Patents Assigned to ENGINEER INC.
  • ELECTRONIC DEVICE
    Publication number: 20240357751
    Abstract: An electronic device is disclosed. The electronic device includes a first circuit structure, a second circuit structure having a surface facing the first circuit structure, and a first electronic component disposed over the first circuit structure and supporting the second circuit structure. The electronic device also includes a second electronic component disposed adjacent to the second circuit structure and having a top surface at an elevation higher than the surface of the second circuit structure with respect to the first circuit structure.
    Type: Application
    Filed: April 21, 2023
    Publication date: October 24, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsin-Yu CHEN, Huei-Shyong CHO, Shih-Wen LU
  • OPTICAL DEVICE
    Publication number: 20240345337
    Abstract: An optical device is provided. The optical device includes a first photonic component and a second photonic component. The first photonic component is configured to communicate with the second photonic component through a first optical path or an electrical path depending on a distance between the first photonic component and the second photonic component.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tai-Hsiang LIU, Hung-Yi LIN, Wen Chieh YANG
  • PACKAGE DEVICE
    Publication number: 20240345341
    Abstract: A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung Jui KANG, Shih-Yuan SUN, Chiu-Wen LEE, Chang Chi LEE, Chun-Yen TING, Hung-Chun KUO
  • ELECTRONIC DEVICE
    Publication number: 20240345343
    Abstract: An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
  • ANTENNA PACKAGE STRUCTURE
    Publication number: 20240347921
    Abstract: The present disclosure provides an antenna package structure, which includes antenna and a transmitting structure. The transmitting structure includes a first dielectric material and a second dielectric material of different dielectric constants, and a frequency selective surface unit. The first dielectric layer and the second dielectric layer are configured to focus the electromagnetic wave radiated between the antenna and the frequency selective surface unit.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
  • ANTENNA PACKAGE STRUCTURE
    Publication number: 20240347909
    Abstract: The present disclosure provides an antenna package structure, including a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a plurality of first patterns and a plurality of second patterns geometrically distinct from the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are configured to enhance gain and directivity of the first antenna.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
  • OPTOELECTRONIC PACKAGE
    Publication number: 20240345315
    Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
  • Loading Dock with Integrated Leveler
    Publication number: 20240336447
    Abstract: A modular loading dock with a mobile base includes an adjustable front section with front opposing adjustable leg members and middle opposing adjustable leg members, two adjustable feet connect each front leg member to a middle leg member, as well as an adjustable back section connected to the adjustable front section and including opposing rear adjustable leg members each having a grade plate. The mobile base has top and bottom surfaces, the top surface has an opening to receive a dock leveler into such opening, the dock leveler includes a lower end and an upper end, the upper end abuts a preexisting structure and the lower end has a lower edge having a lip, the lip being able to be activated between an extended/engaged position to contact a truck bed and a retracted/disengaged position.
    Type: Application
    Filed: April 4, 2023
    Publication date: October 10, 2024
    Applicant: Leum Engineering, Inc. d/b/a Dockzilla Co.
    Inventors: Grant Leum, Eric Demerath
  • ELECTRONIC DEVICE
    Publication number: 20240339383
    Abstract: An electronic device and a method of manufacturing an electronic device are provided. The electronic device includes an electronic component, a carrier, and a lead. The electronic component has a lateral surface. The carrier supports the electronic component. The lead is electrically connected to the electronic component and disposed adjacent to the lateral surface of the electronic component. The carrier and the lead are configured to block an electromagnetic wave between the electronic component and an external of the electronic device.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 10, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ko-Pu WU, Chih-Hung HSU, Chin Li HUANG, Chieh-Yin LIN, Yuan-Chun CHEN, Kai-Sheng PAI
  • OPTICAL PACKAGE
    Publication number: 20240329387
    Abstract: An optical package is provided. The optical package includes a first optical device and an optical guiding structure. The first optical device is disposed over a carrier. The optical guiding structure is disposed over the carrier and configured to adjust a first optical transmission path of the first optical device.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Chi-Han CHEN, Jr-Wei LIN, Pei-Jung YANG
  • PACKAGE STRUCTURE
    Publication number: 20240332192
    Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-I WU, Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
  • SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240329344
    Abstract: Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN, Chang Chi LEE, Hung-Chun KUO, Chun-Yen TING
  • PACKAGE DEVICE AND ELECTRONIC DEVICE
    Publication number: 20240329300
    Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-I WU, Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
  • PACKAGE STRUCTURE
    Publication number: 20240334586
    Abstract: A package structure is provided. The package structure includes an electronic component, a heat dissipating element, a thermal interfacing unit, and a confining structure. The electronic component has an upper surface. The heat dissipating element is over the upper surface of the electronic component. The thermal interfacing unit is between the upper surface of the electronic component and the heat dissipating element. The thermal interfacing unit includes a thermal interfacing material (TIM). The TIM is attached to the confining structure by capillary force.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: An-Hsuan HSU, Hung-Hsien HUANG, Chin-Li KAO
  • BIOGAS HALOGEN PROCESSING SYSTEMS AND METHODS
    Publication number: 20240325973
    Abstract: A method to produce a halogen-depleted gas is described. The method providing a gas derived from and/or including a source of biogas, mixing said gas with a source of hydrogen to produce a processed gas mixture including an acid, and separating said acid from said processed gas mixture. Sulfur, oxygen, carbon dioxide removal processes are integrated into the method. Production of secondary products, and removal thereof, are included. Pre and post processing may be integrated, and production of products is described.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Applicant: Stearns, Conrad and Schmidt, Consulting Engineers, Inc.
    Inventor: Jeffrey GRILL
  • OPTICAL DEVICE PACKAGE
    Publication number: 20240332274
    Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.
    Type: Application
    Filed: June 11, 2024
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tsung-Yueh TSAI, Meng-Jen WANG, Yu-Fang TSAI, Meng-Jung CHUANG
  • Needle actuator for cartridge filling machine
    Patent number: 12103838
    Abstract: Apparatus for automatically filling fluid into containers includes an actuator for raising and lowering a fluid dispensing needle. The needle is coupled to a pump. A first sensor senses that the needle has been moved to its lowered position. A control circuit responsive to the first sensor prevents the pump from pumping fluid to the needle unless the needle is in its lowered position. A horizontal actuator moves the needle actuator in a horizontal plane from one container to another. A second sensor senses that the needle has been moved to its raised position, and the control circuit is responsive thereto for preventing operation of the horizontal actuator unless the needle has been moved to its raised position.
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: October 1, 2024
    Assignee: Credence Engineering, Inc.
    Inventor: James Edward Ellis
  • Pleated filter preparation system
    Patent number: 12103264
    Abstract: A pleated filter preparation system is provided for accurately counting pleats along a continuous sheet of pleated filter material and cutting the sheet into filter strips to be formed into filters. The pleated filter preparation system includes a pleat driver having multiple drive gears that engage with the pleats of the pleated filter material to move the pleated filter material through the system. A pleat counter counts peaks and valleys of each pleat comprising the pleated filter material so as to identify a target pleat to be cut. The pleat counter clamps and stretches the target pleat to distinguish the target pleat among the other pleats. A punch cut station cuts the target pleat to form a filter strip having a desired number of pleats. A pleat compressor compresses the filter strips to a predetermined size and then ejects the filter strips into a suitable container or bin.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: October 1, 2024
    Assignee: K&N Engineering, Inc.
    Inventor: Jonathan Richard Fiello
  • Battery passivation management system
    Patent number: 12107237
    Abstract: Described is a battery de-passivation circuit that generally comprises a battery having a de-passivation circuit attached across its positive and negative terminals. The de-passivation circuit includes a switch that can open or close the de-passivation circuit, a resistor that can regulate the amount of current drawn from the battery and a clock and timer controller system that controls the switch. The controller system controls closing the circuit long enough to bring the passivation level build-up within the battery to an acceptable lower level and controls opening the circuit long enough to allow passivation levels to build-up to an acceptable upper level.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: October 1, 2024
    Assignee: Phase IV Engineering Inc.
    Inventor: Scott David Dalgleish
  • Bolt together wheel with deflation system
    Patent number: 12097725
    Abstract: A bolt together wheel assembly with deflation system includes an inner wheel half, an outer wheel half, a bolt cover ring, and a removable valve stem. Clamping bolts and clamping nuts secure the outer wheel half to the inner wheel half. Venting port plugs secure the bolt cover ring to the outer wheel half over the clamping bolts. Loosening one or more of the venting port plugs to access the clamping bolts opens a seal to a vent port within the inner wheel half and releases pressurized air from a tire on the wheel, ensuring that the tire is deflated before the wheel can be disassembled.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: September 24, 2024
    Assignee: OTR Wheel Engineering, Inc.
    Inventor: Leonard Austin Hensel