Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.

Abstract: Metal foil is laminated via an insulating layer so as to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed so as to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in interlayer via holes each formed by applying a laser beam to the resist layer, thereby to establish interlayer connection between the first layer circuit wiring and the second layer circuit wiring. Subsequently, the resist layer is removed, and then, using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in hole portions of an insulating layer formed so as to cover the second layer circuit wiring, thereby to form external connection terminals.

Abstract: In a polymer electrolyte fuel cell wherein a plurality of unit cells are arranged in a flat manner oriented in the same direction, and the prescribed adjacent unit cells are electrically connected in series so as to connect the plurality of unit cells in series, a flat-type polymer electrolyte fuel cell is made possible by providing at least one of a through hole connecting portion, a filled via connecting portion and a bump connecting portion in an insulating portion located between the prescribed adjacent unit cells, electrically insulated from the unit cells and having a thickness approximately equal to that of the unit cell, for establishing electrical connection between the prescribed adjacent unit cells.

Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.

Abstract: The present invention relates to image-formation on any selected kind of objective body. The characterizing features reside in such that, based upon fed image data, required images are formed on an image-transferable sheet acting for image carry-over service and in reliance on sublimation image transfer technique, and then, by the use of said sheet with said images thus formed thereon, the formed images thereon are transferringly applied on the objective body. By adopting the above measures, the objective body can be formed sharply and clearly with any desired images, irrespective of kind and configuration thereof, with such superior results of highly improved unity and solidability between the formed images and the objective body to be decorated with.

Abstract: The present invention relates to a heat transfer cover film characterized in that a specific transparent resin layer (2) is releasably provided on a substrate film (1). This transparent resin layer (2) can be easily laminated on the surface of the resulting image (7Y, 7M and 7C) by heat transfer means, making it possible to provide expeditious provision of image representations which are improved in terms of such properties as durability, gloss and color development and is curl-free.

Abstract: The present invention relates to a heat transfer cover film characterized in that a specific transparent resin layer (2) is releasably provided on a substrate film (1). This transparent resin layer (2) can be easily laminated on the surface of the resulting image (7Y, 7M and 7C) by heat transfer means, making it possible to provide expeditious provision of image representations which are improved in terms of such properties as durability, gloss and color development and is curl-free.

Abstract: There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside

Abstract: The present invention relates to image-formation on any selected kind of objective body. The characterizing features reside in such that, based upon fed image data, required images are formed on an image-transferable sheet acting for image carry-over service and in reliance on sublimation image transfer technique, and then, by the use of said sheet with said images thus formed thereon, the formed images thereon are transferringly applied on the objective body. By adopting the above measures, the objective body can be formed sharply and clearly with any desired images, irrespective of kind and configuration thereof, with such superior results of highly improved unity and solidability between the formed images and the objective body to be decorated with.

Abstract: There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside

Abstract: A resin composition for an aqueous paint containing different phase structure emulsion particles obtained by multi-stage emulsion polymerization as a binder, wherein the different phase structure emulsion particles have an outermost phase formed by an emulsion polymer of an ethylenic unsaturated monomer, having a glass transition temperature of from −500° C. to 10° C.

Abstract: When a temporary adhesive layer for peelably bonding a transfer-receiving material to a thermal transfer sheet comprising a substrate film and a heat-fusible ink layer disposed on one side thereof is caused to comprise a specific adhesive, an excellent composite thermal transfer material is provided. In such a composite thermal transfer sheet, the thermal transfer sheet is firmly bonded to the transfer-receiving material so as not to cause wrinkles or deviation, both of these members may easily be peeled from each other so that the ink layer is exactly transferred to the paper in a transfer region and it is not transferred thereto at all in a non-transfer region, whereby the transfer-receiving material is not contaminated. An antistatic treatment provides a composite thermal transfer sheet causing no trouble due to charging at the time of or after printing operation.

Abstract: The present invention relates to image-formation on any selected kind of objective body. The characterizing features reside in such that, based upon fed image data, required images are formed on an image-transferable sheet acting for image carry-over service and in reliance on sublimation image transfer technique, and then, by the use of said sheet with said images thus formed thereon, the formed images thereon are transferringly applied on the objective body. By adopting the above measures, the objective body can be formed sharply and clearly with any desired images, irrespective of kind and configuration thereof, with such superior results of highly improved unity and solidability between the formed images and the objective body to be decorated with.

Abstract: There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside

Abstract: There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside

Abstract: The present invention relates to a heat transfer cover film characterized in that a specific transparent resin layer (2) is releasably provided on a substrate film (1). This transparent resin layer (2) can be easily laminated on the surface of the resulting image (7Y, 7M and 7C) by heat transfer means, making it possible to provide expeditious provision of image representations which are improved in terms of such properties as durability, gloss and color development and is curl-free.

Abstract: A release sheet according to the invention comprises a base release sheet, which is a laminate of a base material and a release resin layer, and a design printed sheet which can be stacked releasably on the base material of the base release sheet. Said design printed sheet have a base sheet and a convex image layer with the desired pattern positioned on the one side of the base sheet. In the release sheet according to the invention, the base release sheet may be used repeatedly and only the design printed sheet may be replaced with another one having the desired convex image layer. The use of such a release sheet makes it possible to prepare synthetic leather in various kinds and small lots.

Abstract: The present invention relates to a heat transfer cover film characterized in that a specific transparent resin layer (2) is releasably provided on a substrate film (1). This transparent resin layer (2) can be easily laminated on the surface of the resulting image (7Y, 7M and 7C) by heat transfer means, making it possible to provide expeditious provision of image representations which are improved in terms of such properties as durability, gloss and color development-and is curl-free.

Abstract: The present invention relates to image-formation on any selected kind of objective body. The characterizing features reside in such that, based upon fed image data, required images are formed on an image-transferable sheet acting for image carry-over service and in reliance on sublimation image transfer technique, and then, by the use of said sheet with said images thus formed thereon, the formed images thereon are transferringly applied on the objective body. By adopting the above measures, the objective body can be formed sharply and clearly with any desired images, irrespective of kind and configuration thereof, with such superior results of highly improved unity and solidability between the formed images and the objective body to be decorated with.

Abstract: There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside