Abstract: The present disclosure relates to an electronic device that includes a first electronic component, a second electronic component, an interconnection structure below the first electronic component and the second electronic component and electrically connecting the first electronic component to the second electronic component, and a first waveguide below the first electronic component and the second electronic component and configured to transmit electromagnetic waves.

Abstract: A package structure is provided. The package structure includes a substrate, a first electronic component, a first electrical connector, and a protective layer. The first electronic component is over the substrate. The first electrical connector is between the substrate and the first electronic component. The protective layer encapsulates the first electrical connector. The protective layer has a first curved lateral surface concave toward the first electrical connector and recessed with respect to a lateral surface of the first electronic component.

Abstract: A reusable air filter and methods are provided for filtering air being conducted to an air intake of an internal combustion engine. The reusable air filter comprises a filter medium configured to pass an airstream and entrap particulates flowing within the airstream. The filter medium is comprised of cotton gauze disposed in a sinusoidal arrangement that provides a filtration surface area that is larger than a perimeter area of the filter medium. An end cap and base may be configured to retain the filter medium therebetween. The base provides an interface between the air filter and an air inlet of the engine. The filter medium may be disposed in a flat, panel shape that is bordered by a supportive tray. Support rods may be embedded within the tray to prevent bowing of the tray due to air pressure when coupled with an air box of the engine.

Abstract: An apparatus for charging electric vehicles is provided. The apparatus includes a housing, a sleeve extending from the housing, a first nozzle assembly designed to move inside the sleeve and to engage a charging port of an electric vehicle, and a second nozzle assembly designed to move inside the sleeve independently of the first nozzle assembly. The second nozzle assembly has a recess for receiving a locking pawl of the charging port. The second nozzle assembly is designed to be fully inserted into the charging port before the first nozzle assembly is fully inserted into the charging port. The recess receives the locking pawl after the ground pin engages the inlet ground pin. The first nozzle assembly is designed to be fully inserted into the charging port after the locking pawl is secured inside the recess of the second nozzle assembly.

Abstract: A wearable device is provided. The wearable device includes an electronic component and an encapsulant. The encapsulant includes a low-penetrability region encapsulating the electronic component and a high-penetrability region physically separated from the electronic component.

Abstract: An electronic device is disclosed. The electronic device includes a unit chip. The unit chip includes an electronic component having a power delivery circuit and a reinforcement supporting the electronic component. The reinforcement is configured to transmit a power signal to the power delivery circuit. The reinforcement includes a thermosetting reinforcement or a glass reinforcement.

Abstract: An electronic device is provided. The electronic device includes a first circuit structure, a second circuit structure, a conductive layer, and a supporting structure. The conductive layer is disposed between the first circuit structure and the second circuit structure.

Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.

Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.

Abstract: An electronic carburetor injection system is provided for an internal combustion engine. The electronic carburetor injection system is a standalone, user programmable fuel injection system that delivers additional fuel to the engine whenever a lean fuel/air mixture is delivered by a carburetor. The electronic carburetor injection system includes a fuel injector that delivers liquid fuel in the form of a spray discharge. A plate supports the fuel injector between the carburetor and an intake manifold of the engine. The plate includes an injector port that allows the spray discharge to enter the intake manifold without interfering with operating the carburetor. An engine control unit operates the fuel injector according to signals received from an oxygen sensor that is disposed within an exhaust system of the engine. During operation, the electronic carburetor injection system maintains the fuel/air mixture within a proper range across multiple driving conditions and changing environmental conditions.

Abstract: A semiconductor package structure includes a circuit pattern structure, an encapsulant and an anchoring structure. The encapsulant is disposed on the circuit pattern structure. The anchoring structure is disposed adjacent to an interface between the encapsulant and the circuit pattern structure, and is configured to reduce a difference between a variation of expansion of the encapsulant and a variation of expansion of the circuit pattern structure in an environment of temperature variation.

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

Abstract: An apparatus and a method are provided for a heating, ventilation, and air conditioning (HVAC) system air filter for a building ventilation system. The HVAC system air filter comprises a supportive frame configured to orient the HVAC system air filter within the building ventilation system. A composite filter medium retained within the supportive frame comprises a cotton gauze portion and an electrostatic portion. The cotton gauze portion is configured for treatment with a filter oil composition to enhance airflow and filtration of air flowing through the composite filter medium. The electrostatic portion is configured to electrostatically attract and agglomerate airborne molecular contaminants and volatile organic compounds (VOCs) as small as 0.001 microns in diameter. In some embodiments, the composite filter medium comprises substances configured to release a fragrance into air passing through the composite filter medium.

Abstract: A thermal printer includes a housing, a head cover, and a locking mechanism, wherein the locking mechanism includes a lever member and a lock member which are configured so that i) as an operation part is pressed down, the lock member rotates in a direction to move a claw away from the lock pin, and a lock is released by the claw being disengaged from the lock pin and ii) as the operation part of the lever member is pulled up, a portion of the lever member presses the lock member, whereby the lock member rotates in a direction to move the claw away from the lock pin, and the lock is released by the claw being disengaged from the lock pin.

Abstract: Excellent adhesive strength can be maintained to improve product reliability, even after storage under high humidity, by a curing agent (B) for an epoxy resin, the curing agent (B) containing a reactive terminated polydiene (B1), a reactive polyamine (B2), and an amidine (B3).

Abstract: A package structure is provided. The package structure includes a substrate, a sensing device, a light transmissive member, and a bonding structure. The sensing device is over the substrate, and the light transmissive member is over the sensing device. The bonding structure has an upper surface connected to the light transmissive member and a lower surface connected to the sensing device. A width of the upper surface is less than a width of the lower surface of the bonding structure.

Abstract: A package structure is provided. The package structure includes a substrate, a first electronic component, an interposer, a conductive wire, and a conductive adhesive. The first electronic component and the interposer are disposed over the substrate. The conductive wire connects the first electronic component to the interposer. The conductive adhesive (connects the interposer to the substrate.