Abstract: A sensing device for a non-volatile memory includes a reference circuit, two switches, a sensing circuit and a judging circuit. The reference circuit is connected to a first node. A first terminal of the first switch is connected with the first node and a control terminal of the first switch receives an inverted reset pulse. A first terminal of the second switch is connected with the first node, a second terminal of the second switch receives a ground voltage, and a control terminal of the second switch receives a reset pulse. The sensing circuit is connected between the second terminal of the first switch and a second node. The sensing circuit generates a first sensed current. The judging circuit is connected to the second node. The judging circuit receives the first sensed current and generates an output data according to the first sensed current.

Abstract: A driving circuit includes a cross coupled circuit, a first conducting device, a second conducting device, a first switching device, a second switching device, a first selecting device and a second selecting device. The first conducting device is connected between a first node and a second node. The second conducting device is connected between a third node and a fourth node. The cross coupled circuit receives a first supply voltage and is connected with the first node and the second node. The first switching device is connected between the second node and a fifth node. The second switching device is connected between the fourth node and a sixth node. The first and second selecting devices are respectively connected with the fifth node and the sixth node. Each of the first and second selecting devices receives a second supply voltage and a third supply voltage.

Abstract: A random bit generator includes a voltage source, a bit data cell, and a sensing control circuit. The voltage source provides a scan voltage during enroll operations. The data cell includes a first transistor and a second transistor. The first transistor has a first terminal coupled to a first bit line, a second terminal coupled to the voltage source, and a control terminal. The second transistor has a first terminal coupled to a second bit line, a second terminal coupled to the voltage source, and a control terminal. The sensing control circuit is coupled to the first bit line and the second bit line, and outputs a random bit data according to currents generated through the first transistor and the second transistor during an enroll operation of the bit data cell.

Abstract: An anti-fuse memory device includes an anti-fuse module, a reference current circuit and a controller. A write enable signal enables a write controller and a write buffer of the anti-fuse module to program a selected anti-fuse memory cell in an anti-fuse array of the anti-fuse module, and a timing controller of the anti-fuse module stops a program operation of the anti-fuse array after a sense amplifier of the anti-fuse module changes a state of a readout data signal for a predetermined time duration.

Abstract: A random code generating method for the magnetoresistive random access memory is provided. Firstly, a first magnetoresistive random access memory cell and a second magnetoresistive random access memory cell are programmed into an anti-parallel state. Then, an initial value of a control current is set. Then, an enroll action is performed on the first and second magnetoresistive random access memory cells. If the first and second magnetoresistive random access memory cells fail to pass the verification action, the control current is increased by a current increment, and the step of setting the control current is performed again. If the first and second magnetoresistive random access memory cells pass the verification action, a one-bit random code is stored in the first magnetoresistive random access memory cell or the second magnetoresistive random access memory cell.

Abstract: An erasable programmable single-poly non-volatile memory cell and an associated array structure are provided. The memory cell comprises a select transistor and a floating gate transistor. The floating gate of the floating gate transistor and an assist gate region are collaboratively formed as a capacitor. The floating gate of the floating gate transistor and an erase gate region are collaboratively formed as another capacitor. Moreover, the select transistor, the floating gate transistor and the two capacitors are collaboratively formed as a four-terminal memory cell. Consequently, the size of the memory cell is small, and the memory cell is operated more easily.

Abstract: A non-volatile memory cell includes a first select transistor, a first floating gate transistor, a second floating gate transistor and a second select transistor. The first select transistor is connected with a program source line and a program word line. The first floating gate transistor includes a floating gate. The first floating gate transistor is connected with the first select transistor and a program bit line. The second floating gate transistor includes a floating gate. The second floating gate transistor is connected with a read source line. The second select transistor is connected with the second floating gate transistor, the read word line and the read bit line. The floating gate of the second floating gate transistor is connected with the floating gate of the first floating gate transistor.

Abstract: A fault-injection protection circuit includes a circuit under protection and a detection circuit. The detection circuit includes a detection cell having unequal pull-up capability and pull-down capability, and is arranged at a distance less than a laser spot diameter from the circuit under protection. The detection circuit is used to generate an alarm signal upon detecting a laser fault injection.

Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.

Abstract: A resistive memory device includes word lines, first memory cells, second memory cells, bit lines, source lines, and a driver. The driver provides a forming voltage to the first memory cells and the second memory cells through the bit lines and the source lines in a forming process. A first connection length along the bit lines and the source lines between the first memory cells and the driver is longer than a second connection length along the bit lines and the source lines between the second memory cells and the driver. The forming process is performed to the first memory cells before the forming process is performed to the second memory cells. A first value of the forming voltage provided to the first memory cells is less than a second value of the forming voltage provided to the second memory cells.

Abstract: A program control circuit for an antifuse-type one time programming memory cell array is provided. When the program action is performed, the program control circuit monitors the program current from the memory cell in real time and increases the program voltage at proper time. When the program control circuit judges that the program current generated by the memory cell is sufficient, the program control circuit confirms that the program action is completed.

Abstract: A selection circuit includes a main selection circuit and an auxiliary selection circuit. When a first voltage and a second voltage are different, the main selection circuit selects a higher one of the first voltage and the second voltage as an output voltage. When the first voltage and the second voltage are equal, the auxiliary selection circuit generates the output voltage according to the first voltage and the second voltage.

Abstract: A memory cell of a non-volatile memory includes a memory element. The memory element is a transistor. The memory element includes an asymmetric spacer. In the memory element, a channel under the wider part of the spacer is longer. When the program operation of the memory element is performed, more carriers are injected into a charge-trapping layer of the spacer through the longer channel. Consequently, the program operation of the memory element is performed more efficiently, and the time period of performing the program operation is reduced.

Abstract: A charge pump apparatus includes a first charge pump system, a second charge pump system, a switch transistor, and a voltage regulation circuit. The first charge pump system converts a first supply voltage into a first boost voltage. The second charge pump system converts a second supply voltage into a second boost voltage. The switch transistor is coupled to the first charge pump system and the second charge pump system, and outputs an output voltage according to the second boost voltage. The switch transistor includes a control terminal receiving the second boost voltage, a first terminal receiving the first boost voltage, and a second terminal outputting the output voltage. The voltage regulation circuit successively adjusts a code of a voltage regulation signal according to the output voltage, in order to control the second charge pump system to successively adjust the second boost voltage according to the voltage regulation signal.

Abstract: An erasable programmable single-poly non-volatile memory cell and an associated array structure are provided. In the memory cell of the array structure, the assist gate region is composed at least two plate capacitors. Especially, the assist gate region at least contains a poly/poly plate capacitor and a metal/poly plate capacitor. The structures and the fabricating processes of the plate capacitors are simple. In addition, the uses of the plate capacitors can effectively reduce the size of the memory cell.

Abstract: When a driving circuit of an anti-fuse memory device programs a selected anti-fuse memory cell, voltage differences between unselected bit lines and unselected anti-fuse control lines would be eliminated or decreased to an acceptable value by floating unselected anti-fuse control lines or by applying a second control line voltage to the unselected anti-fuse control lines. Leakage currents flowing from unselected bit lines through ruptured anti-fuse transistors of the anti-fuse memory device to the unselected anti-fuse control lines would be decreased or eliminated, and program disturbance would be avoided.

Abstract: A random bit generator includes a voltage source, a bit data cell, and a sensing control circuit. The voltage source provides a scan voltage during enroll operations. The data cell includes a first transistor and a second transistor. The first transistor has a first terminal coupled to a first bit line, a second terminal coupled to the voltage source, and a control terminal. The second transistor has a first terminal coupled to a second bit line, a second terminal coupled to the voltage source, and a control terminal. The sensing control circuit is coupled to the first bit line and the second bit line, and outputs a random bit data according to currents generated through the first transistor and the second transistor during an enroll operation of the bit data cell.

Abstract: A memory device includes a data memory array, a reference memory array and a detection circuit. The reference memory array includes (N/2+1) bit lines, (N/2) source lines and reference cells, N being a positive even integer. Each row of reference cells includes a (2n?1)th reference cell and a (2n)th reference cell. The (2n?1)th reference cell includes a first terminal coupled to an nth bit line, and a second terminal coupled to an nth source line, n being a positive integer less than N/2+1. The (2n)th reference cell includes a first terminal coupled to an (n+1)th bit line, and a second terminal coupled to the nth source line. The detection circuit compares a data current outputted from the data memory array and a reference current outputted from the reference memory array to determine a data state of a memory cell.

Abstract: A memory structure including a substrate, a gate structure, a charge storage layer, and a first control gate is provided. The substrate has a fin portion. A portion of the gate structure is disposed on the fin portion. The gate structure and the fin portion are electrically insulated from each other. The charge storage layer is coupled the gate structure. The charge storage layer and the gate structure are electrically insulated from each other. The first control gate is coupled to the charge storage layer. The first control gate and the charge storage layer are electrically insulated from each other.

Abstract: An antifuse-type one time programming memory cell includes a select device, a following device and an antifuse transistor. A first terminal of the select device is connected with a bit line. A second terminal of the select device is connected with a first node. A select terminal of the select device is connected with a word line. A first terminal of the following device is connected with the first node. A second terminal of the following device is connected with a second node. A control terminal of the following device is connected with a following control line. A first drain/source terminal of the antifuse transistor is connected with the second node. A gate terminal of the antifuse transistor is connected with an antifuse control line. A second drain/source terminal of the antifuse transistor is in a floating state.