Patents Assigned to ENGINEER INC.
  • Patent number: 12185441
    Abstract: An example of an apparatus is provided. The apparatus includes a power sensor to measure a power used to emit light. In addition, the apparatus includes a light source controller to control a light source to change an intensity of the light emitted by the light source. Furthermore, the apparatus includes a boundary detector to detect a room boundary. The apparatus also includes a device sensor to determine a position of a proximate device. The apparatus further includes a communications interface to communicate with the proximate device to transmit measured data to the proximate device and to receive device data from the proximate device. Also, the apparatus includes a processor to calculate a lighting power density based on the proximate device data and the measured data. The lighting power density is to be used by the light source controller to adjust the power used to emit the light.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: December 31, 2024
    Assignee: JDRF Electromag Engineering Inc.
    Inventor: Roumanos Dableh
  • Patent number: 12180916
    Abstract: An apparatus may comprise a base member being defined by a rectangular aperture configured to receive and engage an automobile intake box, the base member being further defined by a perimeter surrounding the rectangular aperture and having at least one fastener or aperture configured to receive a fastener dimensioned to avoid disturbing the automobile intake box; a gooseneck member fixedly attached to the base member, the gooseneck member having a first end opening and a second end opening, the gooseneck member having an interior cavity configured to direct air into the automobile intake box from the second end opening to the first end opening through the interior cavity; and an interchangeable bell housing removably secured to the second end opening of the gooseneck member, the interchangeable bell housing having a frustoconical shaped cross section on at least one plane.
    Type: Grant
    Filed: February 9, 2020
    Date of Patent: December 31, 2024
    Assignee: Velossa Tech Engineering Inc.
    Inventor: Dan Joseph Becker
  • Publication number: 20240429213
    Abstract: An electronic device is provided. The electronic device includes a package structure and a power regulating element. The package structure includes an electronic component, a plurality of first conductive structures, and an encapsulant. The plurality of first conductive structures are connected to the electronic component. The encapsulant encapsulates the electronic component and exposes a portion of the plurality of first conductive structures. The power regulating component includes a plurality of second conductive structures directly bonded with the plurality of first conductive structures and configured to provide the electronic component with a power signal.
    Type: Application
    Filed: June 20, 2023
    Publication date: December 26, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Syu-Tang LIU, Pao-Nan LEE, Yu-Hsun CHANG, Jung Jui KANG
  • Publication number: 20240427092
    Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.
    Type: Application
    Filed: September 10, 2024
    Publication date: December 26, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Chieh TANG, Lu-Ming LAI, Yu-Che HUANG, Ying-Chung CHEN
  • Publication number: 20240429115
    Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.
    Type: Application
    Filed: September 10, 2024
    Publication date: December 26, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi CHEN, Chang-Lin YEH, Jen-Chieh KAO
  • Publication number: 20240421086
    Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a second electronic component, and a circuit structure. The circuit structure is supported by the first electronic component and the second electronic component. The circuit structure electrically connects the first electronic component to the second electronic component and is configured to provide the first electronic component and the second electronic component with a power.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 19, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Nan LEE, Syu-Tang LIU, Yu-Hsun CHANG
  • Publication number: 20240418111
    Abstract: A sound attenuating engine exhaust system and methods are provided for directing exhaust gases away from an internal combustion engine of a vehicle and attenuating undesirable exhaust sounds during engine operation. The sound attenuating engine exhaust system comprises an exhaust inlet configured to receive exhaust gases from the internal combustion engine. A first resonator coupled with the exhaust inlet is configured to dampen at least one frequency of exhaust sound waves by way of destructive wave interference. The first resonator includes an exhaust outlet for directing the exhaust gases out of the first resonator. A second resonator is coupled with the first resonator and configured to dampen one or more frequencies of exhaust sound waves by way of a combination of destructive wave interference and Helmholtz resonance. Hangers facilitate attaching the sound attenuating engine exhaust system to an undercarriage of the vehicle.
    Type: Application
    Filed: August 26, 2024
    Publication date: December 19, 2024
    Applicant: K&N Engineering, Inc.
    Inventors: Steve E. Williams, Kevin McClelland
  • Publication number: 20240421103
    Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.
    Type: Application
    Filed: August 27, 2024
    Publication date: December 19, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia Hsiu HUANG, Chun Chen CHEN, Wei Chih CHO, Shao-Lun YANG
  • Publication number: 20240413061
    Abstract: A package structure is provided. The package structure includes a substrate, a wiring structure, and a wire bundle structure. The wiring structure is over the substrate. The wire bundle structure is between the wiring structure and the substrate. The wire bundle structure includes a first wire bundle extending from the substrate and a second wire bundle extending from the wiring structure and contacting the first nanowire bundle. The wire bundle structure is configured to reduce a variation in a distance of a gap between the substrate and the wiring structure.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: An-Hsuan HSU, Cheng-Yuan KUNG, Yaohsin CHOU
  • Publication number: 20240413062
    Abstract: A package structure is provided. The package structure includes a wiring structure, a first element, and a plurality of first wires. The wiring structure has a first recess recessed from a first surface of the wiring structure. The first element is disposed over the first surface of the wiring structure. The first wires are disposed in the first recess and extending in a direction from the wiring structure to the first element. The first wires are configured to reduce an inclination of the first element with respect to the first surface of the wiring structure.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Jen-Hao PAN
  • Publication number: 20240411096
    Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component and an optical interposer. The optical interposer includes a plurality of optical paths and optically coupled to the first photonic component. The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU, Sin-Yuan MU
  • Publication number: 20240413115
    Abstract: A package structure is provided. The package structure includes an electronic component, an encapsulant, a first conductive pillar, a first dielectric layer. The electronic component has an active surface. The encapsulant encapsulates the electronic component and exposes the active surface of the electronic component. The first conductive pillar is over the active surface of the electronic component, wherein an upper surface of the first conductive pillar includes a concave portion. The first dielectric layer is over the encapsulant and the active surface of the electronic component, wherein the first dielectric layer defines an opening exposing the concave portion of the first conductive pillar.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Ling YEH, Yuan-Feng CHIANG, Chung-Hung LAI, Chin-Li KAO
  • Publication number: 20240395784
    Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible carrier, an electronic component disposed over the flexible carrier, and a first flexible connection element configured to connect the flexible carrier and the electronic component. The first flexible connection element is configured to extend along a deformation direction of the electronic device. An interconnection structure is also provided.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 28, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuei-Hao TSENG, Kai Hung WANG, Chih Lung LIN
  • Publication number: 20240390832
    Abstract: An apparatus and methods are provided for a filtered cap air filter configured to be coupled with an air intake system of an internal combustion engine. The filtered cap air filter comprises a filter medium that is retained between a base and a filtered cap. The filter medium and the filtered cap are fabricated to remove contaminants and particulate matter from an intake airstream. In some embodiments, the filter medium and filtered cap may be configured to be treated with a filter oil composition to enhance air cleaning properties of the filter media. Wire supports may be incorporated into the filter medium and filtered cap to provide additional strength and durability to the filtered cap air filter. The base includes a flange and an opening that form an airtight connection between the filtered cap air filter and an air intake duct of the air intake system.
    Type: Application
    Filed: April 3, 2024
    Publication date: November 28, 2024
    Applicant: K&N Engineering, Inc.
    Inventor: Jere James Wall
  • Patent number: 12155344
    Abstract: Systems and methods for providing and controlling solar panel arrays are provided. The solar panel array may include one or more articulating joints that may provide variability in the arrangement of solar panels, which may allow the solar panel array to be distributed over varying types of underlying surfaces. The articulating joints may allow orientations of solar panels to be different relative to one another. The articulating joints may convey rotational force across the joints, so that a rotational force used to drive a first solar panel may also be conveyed across the joint and used to drive a second solar panel. The controls system may include row-specific semi-autonomous, or autonomous, controllers as well as controllers to interface with multiple rows. The controllers may include sensors to measure system power generation and basic operations aspects of the solar field to directly measure, or infer, module shading within the solar field.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: November 26, 2024
    Assignee: Nevados Engineering, Inc.
    Inventors: Yezin Taha, Norman Xiao
  • Patent number: 12152556
    Abstract: An apparatus and a method are provided for an air filter configured to be mounted onto air inlets of turbochargers and superchargers. The air filter a proximal base including an inlet receiver configured to receive an air inlet, a clamp to secure the air inlet within the inlet receiver, and a first opening aligned with a screw mechanism of the clamp. A filter medium fastened to the proximal base is configured to remove particulate matter and other contaminates from an incoming air stream. A distal end cap fastened to the filter medium comprises a second opening aligned with the first opening. A conduit within an interior cavity of the air filter is disposed between the first opening and the second opening, facilitating tightening and loosening the clamp by extending an appropriate tool through the interior cavity so as to engage the screw mechanism of the clamp.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: November 26, 2024
    Assignee: K&N Engineering, Inc.
    Inventor: Steve Williams
  • Patent number: 12147871
    Abstract: A pleat counter and methods are provided to accurately count the number of pleats in a corrugated sheet of material to be used for the production of air filters. The pleat counter comprises a pleat detector mounted underneath a mounting board for counting the pleats. The mounting board is configured to position the pleat detector adjacent to the corrugated sheet of filter material. The pleat detector includes one or more sensors configured to detect the presence of individual pleats comprising the corrugated sheet. The pleat counter includes an interface configured to enable coupling the pleat counter with a data processing system. The data processing system may comprise any of a desktop, a tablet, a server, a mobile phone, a media player, a personal digital assistant (PDA), a personal communicator, a network router or hub, a wireless access point (AP) or repeater, a set-top box, or a combination thereof.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: November 19, 2024
    Assignee: K&N Engineering, Inc.
    Inventor: Steve Williams
  • Publication number: 20240375911
    Abstract: An apparatus and method for controlling a hydraulic elevator system involves setting a baseline slowdown distance based on initial tuning, establishing a target leveling time in 0.1-second intervals, monitoring elevator operations to capture high speed, transition distance, leveling speed, leveling distance data, and adjusting the reference slowdown distance to align actual leveling times with the target time. A logarithmic averaging method is employed to calculate the reference slowdown distance, ensuring consistent elevator performance by smoothing out data variations.
    Type: Application
    Filed: May 11, 2024
    Publication date: November 14, 2024
    Applicant: Smartrise Engineering, Inc.
    Inventors: Gilbert Zogbi, Thomas Hanger
  • Publication number: 20240377235
    Abstract: There is provided a method of estimating flowrate in a pipeline based on acoustic behaviour of the pipe. First acoustic data is measured from the pipeline. A flowrate of the fluid in the pipeline is then estimated. The estimation is based on the first acoustic data and based on a correlation established between second acoustic data and corresponding flowrate data from an experimental pipeline. The correlation is established by a machine learning process (which may include the use of an artificial neural network, such as an autoencoder). The second acoustic data and corresponding flowrate data are used as inputs to the machine learning process.
    Type: Application
    Filed: July 24, 2024
    Publication date: November 14, 2024
    Applicant: Hifi Engineering Inc.
    Inventors: Seyed Ehsan Jalilian, Dongliang Huang, Henry Leung, King Fai Ma
  • Patent number: D1055673
    Type: Grant
    Filed: August 13, 2024
    Date of Patent: December 31, 2024
    Assignee: S.W. Engineering Inc.
    Inventor: Stephen W. Warter