Abstract: A substrate treatment apparatus includes: a chamber; a substrate being treated with a treatment liquid in the chamber; a temperature measuring unit which measures an internal air temperature of the chamber and/or a temperature of the treatment liquid; a temperature adjusting unit which changes the internal air temperature and/or the temperature of the treatment liquid; a storage unit which stores a map defining a relationship between the air temperature and the treatment liquid temperature so that a treatment liquid temperature level for a given air temperature level is lower than the given air temperature level; and a temperature controlling unit which sets a target value of the internal air temperature of the chamber or the temperature of the treatment liquid based on the map and a measurement value detected by the temperature measuring unit, and controls the temperature adjusting unit based on the target value.

Abstract: A first RIP processing unit reads cache data from a first cache unit. The first RIP processing unit transmits first RIP-processed variable part data to a printer. Since an identifier read by the first RIP processing unit is not a transmitted identifier, the first RIP processing unit transmits RIP-processed reuse part data to the printer. A second RIP processing unit reads cache data from a second cache unit. The second RIP processing unit transmits second RIP-processed variable part data to the printer. Since an identifier read by the second RIP processing unit is a transmitted identifier, the second RIP processing unit does not transmit the RIP-processed reuse part data to the printer.

Abstract: A substrate treating apparatus includes a circulating line having a treating tank for storing a phosphoric acid aqueous solution, a circulating pump for feeding the phosphoric acid aqueous solution, a heater for circulation for heating the phosphoric acid aqueous solution, a filter for filtering the phosphoric acid aqueous solution, the circulating line causing the phosphoric acid aqueous solution discharged from the treating tank to flow in order of the circulating pump, the heater for circulation and the filter, and returning the phosphoric acid aqueous solution from the filter to the treating tank. The apparatus also includes a branch pipe branching from the circulating line between the heater for circulation and the filter for extracting the phosphoric acid aqueous solution from the circulating line, and a concentration measuring station connected to the branch pipe for measuring silicon concentration in the phosphoric acid aqueous solution by potentiometry.

Abstract: Each unit of an inkjet printing station includes chains arranged along a transportation path of a web paper. A holding mechanism is fixedly arranged on the chain. The holding mechanism holds both ends of a paper passing bar to which the web paper is attached. Driving the chain with a handle causes the holding mechanism to move. The paper passing bar is delivered between the units adjoining each other. Therefore, the paper passing bar is movable from one end to the other end of the inkjet printing station formed by the units. Moreover, when specifications are changed for changing combination of the units, the combination can be made optionally.

Abstract: A substrate processing method includes a water removing step of removing water from a substrate, a silylating step of supplying a silylating agent to the substrate after the water removing step, and an etching step of supplying an etching agent to the substrate after the silylating step. The substrate may have a surface on which a nitride film and an oxide film are exposed and in this case, the etching step may be a selective etching step of selectively etching the nitride film by the etching agent. The etching agent may be supplied in a form of a vapor having an etching component.

Abstract: A substrate treating apparatus includes a loading section 1, a treating tank 2, a rinsing tank 4, a drying tank 5, an unloading section 6, and a pair of endless belt members 7 for transporting substrates successively through the loading section 1, treating tank 2, rinsing tank 4, drying tank 5 and unloading section 6. The substrate treating apparatus further includes a fixing mechanism for fixing a pair of side edges of each substrate parallel to a transport direction of the substrate to the endless belt members 7. In the loading section 1, a plurality of substrates are fixed, each with the pair of edges thereof parallel to the transport direction fixed at constant intervals to the pair of endless belt members 7. The substrates having undergone the treatment are removed from the pair of endless belt members 7 in the unloading section 6.

Abstract: A substrate processing apparatus comprises a substrate holding mechanism, a process liquid supplying mechanism supplying a process liquid, a first guide portion around the substrate holding mechanism having an upper edge portion extending toward the rotation axis for guiding scattered process to flow down, a second guide portion provided around the substrate holding mechanism outside the first guide portion and having an upper edge portion extending toward the rotation axis as vertically overlapping with the upper edge portion of the first guide portion for further guiding the scattered process liquid to flow down, a recovery channel provided outside and integrally with the first guide portion for recovering the process liquid guided by the second guide portion, and a driving mechanism for moving up and down the first guide portion and the second guide portion independently of each other.

Abstract: Compressed data transmitted to a print control apparatus includes break data having information on a compressed size and a decompressed size for each page. When the compressed data is transferred to a decompressing unit, the break data is converted to NOP data. Information on the decompressed size included in each break data is provided to a checking unit. During a period in which a decompression process is performed, a decompression flag is turned on. The checking unit obtains the actual decompressed size by counting a period in which the decompression flag is turned on, to check whether the decompression process has been normally performed. During a period in which the decompressing unit and the checking unit perform processes for a certain page, a reading unit reads compressed data for the next page.

Abstract: The temperature of a semiconductor wafer is raised by light irradiation heating performed by halogen lamps. An infrared ray emitted from the semiconductor wafer whose temperature has been raised transmits through an infrared-transparent window made of silicon, and then is detected by an infrared camera. The infrared camera two-dimensionally detects the temperature of an entire surface of the semiconductor wafer. Based on a result of the detection obtained by the infrared camera, a temperature drop region having a relatively low temperature among the region of the semiconductor wafer is irradiated with laser light emitted from a laser light emission part. Accordingly, without rotating the semiconductor wafer, a temperature distribution can be made uniform with a high accuracy throughout the entire surface of the semiconductor wafer.

Abstract: Ink in an ink tank is fed through a dissolved gas control filter to a printer head. A gas pressure changing mechanism reduces pressure in a gas pressure control tank. In response, the dissolved gas control filter removes gas dissolved in the ink. The gas pressure control tank is placed under pressure corresponding to a sum of the pressure reduced by the gas pressure changing mechanism and the pressure of the gas having been removed from the liquid. A gas pressure measuring part measures the sum of these pressures as pressure in the gas pressure control tank. Then, a controller determines when time of exchange of the dissolved gas control filter has come based on the magnitude of a gradient of gas pressure variation in the gas pressure control tank.

Abstract: A substrate treating apparatus for treating substrates by immersing the substrates in a treating solution includes the following elements. A treating tank for storing the treating solution; a lifter capable of supporting a plurality of substrates, and vertically movable between an upper withdrawn position above the treating tank and a treating position inside the treating tank; a treating solution supply device for supplying the treating solution to the treating tank; a dripping device for dripping a surfactant to a surface of the treating solution stored in the treating tank; and a control device for causing the treating solution supply device to supply the treating solution to the treating tank, causing the lifter to place the substrates in the treating position, and causing the dripping device to drip the surfactant when raising the lifter to the upper withdrawn position after treatment of the substrates with the treating solution.

Abstract: An electromagnetic radiation generating device is a device that generates electromagnetic wave pulses from a plane surface. The electromagnetic radiation generating device includes an electromagnetic radiation generating element, a light irradiating unit. The electromagnetic radiation generating element includes: a depletion layer forming body formed by stacking a p-type silicon layer and an n-type silicon layer in a planar pattern; a light receiving surface electrode formed on one surface of the depletion layer forming body, the light receiving surface electrode including a plurality of parallel electrode parts that are equally spaced while a forming distance is maintained between the parallel electrode parts, the forming distance corresponding to the wavelength of the electromagnetic wave pulses generated from the depletion layer forming body; and a rear surface electrode formed on the opposite surface of the depletion layer forming body.

Abstract: A substrate processing method comprising: holding a substrate substantially horizontally by a rotatable substrate holding mechanism; supplying a rinsing liquid onto the top of the substrate held by the substrate holding mechanism at the substrate holding step; after the rinsing liquid supply step, spraying a gas onto the top of the substrate held by the substrate holding mechanism, by a gas knife mechanism, to form a gas spraying zone on the substrate top, and unidirectionally scanning the substrate top in its entirety by this gas spraying zone, without rotating the substrate; replenishing the rinsing liquid by supplying, in parallel to the gas knife spraying step, a rinsing liquid onto the substrate top at its area downstream in the gas-spraying-zone scanning direction rather than the gas spraying zone formed by the gas knife mechanism; and drying the substrate surface after the gas knife spraying step and the rinsing liquid replenishing step.

Abstract: Provided is a data processing method of a printing apparatus for printing a multi-color image on a printing medium by each of printing heads for at least two colors while transporting the printing medium relative to the printing heads in a paper-feed direction. The method includes a skew detecting step of detecting a degree of skew of the printing medium; a correction printing-data generating step of shifting print data from a printing unit for performing printing in a direction orthogonal to the paper-feed direction in accordance with the degree of skew to generate correction printing-data, the printing unit having a first printing head disposed upstream in the paper-feed direction and a second printing head spaced away from the first printing head downstream in the paper-feed direction; and a printing step of performing printing on the printing medium with the printing unit in accordance with the correction printing-data.

Abstract: An inspection apparatus inspects a photovoltaic cell panel in which the photo device is formed. The inspection apparatus includes: an irradiation part that irradiates the photovoltaic cell panel with pulsed light (pump light) emitted from a femtosecond laser; a detecting part that detects an electromagnetic wave pulse, which is generated from the photovoltaic cell panel according to the irradiation of the pump light; and a continuous light irradiation part that irradiates a portion, which is irradiated with the pump light in the photovoltaic cell panel, with continuous light.

Abstract: A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Abstract: In an inkjet printer, a pattern for density correction that indicates a constant density image is printed on printing paper with a head having a plurality of outlet rows, and pattern image data that indicates the pattern is acquired. A target outlet that ejects ink toward a linear region having a missing part in the pattern is detected, and a reference outlet that is included in the same outlet row as the target outlet and located close to the target outlet is specified. A density correction value of the target outlet among density correction values that are acquired based on a density profile of the pattern is replaced with a representative value of a density correction value of the reference outlet. Through this, even if an ink ejection failure occurs in any of the outlets, appropriate density correction values can be obtained for a plurality of outlets.

Abstract: Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.

Abstract: A substrate processing apparatus is composed of an indexer block, a first processing block and a second processing block that are provided in parallel with one another. The indexer block is provided with an indexer robot. The first processing block is provided with a plurality of back surface cleaning units and a first main robot. The second processing block is provided with a plurality of end surface cleaning units, a plurality of top surface cleaning units and a second main robot.

Abstract: The front surface of a semiconductor wafer with a back surface supported by lift pins is irradiated with a flash of light from flash lamps, so that the semiconductor wafer is heated. A transparent restriction ring made of quartz is into abutment with or close to a peripheral portion of the front surface of the semiconductor wafer. In this state, the flash irradiation is performed. If the temperature of the front surface of the semiconductor wafer rises rapidly when the flash irradiation is performed, the restriction ring restrains the semiconductor wafer from jumping up from the lift pins. This prevents wafer cracking resulting from the jumping of the semiconductor wafer when the flash irradiation is performed.