Patents Assigned to Dai-Ichi Kogyo Seiyaku Co., Ltd.
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Patent number: 7468408Abstract: Disclosed is a flame retarded styrene-based resin composition containing a brominated flame retardant and an additive capable of enhancing the flame retardancy of the shaped article of the composition even in a very small amount of addition. The composition comprises (A) a styrene-based resin, (B) 0.1 to 30 parts by weight per 100 parts by weight of the resin (A) of a brominated flame retardant having a bromine content greater than 50 wt %, and (C) 0.01 to 0.2 parts by weight per 100 parts by weight of the resin (A) of a metal phthalocyanine selected from iron, manganese, cobalt, nickel, platinum or paradium phthalocyanine.Type: GrantFiled: January 11, 2005Date of Patent: December 23, 2008Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Hideaki Onishi, Makoto Teramoto
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Publication number: 20080119628Abstract: In order to provide a water-based coating composition for surface treatment of metallic materials having excellent chemical resistance, corrosion resistance, solvent resistance and adhesion, a cationic aqueous urethane resin (F) is prepared, which is obtained by chain-elongation of a cationic urethane prepolymer (D) using water or a polyamine compound (E), the cationic urethane prepolymer (D) being formed by neutralized a tertiary amino group by an acid or quaternarized the tertiary amino group by quaternarizing agent, the tertiary amino group being included in a urethane prepolymer comprising, as components thereof, a compound (A) having two or more active hydrogen atoms, an organic polyisocyanate (B), and a chain elongation agent (C) having the tertiary amino group.Type: ApplicationFiled: March 16, 2005Publication date: May 22, 2008Applicant: DAI-ICHI KOGYO SEIYAKU CO., LTD.Inventors: Hidekazu Wada, Shuichi Ito
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Patent number: 7354984Abstract: To efficiently dry it, a nonionic alkylene oxide-type water-soluble resin is put into a container, then the container is degassed to a prescribed vacuum degree which is maintained while a dry gas having a dew point not higher than prescribed is introduced into the container at a rate not lower than prescribed. Minor volatiles are efficiently removed from the resin in an evaporation tank having a stirring blade. For protecting the dried resin from water, a dry gas is introduced into and air is purged from an empty packaging container whereafter the resin is charged into the container is sealed. By controlling solvent content and visocity of the resin and loading it into a temperature-controlled transportation container and/or unloading it out of the transportation container by the use of a pump, good subsquent processability of the resin and prevention of deterioration thereof are ensured.Type: GrantFiled: February 18, 2005Date of Patent: April 8, 2008Assignees: Dai-ichi Kogyo Seiyaku Co., Ltd., Nippon Shokubai Co., Ltd.Inventors: Michiyuki Kono, Manabu Kikuta, Masaki Tezuka, Hiroshi Tanaka, Takao Yokohashi, Takao Nishihata, Kazuhiko Murata, Taketo Toba, Fumihide Tamura, Ritsuo Kitada
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Patent number: 7279540Abstract: A precursor composition capable to form a solid-state electrolyte having good ion conductivity and high heat-resistance, by simple curing procedure, comprising; (A) a polymerizable ion pair compound represented by formula I, (B) a cross-linker having two or more unsaturated groups co-polymerizable with the polymerizable ion pair compound (A), and (C) non-polymerizable ion pair compound. Each of R1, R2, R3, R4, R5 and R6 represents hydrogen atom, alkyl or aryl group having 1-12 carbon atoms; and each of R7 and R8 represents alkyl or aryl group having 1-12 carbon atoms.Type: GrantFiled: July 18, 2005Date of Patent: October 9, 2007Assignee: Dai-ichi Kogyo Seiyaku Co., Ltd.Inventors: Manabu Kikuta, Akiyoshi Hatakeyama
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Publication number: 20070173614Abstract: An object of the present invention is to provide a polyether composition that can suppress reduction in a molecular weight of polyether having a low glass transition temperature and melting point. As a means of achieving this object, a polyether composition of the present invention contains polyether having a glass transition temperature of ?50° C. or lower and a melting point of 55° C. or lower and, at the same time, contains at least one kind selected from the group consisting of compounds represented by the specified three general formulas.Type: ApplicationFiled: March 8, 2005Publication date: July 26, 2007Applicants: Nippon Shokubai Co., Ltd., Dai-ichi Kogyo Seiyaku Co., Ltd.Inventors: Keiichiro Mizuta, Teruki Matsushita, Kenji Shimizu, Kazuo Takei, Michiyuki Kono, Manabu Kikuta, Nobuo Ochiai
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Publication number: 20070161772Abstract: The invention relates to a cladding resin composition curable by heat, ultraviolet radiation, an electron beam or the like. The composition comprises a polyoxyalkylene polyol phosphate ester (hydroxyl value: 10-2,000 mg KOH/g) and a polymerizable or reactive functional group-containing compound. This composition is highly conductive as it is and, without incorporation of the conventional conductive additives, can be used successfully in the field of coatings and protective films where electric conductivity is a requisite.Type: ApplicationFiled: February 27, 2007Publication date: July 12, 2007Applicant: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Tetsuo Shiraiwa, Shigeo Mori
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Patent number: 7238444Abstract: A lithium secondary battery which comprises a negative electrode, a positive electrode, and disposed therebetween a polymer electrolyte comprising an ionically conductive polymer. The polymer electrolyte has a two-layer structure composed of a positive-electrode-side layer and a negative-electrode-side layer. The polymer electrolyte on the positive-electrode side contains a nonaqueous electrolytic solution containing a lithium salt in a higher concentration than that in the polymer electrolyte on the negative-electrode side. The battery is improved in charge/discharge cycling characteristics and high-load discharge characteristics.Type: GrantFiled: September 28, 2001Date of Patent: July 3, 2007Assignees: Dai-Ichi Kogyo Seiyaku Co., Ltd., Sharp CorporationInventors: Tsutomu Sada, Kazunari Takeda, Yumiko Takashima, Naoto Nishimura, Takehito Mitate, Kazuo Yamada, Motoaki Nishijima, Naoto Torata
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Patent number: 7189444Abstract: The invention relates to a cladding resin composition curable by heat, ultraviolet radiation, an electron beam or the like. The composition comprises a polyoxyalkylene polyol phosphate ester (hydroxyl value: 10–2,000 mg KOH/g) and a polymerizable or reactive functional group-containing compound. This composition is highly conductive as it is and, without incorporation of the conventional conductive additives, can be used successfully in the field of coatings and protective films where electric conductivity is a requisite.Type: GrantFiled: April 1, 2003Date of Patent: March 13, 2007Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Tetsuo Shiraiwa, Shigeo Mori
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Patent number: 7160957Abstract: A method for residual monomer diminution by which a residual monomer is speedily removed from an N-vinyl compound polymer or the like without posing a problem such as an increase in ash content; and a process for producing an N-vinyl compound polymer solution or powder which has a regulated pH and is free from a decrease in pH with time. The method comprises adding an organic acid having a boiling point of 140° C. or higher at ordinary pressure to anaqueous solution of an N-vinyl compound polymer. The process comprises adding an organic base to an aqueous N-vinyl compound polymer solution having a pH lower than 7.0 to thereby neutralize the solution and regulate the pH thereof. Those operations are conducted in a reaction vessel in which a gaseous phase is regulated so as to have an oxygen concentration of 5.0% by volume or lower.Type: GrantFiled: July 8, 2003Date of Patent: January 9, 2007Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Toshiaki Kuriyama, Yasuko Inui
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Publication number: 20060111544Abstract: This invention relates to a water-soluble fiber and a method of manufacturing the fiber. The water-soluble fiber of the invention is composed of a high molecular compound with a weight average molecular weight of not less than 10,000, which high molecular compound is obtainable by reacting a polyalkylene oxide compound, which is obtainable by addition polymerization of an ethylene oxide-containing alkylene oxide and an organic compound containing two active hydrogen atoms, with a polycarboxylic acid, an anhydride thereof, a lower alkyl ester thereof, or a diisocyanate and is manufactured by spinning the same high molecular compound. The water-soluble fiber of the invention is not only high in elongation and tensile strength but is readily soluble in water.Type: ApplicationFiled: December 30, 2005Publication date: May 25, 2006Applicant: Dai-ichi Kogyo Seiyaku Co., Ltd.Inventors: Takeshi Fujita, Chuzo Isoda, Sejin Pu
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Patent number: 7045242Abstract: Polymeric compounds are provided the use of which expedites dissociation of an electrolytic salt. The polymeric compounds have a trivalent boron atom which is a Lewis acid. Transport rates of charge carrier ions can be controlled by trapping counter ions of charge carrier ions in the polymeric chain.Type: GrantFiled: April 30, 2004Date of Patent: May 16, 2006Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Masahito Nishiura, Michiyuki Kono, Masayoshi Watanabe
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Patent number: 7026386Abstract: The present invention relates to a flame-retarded styrene-based plastic composition comprising (A) a styrene-based plastic material (B) a brominated aromatic compound having a melting point from 200° C. to 260° C. in which all bromine atoms are attached to the aromatic ring, (C) a brominated aromatic compound having a melting point above 300° C. in which all bromine atoms are attached to the aromatic ring, (D) an organic compound having at least one 2,3-dibromopropyl group, and optionally (E) antimony trioxide.Type: GrantFiled: September 4, 2002Date of Patent: April 11, 2006Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventor: Hideaki Onishi
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Publication number: 20060051288Abstract: The present invention provides new process for preparing inorganic fine particles, which suppresses agglomeration and adhesion of particles due to heat when preparing powder from a raw material liquid such as a slurry of zirconia hydrate fine particles in order to obtain inorganic raw material powder having sharp particle size distribution. Furthermore, the present invention provides a new process for preparing inorganic fine particles, which can make the chemical structure homogenous among the produced particles and inside the particles even in a multi-component system. The present invention provides a process for preparing inorganic fine particles, which comprises heating and applying impulse waves to a raw material liquid.Type: ApplicationFiled: November 6, 2003Publication date: March 9, 2006Applicants: DAI-ICHI KOGYO SEIYAKU CO. LTD, PULTECH CORPORATION, TORY INDUSTRIES, INC.Inventors: Toru Tsurumi, Masaki Yoshino, Mineo Sabi, Fumio Yoshida, Satoshi Ishida, Minoru Yonehara, Toshiaki Kimura, Atsuyoshi Kubotani
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Patent number: 7001976Abstract: This invention relates to a water-soluble fiber and a method of manufacturing the fiber. The water-soluble fiber of the invention is composed of a high molecular compound with a weight average molecular weight of not less than 10,000, which high molecular compound is obtainable by reacting a polyalkylene oxide compound, which is obtainable by addition polymerization of an ethylene oxide-containing alkylene oxide and an organic compound containing two active hydrogen atoms, with a polycarboxylic acid, an anhydride thereof, a lower alkyl ester thereof, or a diisocyanate and is manufactured by spinning the same high molecular compound. The water-soluble fiber of the invention is not only high in elongation and tensile strength but is readily soluble in water.Type: GrantFiled: April 24, 2003Date of Patent: February 21, 2006Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Takeshi Fujita, Chuzo Isoda, Sejin Pu
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Patent number: 6924332Abstract: A flame retarded polyamide or polyester resin composition is disclosed. The composition comprises (A) polyamide or polyester resin; (B) 3 to 50 parts by weight per 100 parts of said resin of brominated polystyrene or brominated polyphenylene ether; and (C) 10 to 10,000 ppm of said resin of a thermal coloration inhibitor selected from the group consisting of hydrazine, a hydrazino compound, a hydrazono compound and an acid addition salt thereof.Type: GrantFiled: December 11, 2002Date of Patent: August 2, 2005Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Hideaki Onishi, Makoto Teramoto
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Patent number: 6924331Abstract: A flame retarded polyolefin resin composition comprises polyolefin resin, 1 to 40 parts by weight per 100 parts of the polyolefin resin of a brominated bisphenol ether derivative of the formula: wherein R is hydrogen or methyl, and A is —C(CH3)2—, —SO2—, —S—, or —CH2—; and 1 to 30 parts by weight per 100 parts of the polyolefin resin of 2,4,6-tris(mono-, di- or tribromophenoxy)triazine.Type: GrantFiled: February 5, 2002Date of Patent: August 2, 2005Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Makoto Teramoto, Hideaki Onishi
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Patent number: 6919391Abstract: A flame retarded polyolefin resin composition comprises polyolefin resin, 1 to 40 parts by weight per 100 parts of the polyolefin resin of a brominated bisphenol ether derivative of the formula 1: wherein R is hydrogen or methyl, and A is —C(CH3)2—, —SO2—, —S—, or —CH2—; and 1 to 30 parts by weight per 100 parts of the polyolefin resin of a compound of the formula 2. wherein B is mono-, di- or tribromophenyl group, n is an integer from 1 to 20, and A is as defined above.Type: GrantFiled: February 5, 2002Date of Patent: July 19, 2005Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Makoto Teramoto, Hideaki Onishi
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Patent number: 6913851Abstract: The present invention is aimed to provide polyether polymers capable of improving an ion conductivity around room temperature as well as ion conductible polymer compositions and electrochemical devices using the same. The above objectives are achieved by using polyether polymers characterized by having the structure unit represented by the formula (1) and the structure unit represented by the formula (2) and/or the structure unit represented by the formula (3), and having polymerizable and/or non-polymerizable functional groups at each end of the molecular chains.Type: GrantFiled: March 12, 2002Date of Patent: July 5, 2005Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventors: Masahito Nishiura, Michiyuki Kono
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Patent number: 6864343Abstract: A brominated polyphenylene oxide having a molecular skeleton obtained by condensing tribromophenols and satisfying the requirements: (A) its 20 wt. % solution in chloroform has an absorbance at 600 nm of not larger than 0.6; (B) when 50 ml of ion-exchanged water is added to its 1.00 g/30 ml solution in dioxane, the resulting solution has an electroconductivity of not larger than 10 ?S/cm measured at 25° C.; and (C) when a mixture comprised of 20% by weight of the brominated polyphenylene oxide and 80% by weight of triphenyl phosphate is heated at 280° C. for 20 minutes, the halide ion increase therein is not larger than 10 ?mols per gram of the brominated polyphenylene oxide, is used as a flame retardant. When it is added to resin, the resin moldings are excellent in its flame retardancy, electric properties, physical properties, thermal stability and appearance (color hue), and they do not corrode molds.Type: GrantFiled: June 9, 2003Date of Patent: March 8, 2005Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.Inventor: Hideaki Onishi
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Patent number: RE40302Abstract: Provided are a polymeric electrolyte or a nonaqueous electrolyte that can improve a transport rate of charge carrier ions by adding a compound having boron atoms in the structure, preferably one or more selected from the group consisting of compounds represented by the following general formulas (1) to (4), and an electric device such as a cell or the like using the same. wherein R11, R12, R13, R14, R15, R16, R21, R22, R23, R24, R25, R26, R27, R28, R31, R32, R33, R34, R35, R36, R37, R38, R39, R310, R41, R42, R43, R44, R45, R46, R47, R48, R49, R410, R411 and R412 each represent a hydrogen atom, a halogen atom or a monovalent group, or represent groups bound to each other to form a ring, and Ra, Rb, Rc and Rd each represent a group having a site capable of being bound to boron atoms which are the same or different.Type: GrantFiled: August 28, 2000Date of Patent: May 6, 2008Assignee: Dai-Ichi Kogyo Seiyaku Co. Ltd.Inventors: Masahito Nishiura, Michiyuki Kono, Masayoshi Watanabe