting portion configured to attach to a heat source. The sinking surface has multiple fins corresponding to the connecting portion in location. The cover is mounted on the sinking surface. The pump assembly juxtaposes the heat dissipating assembly. A graphics card is also provided. The graphics card has a graphics card main body and the liquid cooling device. Therefore, functions of the conventional water block and the conventional pump are integrated in one liquid cooling device, which reducing an amount of connecting parts and the probability of leakage of the working fluid.

Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.

Abstract: A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.

Abstract: The disclosure provides a liquid storage device configured for storing a working liquid and including a casing and a liquid driving device. The casing includes a reservoir and an accommodation part detachably disposed on the reservoir. The reservoir has a reservoir chamber. The liquid driving device is disposed in the accommodation part and forms a liquid chamber. The liquid driving device includes an impeller located in the liquid chamber and configured to force the working liquid to flow towards the liquid chamber from the reservoir chamber.

Abstract: A vapor chamber has upper and lower casings and a wick structure therebetween. The upper and lower casings have upper and lower heat exchange chamber areas having multiple upper and lower surface features thereon, separated by multiple upper and lower vapor areas therebetween, respectively. The upper and lower heat exchange chamber areas are surrounded by walls, having flat rims, respectively. The height of the upper surface features is greater than the height of the lower surface features, whereby a top surface of the wick structure lies flush with the lower flat rim. The upper and lower heat exchange chamber areas form a vacuum chamber. An airtight sealed connection is formed at the flat rims of the surrounding walls of the upper and lower heat exchange chamber areas.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.

Abstract: A fluid leak detector which is configured to be disposed on a flow tube. The fluid leak detector includes an insulation sleeve and at least one wire set. The insulation sleeve has water absorption property. The insulation sleeve is configured to be sleeved on the flow tube. The at least one wire set includes a first electrode wire and a second electrode wire. The first electrode wire and the second electrode wire are disposed on the insulation sleeve. The first electrode wire and the second electrode wire are separated from each other but are connected to each other via the insulation sleeve.

Abstract: An external heat dissipation device includes an airflow-guiding base and a refrigerating device. The airflow-guiding base has a supporting surface and a perforation located thereon. The refrigerating device includes a casing, a thermoelectric cooler, a cold air transferring assembly and a hot air transferring assembly. The casing has a storage space. The thermoelectric cooler is located in the storage space and has a cooling surface and a heat releasing surface opposite to each other. The cold air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the cooling surface. The hot air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the heat releasing surface. The storage space is divided into a cold chamber and a hot chamber by the thermoelectric cooler and the cooling plates.

Abstract: A fan has a fan housing and an impeller mounted in the fan housing. The fan housing has a main case, and a foamed metal plate securely mounted in an air inlet aperture of the main case. Hot air inhaled into the main case is forced to flow through pores in the foamed metal plate. Thus, heat in the hot air is conducted to the foamed metal plate and then to the main case. The heat in the hot air is dissipated to reduce temperature of the hot air in advance. Accordingly, heat dissipation efficiency of the fan is improved. Since the foamed metal plate hinders flow of the hot air, the hot air flowing into the main case is reduced. Therefore, air pressure and flowing speed of the hot air flowing into the main case is reduced, such that noise made by the fan is also reduced.

Abstract: The disclosure provides a flat heat exchanger. The flat heat exchanger includes a flat pipe part, a first welded part, a second welded part and a capillary structure. The flat pipe part has a fluid channel. The first welded part and the second welded part are respectively located at two opposite ends of the flat pipe part to close two opposite ends of the fluid channel. At least part of the capillary is located within the fluid channel of the flat pipe part.

Abstract: A fan impeller has a fan hub, an outer circular frame surrounding the fan hub, and metallic blades independent from one another. Two ends of each of the metallic blades are a root and a distal end respectively, at least a portion of the root is embedded in the fan hub, and at least a portion of the distal end is embedded in the outer circular frame. The metallic blades, the plastic fan hub and the plastic outer circular frame are connected by means of insert molding, so that the number of the blades can be increased to provide increased air output.

Abstract: A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.

Abstract: A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.

Abstract: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

Abstract: A liquid cooling heat sink structure includes a thermal conduction module configured to dissipate heat and including a heat exchange unit; a cover coupled to the thermal conduction module and enclosing the heat exchange unit, the cover and the thermal conduction module defining a heat exchange chamber that includes the heat exchange unit, the cover defining a first opening and a second opening, and the cover being coupled to the thermal conduction module such that at least one of the first and second openings is above the heat exchange unit; a flow guidance plate disposed on the cover; and a housing disposed on the flow guidance plate and defining a first cavity and a second cavity fluidly isolated from each other, wherein the housing includes two fluid inlets each in fluid communication with the first cavity, and a fluid outlet in fluid communication with the second cavity.

Abstract: A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.

Abstract: A vapor chamber has a first plate, a second plate, at least one ring structure, and a chamber. The first plate and the second plate have holes communicating with each other. The second plate has a cavity portion concaved away from the first plate. The ring structure is in the cavity portion and encloses the holes. The chamber is formed between the first plate and the second plate. A capillary structure layer and a working liquid are in the chamber. Therefore, even when either of the first and second plates is broken by heads of screws mounted through the holes, which are larger and oppress the margins of the holes, or even when either of the first and second plates is broken during forming of the holes via stamping or drilling, the chamber always remain sealed.