Abstract: A memory cell array of a multi-time programmable non-volatile memory includes plural memory cells. The memory cell has the structure of 1T1C cell, 2T1C cell or 3T1C cell. Moreover, the floating gate transistors of the memory cells in different rows of the memory cell array are constructed in the same well region. Consequently, the chip size is reduced. Moreover, by providing proper bias voltages to the memory cell array, the program action, the erase action or the read action can be performed normally.

Abstract: When a driving circuit of an anti-fuse memory device programs a selected anti-fuse memory cell, voltage differences between unselected bit lines and unselected anti-fuse control lines would be eliminated or decreased to an acceptable value by floating unselected anti-fuse control lines or by applying a second control line voltage to the unselected anti-fuse control lines. Leakage currents flowing from unselected bit lines through ruptured anti-fuse transistors of the anti-fuse memory device to the unselected anti-fuse control lines would be decreased or eliminated, and program disturbance would be avoided.

Abstract: A memory device includes a data memory array, a reference memory array and a detection circuit. The reference memory array includes (N/2+1) bit lines, (N/2) source lines and reference cells, N being a positive even integer. Each row of reference cells includes a (2n?1)th reference cell and a (2n)th reference cell. The (2n?1)th reference cell includes a first terminal coupled to an nth bit line, and a second terminal coupled to an nth source line, n being a positive integer less than N/2+1. The (2n)th reference cell includes a first terminal coupled to an (n+1)th bit line, and a second terminal coupled to the nth source line. The detection circuit compares a data current outputted from the data memory array and a reference current outputted from the reference memory array to determine a data state of a memory cell.

Abstract: Provided is a memory device including a memory structure including a substrate, a channel region, first and second doped regions, a floating gate and a dielectric layer. The channel region is disposed on the substrate. The first and the second doped regions are disposed on the substrate and respectively located at two sides of the channel region. The floating gate is disposed on the channel region. The dielectric layer is disposed between the floating gate and the channel region, the first doped region and the second doped region. The floating gate and the first doped region are partially overlapped, and/or the floating gate and the second doped region are not overlapped and a sidewall of the floating gate adjacent to the second doped region and a boundary between the second doped region and the channel region are separated by a distance.

Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.

Abstract: An erasable programmable non-volatile memory includes a first-type well region, three doped regions, two gate structures, a blocking layer and an erase line. The first doped region is connected with a source line. The third doped region is connected with a bit line. The first gate structure is spanned over an area between the first doped region and the second doped region. A first polysilicon gate of the first gate structure is connected with a select gate line. The second gate structure is spanned over an area between the second doped region and the third doped region. The second gate structure includes a floating gate and the floating gate is covered by the blocking layer. The erase line is contacted with the blocking layer. The erase line is located above an edge or a corner of the floating gate.

Abstract: A sensing circuit includes a cell clock generator, a reference clock generator, a counter, a latching signal generator, a latch and a count-to-state conversion circuit. The cell clock generator receives a cell current from a selected memory cell, and converts the cell current into a cell clock signal. The reference clock generator converts a reference current into a reference clock signal. The count receives the cell clock signal, and generates a count value. When a pulse number of the reference clock signal reaches a predetermined count value, the latching signal generator activates a latching signal. When the latching signal is activated, the latch issues a latched count value. The count-to-state conversion circuit receives the latched count value, and issues a state value. A storage state of the selected memory cell is determined according to the state value.

Abstract: A write voltage generator is connected with a magnetoresistive random access memory. The write voltage generator provides a write voltage during a write operation. A storage state of a selected memory cell in a write path of the magnetoresistive random access memory is changed in response to the write voltage. The write voltage generator includes a temperature compensation circuit and a process corner compensation circuit. The temperature compensation circuit generates a transition voltage according to an ambient temperature. The transition voltage decreases with the increasing ambient temperature. The process corner compensation circuit receives the transition voltage and generates the write voltage.

Abstract: A method provided herein is adapted to a sense amplifier having a first cross-coupled latch and a second cross-coupled latch, each of which includes a first pair of transistors and a pair of coupling capacitors coupled to respective gate terminals of the first pair of transistors. The method includes, during a first phase, charging the pair of coupling capacitors of a first pair of transistors at a first cross-coupled latch to achieve zeroing and providing a first set of input voltages to a second cross-coupled latch, and, during a second phase following the first phase, discharging the pair of coupling capacitors to cancel a mismatch between the first pair of transistors and comparing the first set of input voltages provided to the second cross-coupled latch to generate a first set of output voltages.

Abstract: A random number generator includes a counting value generator, an address generator, a static entropy source and a processing circuit. The counting value generator generates a first random number. The address generator generates an address signal. The static entropy source is connected with the address generator to receive the address signal and generates a second random number. The processing circuit is connected with the static entropy source and the counting value generator to receive the first random number and the second random number. After the first random number and the second random number are processed by the processing circuit, the processing circuit generates an output random number.

Abstract: An erasable programmable non-volatile memory includes a first select transistor, a first floating gate transistor, a second select transistor and a second floating gate transistor. A select gate and a first source/drain terminal of the first select transistor receive a first select gate voltage and a first source line voltage, respectively. A first source/drain terminal and a second source/drain terminal of the first floating gate transistor are connected with a second source/drain terminal of the first select transistor and a first bit line voltage, respectively. A select gate and a first source/drain terminal of the second select transistor receive a second select gate voltage and a second source line voltage, respectively. A first source/drain terminal and a second source/drain terminal of the second floating gate transistor are connected with the second source/drain terminal of the second select transistor and a second bit line voltage, respectively.

Abstract: A memory structure including a substrate, a gate structure, a charge storage layer, and a first control gate is provided. The substrate has a fin portion. A portion of the gate structure is disposed on the fin portion. The gate structure and the fin portion are electrically insulated from each other. The charge storage layer is coupled the gate structure. The charge storage layer and the gate structure are electrically insulated from each other. The first control gate is coupled to the charge storage layer. The first control gate and the charge storage layer are electrically insulated from each other.

Abstract: A level shifter includes a self-initialization circuit. The self-initialization circuit judges whether the input signal and the inverted input signal received by the level shifter are invalid while a power supply voltage is powered up. If the self-initialization circuit confirms that the input signal and the inverted input signal received by the level shifter are invalid, the self-initialization circuit controls the level shifter to be maintained in a self-initializing power up state. Consequently, the output signal from the level shifter has the specified voltage level.

Abstract: A non-volatile memory includes a cell array, a current supply circuit, a path selecting circuit and a judging circuit. The cell array includes plural multi-level memory cells in an m×n array. The cell array is connected with m word lines and n lines. The current supply circuit provides one of plural reference currents according to a current control value. The path selecting circuit is connected with the current supply circuit and the n bit lines. The judging circuit is connected with the path selecting circuit, and generates n output data. A first path selector of the path selecting circuit is connected with a path selecting circuit and a first bit line. A first judging device of the judging circuit is connected with the first path selector and generates a first output data.

Abstract: A charge pump circuit includes a power switch, a first pull-low circuit, an output pull-low circuit, a first charge pump stage and an output charge pump stage. The power switch receives an enabling signal. The first pull-low circuit and the output pull-low circuit receive a pull-low signal. The first charge pump stage includes a first boost capacitor used to receive a first phase signal, a first transfer transistor, a first gate-control transistor and a first storage capacitor used to receive a second phase signal. The output charge pump stage includes an output boost capacitor used to receive a third phase signal, an output transfer transistor and an output gate-control transistor. The charge pump circuit generates voltages in an erasing operation, a program operation and a read operation according to the enabling signal, the pull-low signal, the first phase signal, the second phase signal and the third phase signal.

Abstract: A memory device includes a first well, a second well, a first active area, a second active area, a third active area, a first poly layer and a second poly layer. The first well is of a first conductivity type. The second well is of a second conductivity type different from the first conductivity type. The first active area is of the second conductivity type and is formed on the first well. The second active area is of the first conductivity type and is formed on the first well and between the first active area and the second well. The third active area is of the first conductivity type and is formed on the second well. The first poly layer is formed above the first well and the second well. The second poly layer is formed above the first well.

Abstract: A programming and verifying method for a multi-level memory cell array includes following steps. In a step (a1), a first row of the multi-level memory cell array is set as a selected row, and A is set as 1. In a step (a2), memory cells in the selected row excluding the memory cells in the target storage state and bad memory cells are programmed to the A-th storage state. In a step (a3), if A is not equal to X, 1 is added to X and the step (a2) is performed again. In a step (a4), if A is equal to X, the program cycle is ended. In the step (a2), the first-portion memory cells of the selected row are subjected to plural write actions and plural verification actions until all of the first-portion memory cells reach the A-th storage state.

Abstract: A non-volatile memory includes a substrate region, a barrier layer, an N-type well region, an isolation structure, a first gate structure, a first sidewall insulator, a first P-type doped region, a second P-type doped region and an N-type doped region. The isolation structure is arranged around the N-type well region and formed over the barrier layer. The N-type well region is surrounded by the isolation structure and the barrier layer. Consequently, the N-type well region is an isolation well region. The first gate structure is formed over a surface of the N-type well region. The first sidewall insulator is arranged around the first gate structure. The first P-type doped region, the second P-type doped region and the N-type doped region are formed under the surface of the N-type well region.

Abstract: A differential sensing device includes two reference cells, four path selectors, and four sample circuits. The first path selector is coupled to a first sensing node, the second reference cell, and a first memory cell. The second path selector is coupled to a second sensing node, the first reference cell, and the first memory cell. The third path selector is coupled to a third sensing node, the first reference cell, and a second memory cell. The fourth path selector is coupled to a fourth sensing node, the second reference cell, and the second memory cell. During a sample operation, the first sample circuit samples a first cell current, the second sample circuit samples the first reference current, the third sample circuit samples a second cell current, and the fourth sample circuit samples the second reference current.

Abstract: A non-volatile memory includes a cell array, a current supply circuit, a path selecting circuit and a verification circuit. The cell array includes plural multi-level memory cells in an m×n array. The cell array is connected with m word lines and n lines. Each of the plural multi-level memory cells is in one of X storage states. The current supply circuit provides plural reference currents. The path selecting circuit is connected with the current supply circuit and the n bit lines. The verification circuit is connected with the path selecting circuit, and generates n verification signals. A first path selector of the path selecting circuit is connected with a path selecting circuit and a first bit line. A first verification device of the verification circuit is connected with the first path selector and generates a first verification signal.