Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: A method for manufacturing a package structure is provided. The method includes providing a package structure including a first region and a second region different from the first region, wherein the package structure comprises a package substrate having an active surface and a backside surface; and irradiating the package structure by a first light beam along a first direction from the active surface toward the backside surface, wherein the first light beam only irradiates the first region without irradiating the second region.

Abstract: A combined mass airflow sensor and hydrocarbon trap is provided for absorbing evaporative hydrocarbon emissions from an air intake duct of an internal combustion engine. The combined mass airflow sensor and hydrocarbon trap comprises a duct that supports a hydrocarbon absorbing sheet in an unfolded configuration within a housing. The duct communicates an airstream from an air filter to the air intake duct during operation of the internal combustion engine. An opening in the housing receives a mass airflow sensor into the duct, such that the mass airflow sensor is disposed within the airstream. Guide vanes extending across the duct reduce air turbulence within the airstream passing by the mass airflow sensor. Ports disposed along the duct allow the evaporative hydrocarbon emissions to be drawn into the interior and arrested by the hydrocarbon absorbing sheet when the internal combustion engine is not operating.

Abstract: A package structure includes a wiring structure, a first electronic device and a reinforcement structure. The first electronic device is disposed over the top surface of the wiring structure, and has a bottom surface facing the top surface of the wiring structure. The first electronic device includes a plurality of first wires. The reinforcement structure is disposed over the top surface of the wiring structure, and includes a plurality of second wires directly contacting the plurality of first wires to reduce a variation of an elevation of the bottom surface of the first electronic device with respect to the top surface of the wiring structure.

Abstract: A method and equipment for manufacturing a package structure are disclosed. The equipment includes a first space, a de-bonding apparatus, a second space and a fluid supply device. The de-bonding apparatus is disposed in the first space, and configured to perform a de-bonding process. The second space is disposed around the first space. The fluid supply device is configured to make a first humidity of an atmosphere in the first space greater than a second humidity of an atmosphere in the second space.

Abstract: An apparatus and a method are provided for an air filter configured to be mounted onto air inlets of turbochargers and superchargers. The air filter comprises a proximal base including an inlet receiver configured to receive an air inlet, a clamp to secure the air inlet within the inlet receiver, and a first opening aligned with a screw mechanism of the clamp. A filter medium fastened to the proximal base is configured to remove particulate matter and other contaminates from an incoming air stream. A distal end cap fastened to the filter medium comprises a second opening aligned with the first opening. A conduit within an interior cavity of the air filter is disposed between the first opening and the second opening, facilitating tightening and loosening the clamp by extending an appropriate tool through the interior cavity so as to engage the screw mechanism of the clamp.

Abstract: The present invention provides an adhesive composition which is a primerless urethane-based adhesive and has high adhesive force with respect to a polyolefin-based resin. An adhesive composition according to the present invention is a two-liquid type urethane-based adhesive composition comprising: a main agent which comprises (A) a urethane prepolymer having an isocyanate group at the end thereof, (B) a polyfunctional isocyanate compound having an alkoxysilyl group which can be obtained through a reaction of a silane compound having at least two alkoxysilyl groups in one molecule and a polyisocyanate having an isocyanate group at the end thereof and (C1) a first curing catalyst; and a curing agent which comprises (D) a hydrophobic polyol and (C2) a second curing catalyst.

Abstract: Support assemblies are described herein for use with heat exchanges, wherein the assemblies are deflector and grid support assemblies having a grid support structure formed of a series of interconnected strips and having a peripheral exterior configured to be positioned within an interior surface of a heat exchanger such that the grid support structure substantially extends across a transverse cross-section of the interior of a the tube heat exchanger, wherein the grid support has a first grid support surface and an opposite second grid support surface longitudinally spaced from the first grid surface, the grid support structure defines a plurality of passageways extending therethrough from the first to the second grid support surface, the passageways being configured to support longitudinally extending tubes of a heat exchanger passing substantially perpendicularly to the first grid support surface through the passageways from the first grid surface to the second grid surface without substantially obstructin

Abstract: A package structure and a method for manufacturing the same are provided. The package structure includes an electronic device, a heat spreader, an intermediate layer and an encapsulant. The electronic device includes a plurality of electrical contacts. The intermediate layer is interposed between the electronic device and the heat spreader. The intermediate layer includes a sintered material. The encapsulant encapsulates the electronic device. A surface of the encapsulant is substantially coplanar with a plurality of surfaces of the electrical contacts.

Abstract: An apparatus and a method are provided for a modular intercooler block that may be fabricated by way of direct metal printing and assembled to form larger intercoolers. The modular intercooler block comprises cooling fins that are spaced between first and second core headers to allow passage of an airstream. Countersunk holes are arranged on the first and second core headers and configured to receive grommets when the first or second core header is fastened to another core header comprising similarly arranged countersunk holes. A core tube extends along an undulating path from each countersunk hole in the first core header, through the multiplicity of cooling fins, to a similar countersunk hole in the second core header. The core tubes may include thin copper walls and spiraled inner passages to enhance heat transfer to the airstream passing through the multiplicity of cooling fins.

Abstract: The present invention pertains to an advanced traction control system designed to enhance the performance of traction elevators. This system integrates multiple components and a novel S-curve algorithm to optimize acceleration and deceleration profiles, ensuring smooth transitions and improved ride quality. Key components include a central controller, motor room board, hall panel controllers, and a car panel controller. The system supports high-speed applications, accommodating speeds up to 1400 feet per minute. The S-curve routine is divided into acceleration, constant speed, and deceleration phases, with digital speed commands transmitted via a serial communication link to the motor drive every 10 milliseconds. This precise control reduces mechanical wear and enhances passenger comfort. The system can adapt to various speed profiles, including normal, short, inspection, and emergency power modes, ensuring optimal performance under different conditions.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.

Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.

Abstract: A system and methods for a turbo-boost control system are disclosed for providing a driver of a vehicle with greater control over vehicle performance. The turbo-boost control system instructs an electronic control unit of the vehicle to increase the manifold pressure to a higher level before releasing the pressure through a waste gate so as to provide a greater power output of the engine. The turbo-boost control system includes a control module, a wiring harness, and a signal adjuster. The wiring harness couples the control module with a turbo inlet pressure sensor, a manifold absolute pressure sensor, and an electronic control unit of the vehicle. The control module sends signals to the electronic control unit based on input readings from the turbo inlet pressure sensor and the manifold absolute pressure sensor. The signal adjuster includes a rheostat that enables manual adjustment of the power output of the engine.

Abstract: A pleat counter and methods are provided to accurately count the number of pleats in a corrugated sheet of material to be used for the production of air filters. The pleat counter comprises a pleat detector mounted underneath a mounting board for counting the pleats. The mounting board is configured to position the pleat detector adjacent to the corrugated sheet of filter material. The pleat detector includes one or more sensors configured to detect the presence of individual pleats comprising the corrugated sheet. The pleat counter includes an interface configured to enable coupling the pleat counter with a data processing system. The data processing system may comprise any of a desktop, a tablet, a server, a mobile phone, a media player, a personal digital assistant (PDA), a personal communicator, a network router or hub, a wireless access point (AP) or repeater, a set-top box, or a combination thereof.

Abstract: The chips in coolant having passed through a first bath 202A and a second bath 202B are attracted to a permanent magnets 307B of an endless chain 302B and discharged into a chip box 308. Magnetic force of a permanent magnets 307A of an endless chain 302A is set to be stronger than magnetic force of the permanent magnets 307B of the endless chain 302B. Consequently, fine chips in coolant passing through a third bath 202C and a fourth bath 202D can be attracted to the permanent magnets 307A of the endless chain 302A and discharged into the chip box 308. Further, when coolant having passed through the fourth bath 202D flows into a sub-coolant tank 105, a coolant pump 107 feeds the coolant within the sub-coolant tank 105 to a magnetic inline filter 10 so as to further filtering the coolant.

Abstract: An electronic device includes an encapsulant, an optical emitter, and an optical sensor. The optical sensor is encapsulated by the encapsulant. The optical emitter is supported by the encapsulant.