Patents Assigned to Dai-Ichi Kogyo Seiyaku Co., Ltd.
  • Patent number: 5914358
    Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.
    Type: Grant
    Filed: May 17, 1996
    Date of Patent: June 22, 1999
    Assignees: Matsushita Electric Industrial Co., Ltd., Dai-ichi Kogyo Seiyaku Co., Ltd., Dowa Mining Co., Ltd.
    Inventors: Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama
  • Patent number: 5907040
    Abstract: A process for producing tris(tribromophenoxy)-s-triazine. The process is characterized in that cyanuric chloride and an aqueous tribromophenolate solution are subjected to reaction in the presence of a tertiary amine. According to this process, the reaction goes to completion in a short time and the yield and purity of the product are high.
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: May 25, 1999
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Setsuo Nishibori, Hideto Kondo
  • Patent number: 5858472
    Abstract: The invention provides a method of improving the electrical conductivity of a resin article and a method of coating the article, with high productivity and. without using an inorganic conductive substance-containing primer. The technology comprises coating the substrate with a coating composition essentially consisting of a film-forming component, a nitrogen-containing compound of general formula (1), and a solvent and subjecting the coated surface to corona discharge treatment. The resultant film with improved electrical conductivity is then electrostatically coated.R.sup.1 --Y (1)wherein R.sup.1 represents an alkyl or alkenyl group of 5-21 carbon atoms; Y represents ##STR1## R.sup.2 and R.sup.3 may be the same or different and each represents an alkyl group of 1-4 carbon atoms; m represents 2-3; R.sup.4 represents --H or --CH.sub.3 ; A represents ##STR2## where n represents 1-5.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: January 12, 1999
    Assignees: Nippon Paint Co., Ltd., Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Akinori Iwata, Seigo Miyazoe, Tetsuo Shiraiwa
  • Patent number: 5859141
    Abstract: The present invention provides a cation-modified linear copolymer which comprises, within the molecule thereof, 95 to 85 mole % of an ethylene structural unit, 0.1 to 10 mole % of an ester structural unit represented by general formula (II), 0.1 to 6 mole % of an acrylic or methacrylic acid structural unit and 1 to 12 mole % of an amide structural unit represented by general formula (IV). The copolymer and has a weight-average molecular weight of 1,000 to 100,000. When incorporated in thermoplastic resins, it shows good compatibility and results in good mechanical properties.
    Type: Grant
    Filed: October 10, 1997
    Date of Patent: January 12, 1999
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Takayuki Tsubaki, Hideyuki Sumi, Hiroshi Hotta
  • Patent number: 5783628
    Abstract: A modified polyvinyl alcohol is disclosed, which comprises the following structural units (I) and (II) and has a weight average molecular weight of from 3,000 to 400,000: ##STR1## wherein R.sup.1 represents H or CH.sub.3 ; and M.sup.1 represents H, an alkali metal, ammonium, alkylammonium, or alkanolammonium. The modified polyvinyl alcohol may be sulfonated. The modified polyvinyl alcohol is used as a dispersant such as a drilling fluid additive.
    Type: Grant
    Filed: March 7, 1996
    Date of Patent: July 21, 1998
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Akira Yada, Yoshihiro Kawamori, Hiroshi Nishiguchi, Akira Kitada, Yoshiyuki Mori
  • Patent number: 5755985
    Abstract: Polymer electrolyte compositions for lithium electrochemical generators of the LPB type (lithium polymer electrolyte battery), comprising a mixture of polymers wherein one of the components has a high molecular weight, such as those used currently in LPB batteries, and wherein the other component is a low molecular weight polymer resulting in a more efficient and faster multi-dimensional cross-linking by irradiation, so as to give a network which is interpenetrated or not and films of electrolyte being have better mechanical properties and lower thicknesses, while preserving the good properties of adhesion on the electrodes and the choice of the coating techniques.
    Type: Grant
    Filed: January 11, 1995
    Date of Patent: May 26, 1998
    Assignees: Hydro-Quebec, Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Alain Vallee, Michel Duval, Fernand Brochu, Michiyuki Kono, Eriko Hayashi, Tsutomu Sada
  • Patent number: 5717048
    Abstract: The present invention provides a cation-modified linear copolymer which comprises, within the molecule thereof, 95 to 85 mole % of an ethylene structural unit, 0.1 to 10 mole % of an ester structural unit represented by general formula (II), 0.1 to 6 mole % of an acrylic or methacrylic acid structural unit and 1 to 12 mole % of an amide structural unit represented by general formula (IV). The copolymer has a weight-average molecular weight of 1,000 to 100,000. When incorporated in thermoplastic resins, it shows good compatibility and results in good mechanical properties.
    Type: Grant
    Filed: December 1, 1995
    Date of Patent: February 10, 1998
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Takayuki Tsubaki, Hideyuki Sumi, Hiroshi Hotta
  • Patent number: 5710347
    Abstract: This invention relates to a method of producing a high-melting powder of 2,2-bis?4'-(2",3"-dibromopropoxy)-3',5'-dibromophenyl!propane characterized by comprising a step of adding water to a solution of 2,2-bis?4'-(2",3"-dibromopropoxy)-3',5'-dibromophenyl!-propane in an organic solvent in the presence of a surfactant to give a water-in-oil emulsion and a step of removing the organic solvent from the emulsion in the presence of a crystal nucleus to induce crystallization to give an aqueous dispersion of 2,2-bis?4'-(2",3"-dibromopropoxy)-3',5'-dibromophenyl!propane. In accordance with this invention, crystallization is carried out in the state of an emulsion under assistance of a surfactant so that an ordinary stirrer can be used in production without resort to any special high-shear stirring equipment. Moreover, since a high-melting grade of 2,2-bis?4'-(2",3"-dibromopropoxy)-3',5'-dibromophenyl!propane is obtained as an aqueous dispersion, workability and safety in the subsequent processing are improved.
    Type: Grant
    Filed: September 26, 1995
    Date of Patent: January 20, 1998
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Setsuo Nishibori, Hideaki Ohnishi, Tsuyoshi Furukawa
  • Patent number: 5710309
    Abstract: The invention relates to a process for producing tris(tribromoneopentyl) phosphate (TTBNPP), which is of value as a flame retardant. The process comprises reacting tribromoneopentyl alcohol with a phosphorus oxyhalide in the presence of anhydrous aluminum chloride as catalyst in an organic solvent to give tris(tribromoneopentyl) phosphate characterized in that a basic magnesium salt is added to the reaction mixture at the completion of the reaction. Compared with the conventional production technology, the process of the invention is conducive to high production safety and insures a high yield and a high recovery rate through a simplified procedure.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: January 20, 1998
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Setsuo Nishibori, Hideaki Ohnishi
  • Patent number: 5696302
    Abstract: A highly concentrated aqueous tribromophenolate solution containing a non-hydrophillic solvent and a reducing agent is prepared by dissolving an alkali and a reducing agent in water, adding a non-hydropillic solvent and adding tribromophenol.
    Type: Grant
    Filed: December 27, 1995
    Date of Patent: December 9, 1997
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Setsuo Nishibori, Hideto Kondo
  • Patent number: 5654369
    Abstract: The invention provides a thermoplastic resin composition uniformly and permanently rendered antistatic which comprises (A) 100 parts by weight of a thermoplastic resin, (B) 3-30 parts by weight of a cationic copolymer comprising 80-98 mol % of an ethylene unit and 2-20 mol % of a cationic unit and having a weight-average molecular weight of 1,000-50,000, and (C) 0.
    Type: Grant
    Filed: July 22, 1996
    Date of Patent: August 5, 1997
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Takayuki Tsubaki, Yutaka Nakayama, Hideyuki Sumi, Hiroshi Hotta
  • Patent number: 5652042
    Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.
    Type: Grant
    Filed: October 28, 1994
    Date of Patent: July 29, 1997
    Assignees: Matsushita Electric Industrial Co., Ltd., Dai-Ichi Kogyo Seiyaku Co., Ltd., Dowa Mining Co., Ltd.
    Inventors: Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama
  • Patent number: 5599591
    Abstract: A nitrogen-containing compound of the following general formula (1) is kneaded into a resin molding material, the kneaded mixture is molded and the surface of the resulting article is subjected to corona discharge treatment. Further, a coating material having electrostatic charges is sprayed and deposited on the article after the corona discharge treatment. This can provide a shaped resin article with remarkably improved electrical conductivity from a less electrically conductive resin, without substantially deteriorating the physical properties and the color of the article. Further, electrostatic coating excellent in coating efficiency, surface appearance, productivity or the like is possible. ##STR1## where R.sup.1 represents an alkyl group or alkenyl group of 5 to 21 carbon atoms, R.sup.2 represents --H or --CH.sub.3, R.sup.3 and R.sup.4 may be the same or different and each represents an alkyl group of 1 to 4 carbon atoms, A represents --(CH.sub.2).sub.n -- or ##STR2## and n is 1 to 5.
    Type: Grant
    Filed: February 16, 1996
    Date of Patent: February 4, 1997
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventor: Tetsuo Shiraiwa
  • Patent number: 5571472
    Abstract: A nitrogen-containing compound of the following general formula (1) is kneaded into a resin molding material, the kneaded mixture is molded, and the surface of the resulting article is subjected to corona discharge treatment. Then, an electrostatically charged coating is sprayed on the article. ##STR1## wherein R.sup.1 represents an alkyl group of 6-22 carbon atoms, R.sup.2 and R.sup.3 may be the same or different and each represents an alkyl group of 1-4 carbon atoms; n represents 2-3. In accordance with this invention, a shaped resin article with remarkably improved electrical conductivity can be obtained from a resin of low electrical conductivity substantially without affecting the physical properties and color of the resin and with high productivity. Furthermore, a resin article with high surface resistivity can be electrostatically coated with high coating efficiency and improved results in appearance and productivity substantially without affecting the physical properties of the resin.
    Type: Grant
    Filed: March 21, 1995
    Date of Patent: November 5, 1996
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventor: Tetsuo Shiraiwa
  • Patent number: 5554403
    Abstract: A frozen dough conditioner for preventing freezing damage, such as reduced loaf volume of bread and deteriorated texture and taste, on the frozen dough caused in freezing and thawing processes. Preferably, the conditioner composition is in the form of a powdery or granule conditioner for admixture with a dough composition to be frozen. The composition preferably is prepared by spraying and drying an aqueous solution or dispersion having a pH of about 4 to about 9, wherein the aqueous solution or dispersion contains: (A) a sucrose fatty acid ester having an HLB of not less than about 5; (B) diacetyl tartaric acid monoglyceride; (C) a fatty acid monoglyceride; and (D) one or more sugars.
    Type: Grant
    Filed: October 28, 1994
    Date of Patent: September 10, 1996
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Shingo Nakamura, Hiroyuki Nakata, Katsuko Nakamura
  • Patent number: 5552453
    Abstract: An object of the present invention is to provide a water-absorptive material having a satisfactory water-absorptivity in an ion-exchanged water as well as an ionic aqueous solution and also having a satisfactory thermoplastic moldability, and also to provide a water-absorptive molded product having an excellent fabricability including heat-sealability.Thus, the present invention provides a water-absorptive material crosslinked by irradiation with an ionizing radiation or ultraviolet rays, which comprises a hydrophilic high molecular compound having a weight average molecular weight of at least 10,000 obtained by reaction of (i) a polyalkylene oxide compound having an organic compound containing two active hydrogen groups addition-polymerized with an alkylene oxide comprising ethylene oxide as the main component and (ii) a polycarboxylic acid, a polycarboxylic acid anhydride, a lower alkyl ester of polycarboxylic acid or a diisocyanate.
    Type: Grant
    Filed: December 16, 1994
    Date of Patent: September 3, 1996
    Assignees: Mitsubishi Plastics, Inc., Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Takeshi Fujita, Katsuaki Matsuo, Osamu Kakishita
  • Patent number: 5552480
    Abstract: There is disclosed a thermoplastic resin composition comprising as principal components a [A] thermoplastic resin having a functional group reactive with an amino group, a [B] olefinic polymer and/or styrenic polymer, the subtotal of the above [A]+[B] being 100 parts by weight, and 0.
    Type: Grant
    Filed: February 25, 1993
    Date of Patent: September 3, 1996
    Assignees: Idemitsu Petrochemical Co., Ltd., Dai-ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Yasuhisa Sugita, Naoki Kitazawa, Hiroshi Hotta
  • Patent number: 5541242
    Abstract: The present invention provides an antistatic and flame retardant thermoplastic resin composition which comprises [A] 100 weight parts of a thermoplastic resin, [B] 2.0 to 40 weight parts of a bromine-containing organic flame retardant, and [C] 1.0 to 30 weight parts of a (meth)acrylamide-based copolymer and/or a (meth)acrylate ester-based copolymer each comprising 65 to 99 mole percent of an olefin-derived structural unit (I), 0 to 15 mole percent of a (meth)acrylate-derived structural unit (II) and 1 to 35 mole percent of a (meth)acrylamide-derived or (meth)acrylate ester-derived structural unit (III), as arranged linearly, with a weight average molecular weight of 1,000 to 50,000.
    Type: Grant
    Filed: July 28, 1994
    Date of Patent: July 30, 1996
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Yutaka Nakayama, Hideyuki Sumi, Hiroshi Hotta
  • Patent number: 5527639
    Abstract: A galvanic cell is in which at least one of the negative electrode, the positive electrode and the separator comprises a solid electrolyte prepared by doping an ionic compound to an organic polymer. The organic polymer is a polymer obtained by crosslinking an organic compound having a structure of the general formula (I):Z-[(A).sub.m -(E).sub.p -Y].sub.k (I)where Z is a residue of a compound containing at least one active hydrogen; A is represented by the following formula (II) ##STR1## wherein n is an integer of 0 to 25 and R is an alkyl having 1 to 20 carbon atoms, alkenyl, aryl or alkylaryl; E is at least one of --(R.sup.2 O)--, R.sup.2 being an alkylene having two or more carbon atoms; Y is an active hydrogen or a polymerizable functional group; k is an integer of 1 to 12; m is an integer of 1 to 250; p is an integer of 1 to 450; and A is copolymerized with E. When E is --(CH.sub.2 CH.sub.2 O)--, A and E are random-copolymerized, but when E comprises --(R.sub.2 O)-- in which R.sup.
    Type: Grant
    Filed: August 26, 1994
    Date of Patent: June 18, 1996
    Assignees: Dai-Ichi Kogyo Seiyaku Co., Ltd., Yuasa Corporation
    Inventors: Tomohiko Noda, Shyuiti Izuti, Hiroshi Imachi, Kazunari Takeda, Michiyuki Kono, Kenji Motogami, Shigeo Mori
  • Patent number: 5521100
    Abstract: The molecular weight distribution of carboxymethylcellulose or its salt is determined by gel permeation chromatography using a metal-amine complex and/or a metal-alkali complex as the mobile phase solvent. The column geometry (inside diameter/length) and flow rate for this determination are 1:40-100 and 0.2-0.5 ml/min., respectively. According to this method, the GPC determination of molecular weight distribution can be performed under the same conditions for both starting pulp and CMC.
    Type: Grant
    Filed: August 31, 1994
    Date of Patent: May 28, 1996
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Yukio Uda, Shusaku Matsumoto