Patents Assigned to .Engineering, Inc.
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Publication number: 20240272365Abstract: An optical module is disclosed. The optical module includes a carrier, a first optical receiver disposed over the carrier and configured to receive a first light of a first wavelength band, and a second optical receiver disposed over the carrier and configured to receive a second light of a second wavelength band different from the first wavelength band. The optical module also includes a light blocking structure having a first portion around the first optical receiver and the second optical receiver. The light blocking structure is substantially opaque to the first wavelength band and the second wavelength band. The optical module also includes a first optical filter disposed over the first optical receiver and configured to allow the first light to pass through, and a second optical filter disposed over the second optical receiver and configured to allow the second light to pass through.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shyue-Long LOUH, Jenchun CHEN
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Publication number: 20240275038Abstract: The present disclosure provides an electronic device. The electronic device includes a carrier and an interconnection structure disposed over the carrier and having a plurality of conductive pads. One of the plurality of conductive pads is adjustable to function as a functional pad or a non-functional pad for an antenna unit.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wei-Chih CHO
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Publication number: 20240275061Abstract: The present disclosure provides an electronic device. The electronic device includes a radio frequency (RF) circuit region and an antenna region. The RF circuit region has a first circuit density. The antenna region includes a circuit structure. The circuit structure defines a waveguide. The circuit structure has a second circuit density less than the first circuit density.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
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Publication number: 20240269602Abstract: A method to produce an acid-depleted biogas is described. The method includes supplying biogas to a biogas acid removal system to produce an acid-depleted biogas. Biogas pre-processing, post-processing, and a product production system may be integrated with the biogas acid removal process to produce a product. A two-stage volatile organic compound removal process is also described including a volatile organic compound removal step, and a halogenated volatile organic compound removal step, followed by an acid removal step. Oxygen removal from the biogas is also provided by combusting oxygen together with halogenated volatile organic compounds within the biogas, followed by removing acid generated in the combustion of the halogenated volatile organic compounds.Type: ApplicationFiled: February 15, 2023Publication date: August 15, 2024Applicant: Stearns, Conrad and Schmidt, Consulting Engineers, Inc.Inventor: Jeffrey GRILL
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Publication number: 20240275060Abstract: The present disclosure provides an electronic device. The electronic device includes a signal transmission structure and a circuit. The signal transmission structure defines a waveguide. The signal transmission structure defines a plurality of first apertures. The circuit is configured to adjust a geometric profile of at least one of the plurality of first apertures to control a frequency of an electromagnetic wave radiated from the first apertures.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
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Publication number: 20240266888Abstract: A two-phase bipolar 3.6° step motor is described in which the stator winding assembly has eight stator poles organized into decoupled phase groups with two distinct angular pole separations, 14.4°×[(4n±1)/4] between poles of the same group, and 14.4°×[(4m±1)/2] between adjacent poles of different groups, where n and m are positive whole numbers. Three stator teeth on each stator pole have a stator tooth pitch of 13.2° to minimize detent torque for smoother, more accurate stepping. A rotor has alternating magnetic north and south rotor teeth around a circumference thereof with a 14.4° rotor tooth pitch angle. The stator poles are wound with electromagnetic coil windings that can be driven in a series of phases to magnetically interact with the rotor.Type: ApplicationFiled: July 3, 2023Publication date: August 8, 2024Applicant: Lin Engineering, Inc.Inventor: Ted T. Lin
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Publication number: 20240264369Abstract: An optoelectronic package includes a first photonic component, an optical connection element and an optical component. The optical connection element is disposed at least partially over the first photonic component. The optical component is disposed at least partially over the first photonic component. The optical connection element and the optical component are spaced apart from each other.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
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Publication number: 20240264368Abstract: An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN, Chang Chi LEE, Chun-Yen TING
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Publication number: 20240264377Abstract: An optical package device and a method of manufacturing the same are disclosed. The optical package device includes an optical component and an optical guiding component. The optical component is configured to change a phase of an input optical signal from a first state to a second state, and to output a first beam with a phase of the second state. The optical guiding component is disposed adjacent to the optical component, the first beam propagating from the optical component toward the optical guiding component. The physical axis of the optical component perpendicular thereto is not parallel with a physical axis of the optical guiding component perpendicular thereto.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Ying-Chung CHEN
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Patent number: 12053192Abstract: Described herein are systems, devices, and methods for removing material from patient vasculature. In some embodiments, an aspiration device may include a sheath and a catheter slidably disposed within the sheath and defining a lumen. The catheter may include a distal end portion and an elongate portion, the distal end portion being disposable adjacent to a clot, the elongate portion being couplable to a vacuum source that is configured to apply a negative pressure to the lumen to draw the clot into the distal end portion. The distal end portion may include a plurality of sections, each of the plurality of sections having a different cut pattern.Type: GrantFiled: September 1, 2023Date of Patent: August 6, 2024Assignee: Endovascular Engineering, Inc.Inventors: Scott J. Baron, Michael Rosenthal, David Snow, Brian Domecus, Joshua Michael Stafford
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Publication number: 20240258229Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.Type: ApplicationFiled: April 9, 2024Publication date: August 1, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Yi Chun CHOU
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Publication number: 20240255971Abstract: An apparatus and methods are provided for a portable mass airflow (MAF) training module configured to simulate an air intake into an internal combustion engine. An in-line blower draws an airflow through an air filter by way of a first air duct and a second air duct. A throttle assembly is coupled between the first air duct and the second air duct. The throttle assembly includes a throttle plate that may be rotated to regulate the airflow. The power output of the in-line blower is variable to simulate the air intake of various sizes of the internal combustion engine. A MAF sensor and a duct velocity sensor are configured to provide airflow information. The portable MAF training module enables a practitioner to select a desired throttle setting and observe a resultant mass airflow through the portable MAF training module that is measured by the MAF sensor.Type: ApplicationFiled: April 12, 2024Publication date: August 1, 2024Applicant: K&N Engineering, Inc.Inventors: Mac McClanahan, Steve Williams, Joel Valles
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Publication number: 20240254952Abstract: An apparatus and methods are provided for a throttle body spacer that improves the performance of an internal combustion engine. The throttle body spacer comprises a body that includes an airflow opening for conducting airflow from a throttle body into an intake manifold. A spiral is disposed along a sidewall of the airflow opening and configured for swirling the airflow. The spiral comprises a helical shape disposed around a circumference of the sidewall and extends from an initial bore near a first contact surface of the body to a second contact surface. The helical shape includes a diameter that increases as the spiral extends toward the second contact surface, giving the body a sidewall taper angle that contributes to an increase in power output of the engine. A sawtooth cross-sectional shape of the spiral causes the airflow to swirl so as to improve atomization of an air-fuel mixture entering engine.Type: ApplicationFiled: January 10, 2024Publication date: August 1, 2024Applicant: K&N Engineering, Inc.Inventor: Jonathan Richard Fiello
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Publication number: 20240260181Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.Type: ApplicationFiled: April 9, 2024Publication date: August 1, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Ze LIN, Chia Ching CHEN, Yi Chuan DING
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Publication number: 20240249988Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a substrate, an electronic component, an intermediate structure and a protective layer. The electronic component is disposed over the substrate. The intermediate structure is disposed over the substrate and comprises an interposer and a conductive element on the interposer. The protective layer is disposed over the substrate and has an upper surface covering the electronic component and being substantially level with an upper surface of the conductive element.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Chang CHEN, Wei-Tung CHANG, Jen-Chieh KAO
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Publication number: 20240247620Abstract: An apparatus and method are provided for a fuel bowl to supply liquid fuel to a carburetor. The fuel bowl comprises a float chamber and a fuel inlet cavity which receives a fuel delivery insert. The fuel delivery insert receives a fuel inlet valve and comprises passages to direct incoming fuel to a bottom portion of the float chamber. A float comprises an elongate member rotatably hinged within a float cavity of the fuel delivery insert, such that the float rises according to a quantity of fuel within the float chamber. The fuel inlet valve supplies liquid fuel to the float chamber by way of the passages according to the operation of the float within the float chamber. A ventilation chamber allows air and fuel vapors to exit as liquid fuel enters the float chamber while preventing liquid fuel from entering into the carburetor.Type: ApplicationFiled: April 1, 2024Publication date: July 25, 2024Applicant: K&N Engineering, Inc.Inventor: John Kyle
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Publication number: 20240249958Abstract: A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.Type: ApplicationFiled: January 20, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ya Fang CHAN, Cong-Wei CHEN, Kuoching CHENG, Shih-Yu WANG
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Publication number: 20240250427Abstract: The present disclosure provides an electronic device. The electronic device includes an antenna. The antenna includes a first conductive element, a second conductive element, and a switch circuit. The first conductive element is configured to transmit a first signal along a first direction. The second conductive element is configured to transmit a second signal along a second direction different from the first direction. The switch circuit is configured to electrically couple a ground to the first conductive element and/or the second conductive element.Type: ApplicationFiled: January 23, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Hao CHANG, Wei-Chun LEE
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Publication number: 20240250006Abstract: The present disclosure provides a package structure. The package structure includes a die bonding region and a first lead region. The first lead region extends along a first direction. The first direction is along a first edge of the die bonding region. The first lead region includes a first high density lead region and a first low density lead region. The first high density lead region overlaps the first low density lead region in the first direction.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: I-Jen CHEN
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Publication number: 20240250030Abstract: An electronic device is provided. The electronic device includes an inductor and a dielectric layer. The inductor includes a first magnetic layer, a conductive trace over the first magnetic layer, and a second magnetic layer over the conductive trace. The dielectric layer includes a first portion between the second magnetic layer and an inclined surface of the first magnetic layer. A substantially constant distance between the second magnetic layer and the inclined surface of the first magnetic layer is defined by the dielectric layer.Type: ApplicationFiled: January 23, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Chiu-Wen LEE, Yu-Hsun CHANG, Tai-Yuan HUANG
