Abstract: An apparatus for collecting material from a workpiece from a machined workpiece includes a fluid nozzle for inducing a flow of a fluid and a collection nozzle. The collection nozzle includes a motive nozzle for accelerating a first portion of the fluid flow; and an induced-suction nozzle for receiving a second portion of the fluid flow. A suction force can be generated within a vicinity of the induced-suction nozzle based on the accelerated first portion of the fluid flow. The suction force can be sufficient to carry at least a portion of the material away from the workpiece. Related methods of collecting material from a workpiece are also disclosed, as are systems capable of incorporating the material apparatus collecting apparatus.

Abstract: A surface of a workpiece (12) to be laser machined is protected by a surfactant film (11) form debris (15) produced during machining with a laser beam (14) by reducing adherence to the surface of debris produced by the laser machining. The surfactant film is preferably subsequently removed together with debris (151) deposited thereon.

Abstract: Methods and apparatus for machining substrates are disclosed, as are articles formed from the separated substrates. A method of machining a substrate having a first surface and a second surface opposite the first surface can include forming a first recess in the substrate extending from the first surface toward the second surface, forming a second recess in the substrate extending from the second surface toward the first surface, and removing a portion of the substrate extending from the first recess to the second recess to form an opening in the substrate.

Abstract: Systems and methods are provided for scribing wafers with short laser pulses so as to reduce the ablation threshold of target material. In a stack of material layers, a minimum laser ablation threshold based on laser pulse width is determined for each of the layers. The highest of the minimum laser ablation thresholds is selected and a beam of one or more laser pulses is generated having a fluence in a range between the selected laser ablation threshold and approximately ten times the selected laser ablation threshold. In one embodiment, a laser pulse width in a range of approximately 0.1 picosecond to approximately 1000 picoseconds is used. In addition, or in other embodiments, a high pulse repetition frequency is selected to increase the scribing speed. In one embodiment, the pulse repetition frequency is in a range between approximately 100 kHz and approximately 100 MHz.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: A method of characterizing an object includes determining a depth-wise composition of the object at a measurement site within the object. A property of the object within a region adjacent to the measurement site can, optionally, be estimated based on the determining. Another method of characterizing an object includes disposing at least a portion of an object within a measurement region of a metrology tool, aligning a feature of the object and a location of a designated measurement site within the measurement region relative to each other, and performing a performing a compositional analysis of a portion of the object occupying the measurement site. Various apparatus for performing these methods are also disclosed, as are methods of monitoring manufacturing processes based on these methods.

Abstract: An internal feature can be laser machined in strengthened glass sheets or panels by first laser machining a first scribe in a first surface proximate to the internal feature to be laser machined. The internal feature can be then laser machined by positioning a beam waist of a laser beam proximate to an opposite second surface by focusing the laser beam through the strengthened glass panel from the first surface. The internal feature is laser machined by repositioning the beam waist from the second surface to the first surface while removing material from a kerf surrounding the internal feature. When the laser beam waist is finally positioned proximate to the first surface material, the internal shape formed by the laser machining is easily and cleanly removed from the surrounding glass.

Abstract: Each black square within a two-dimensional code can be represented by a distribution of spots. Each spot can be made small enough to be invisible to the human eye so that the two-dimensional code can be invisible on or within transparent or nontransparent materials. The spots can be spaced at a large distance to increase the signal-to-noise ratio for an optical code reader. A laser can be used to produce the spots.

Abstract: Numerous embodiments of interactive control systems, methods of making the same, and devices incorporating the same are disclosed. In one embodiment, a system includes a light-resistant material; light-transmissive holes penetrating in a light-transmissive pattern through the light resistant material; and a lens disposed adjacent to the light-transmissive pattern.

Abstract: Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.

Abstract: The invention provides a method of laser processing with a thermally stabilized acousto-optic beam deflector.

Abstract: Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.

Abstract: The present invention relates to laser marking articles. In particular it relates to laser marking articles by laser ablating a coating applied to the article which reveals the surface of the article underneath, thereby forming the mark by the contrasting appearance between the revealed surface of the article and the adjacent remaining coating. Laser parameters are selected to provide uniform, commercially desirable appearance and avoid damage to the underlying surface while maintaining acceptable system throughput. In particular the laser pulse envelope is tailored to provide desirable appearance while maintaining acceptable system throughput.

Abstract: A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught.

Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.

Abstract: Detecting misalignment of test probes with component carriers in an automated test system is taught. Automated test systems for testing electronic components can have electronic components held in component carriers in preparation for testing. Testing can include moving test probes through openings provided in the component carrier to contact the electronic components held therein. Aspects of disclosed implementations use force feedback from the test probes to determine if the test probes have successfully contacted the electronic component without, for example, contacting the component carrier.

Abstract: A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.

Abstract: Deep narrow gaps (20) between side walls (32 and 36) of a workpiece (26) can be measure by modules (42) that include an imager (70) and provide focused directional lighting from light sources (76) into the gaps (20). The imager (70) may employ a camera having an array of pixels along rows and columns. Gray scale captured by pixels along rows or columns parallel to a major axis (46) of the gap (20) may be analyzed to facilitate determination of spacing between the edges (34 and 38) of the gaps (20). Relative movement between the workpiece (26) and the imager (76) along the major axis (46) can also facilitate determination of spacing between the edges (34 and 38) of the gaps (20).

Abstract: An apparatus can include ablation chamber body having a transmission window and defining an accommodation region configured to accommodate a target that is movable relative to the transmission window. An aerosol transmission conduit is configured to transport an aerosol produced within the accommodation region to a sample receiving region of an analysis system along a substantially straight transport path.

Abstract: Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.