Abstract: The present disclosure provides an electronic device. The electronic device includes a circuit structure, an interconnection structure disposed over the circuit structure, and an antenna element disposed over the interconnection structure. The antenna element defines a first recess having a sidewall, and the sidewall of the first recess of the antenna element is configured to feed a signal to the antenna element and is electrically connected to the interconnection structure.

Abstract: A gas dispensing canopy positionable over open parisons in a Blow/Fill/Seal machine prior to container forming, filling and sealing minimizes likelihood of particulate contamination of open parisons while the open parisons are transported to a container forming, filling and sealing station.

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

Abstract: The device includes a first portion which has a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The embodiment also includes a second portion which has a leading edge and a trailing edge, the leading edge of the second portion is removably attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The device also includes an extension portion and opposing side portions, the opposing side portions extend the length of and contact the second portion and extension portion. The opposing side portions include at least one light which is controlled by a sensor adjacent to a door.

Abstract: A bond structure is provided. The bond structure includes a seed layer and a conductive structure. The conductive structure includes a via portion over the seed layer and a plurality of wires protruding from the via portion.

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: An electronic device is disclosed. The electronic device includes an electronic component, an input/output (I/O) signal delivery circuit, and a power delivery circuit. The electronic component has a first surface and a second surface opposite to the first surface. The I/O signal delivery circuit is disposed under the first surface of the electronic component. The power delivery circuit is disposed over the second surface of the electronic component and configured to balance a warpage of the electronic device.

Abstract: A bonding structure and a package structure are provided. The bonding structure includes a first pad and a plurality of first wires. The first pad has a top surface including a first region and a second region, wherein the second region is closer to an edge of the top surface of the first pad than the first region is. The first wires are on the top surface of the first pad, wherein a number of the first wires on the first region is greater than a number of the first wires on the second region.

Abstract: A system uses a storage efficient data representation to route mechanical, electrical, or plumbing (MEP) objects of variable cross-sectional area through a bounded three-dimensional space containing obstructions of varying size and complexity. The system uses the triangular representations of the surfaces of the space in which the systems are to be routed. The system creates a computationally efficient 3D model that accurately represents the physical constraints of the space to be traversed and ensures that the routes are built within the constraints of the physical possibility requirements with no conflicts between different types of the MEP objects being routed.

Abstract: A throttle-controlled intake system is disclosed that provides a driver of a vehicle with greater control over engine functions and vehicle performance. The throttle-controlled intake system includes a control module that is coupled with an aircharger air intake. The control module processes input signals from a throttle pedal of the vehicle and sends modified throttle position signals to a throttle body of the vehicle so as to increase throttle responsiveness of the vehicle. The throttle-controlled intake system further includes a wiring harness and a signal adjuster. The wiring harness electrically couples the control module with the throttle pedal and the throttle body. The control module sends signals directly to the throttle body of the engine, bypassing an electronic control unit of the vehicle. The signal adjuster includes a rheostat that enables manual adjustment of the throttle responsiveness of the vehicle.

Abstract: An electronic device is provided. The electronic device includes a first electronic component, a plurality of second electronic components, and a plurality of conductive elements. The plurality of second electronic components are disposed under the first electronic component. The plurality of conductive elements electrically connect the first electronic component to the plurality of second electronic components. The plurality of conductive elements are free from vertically overlapping the plurality of second electronic components.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.

Abstract: The present disclosure provides an electronic device, which includes a circuit structure, a processing component, a first storage unit, and a second storage unit. The processing component is disposed over the circuit structure. The first storage unit is supported by the circuit structure, and electrically connected to the processing component. The second storage unit is disposed under the circuit structure and electrically connected to the processing component via the circuit structure.

Abstract: A captive leadscrew-type linear actuator assembly has a motor whose rotor has a rearward extending hollow bore shaft. An external nut assembly fixed to the bore shaft to rotate with rotor engages a lead screw. An anti-rotation radial support plate attaches to a front of the motor with a non-circular hole that prevents rotation of a rod or piston attached to the lead screw. Accordingly, torque applied by the rotor through the nut to the lead screw is converted into linear motion wherein the rod or piston passes through the hole. Replaceable external components lead to greater design flexibility together with improved motion accuracy and durability.

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

Abstract: A system and method for detecting dynamic strain of a housing. The system includes an optical fiber linearly affixed along a surface of a length of the housing and an interrogator comprising a laser source and a photodetector. The optical fiber comprises at least one pair of fiber Bragg gratings (FBGs) tuned to reflect substantially identical wavelengths with a segment of the optical fiber extending between the FBGs. The segment of the optical fiber is linearly affixed along the surface of the housing. The interrogator is configured to perform interferometry by shining laser light along the optical fiber and detecting light reflected by the FBGs. The interrogator outputs dynamic strain measurements based on interferometry performed on the reflected light.

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

Abstract: A curable composition used to produce a polyurethane foam comprises an isocyanate group-containing urethane pre-polymer (I) having an oxyalkylene ether skeleton and no siloxane skeleton, and an isocyanate group-containing urethane pre-polymer (II) having a siloxane skeleton and an oxyalkylene ether skeleton.

Abstract: A gas shield positionable over open parisons in a Blow/Fill/Seal machine prior to container forming, filling and sealing minimizes likelihood of particulate contamination of open parisons while the open parisons are transported to a container forming, filling and sealing station.

Abstract: An apparatus and methods are provided for a magnetic cover for an air filtration system for an internal combustion engine. The air filtration system includes a housing that has an interior that receives an air filter. A mount portion comprising the housing supports the air filter. The magnetic cover encloses the interior of the housing. An edge portion surrounding an opening in the housing forms an airtight connection with an edge portion of the magnetic cover. The edge portion of the housing includes a number of magnets that attach to a similar number of magnets in the edge portion of the magnetic cover to establish the airtight connection. A seal provides an airtight connection between the housing and the magnetic cover. The housing and the magnetic cover are configured for hand removal of the magnetic cover from the housing.