Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.

Abstract: A package structure and a circuit layer structure are provided in the present disclosure. The package structure includes a wiring structure, a first electronic device, a second electronic device and at least one dummy trace. The wiring structure includes a plurality of interconnection traces. The first electronic device and the second electronic device are disposed on the wiring structure, and electrically connected to each other through the interconnection traces. The dummy trace is adjacent to the interconnection traces. A mechanical strength of the at least one dummy trace is less than a mechanical strength of one of the interconnection traces.

Abstract: A semiconductor package structure and a method of manufacturing the same are provided. The semiconductor package structure includes an electronic component having a first surface, a second surface opposite to the first surface and a circuit structure closer to the first surface than to the second surface. The semiconductor package structure also includes a passive component connected to the second surface of the electronic component. The semiconductor package structure further includes a conductive element extending into the electronic component and configured to electrically connect the circuit structure with the passive component.

Abstract: A novel emissions control watercraft (STAXcraft) solving a long-felt but unsolved need regarding disadvantages associated with prior-art emissions servicing watercraft, the disadvantages selected from the group, but not limited to, the use of tugboats, securing or mooring servicing watercraft to a serviced vessel, additional expenses and time-delays and inefficiencies of land-based approaches, increased toxic emissions, increased greenhouse gases (GHG) emissions, danger from falling cargo, tanker safety, alongside mooring in narrow channels preventing other OGV's to pass safely, and cargo tank emissions.

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, and a connection element. The first electronic component is disposed over a surface of the carrier. The second electronic component is disposed over the first electronic component. The third electronic component is spaced apart from the first electronic component and disposed over the surface of the carrier. The fourth electronic component is disposed over the third electronic component. The connection element is electrically connecting the second electronic component to the fourth electronic component.

Abstract: There is disclosed a system and process for the anaerobic and aerobic treatment of landfill wastewater, including landfill condensate, landfill leachate and mixtures thereof.

Abstract: An apparatus and method are provided for an air filter configured to be mounted onto an air inlet of an internal combustion engine. The air filter comprises a first end cap configured to couple with a base which is configured to support a conventional air filter and provide an interface between the conventional air filter and the air inlet. A filter medium which is relatively thicker than the conventional air filter is configured to remove particulate matter and other contaminates from an incoming airstream. A second end cap is configured to couple with a cover which is configured to fasten the conventional air filter and the base onto the air inlet, such that the incoming airstream is directed through the filter medium. The air filter is configured to be installed in place of the conventional air filter without necessitating alteration of the base and cover.

Abstract: Systems and methods for determining a mass of a crop by using at least one X-ray scanner is provided. The method includes obtaining at least two scan images of the crop, where a first of the at least two images is obtained along a first plane relative to the crop and a second of the at least two images is obtained along a second plane relative to the crop, and where the first plane is angularly displaced relative to the second plane, registering the first image and the second image, correcting the registered first and second images, and determining the mass of the crop from the corrected first and second images.

Abstract: A multiple fluid model tool for training and/or refining of fluid models using disparate and/or aggregated machine data is presented. For example, a system includes a modeling component, a machine learning component, a three-dimensional design component and a data collection component. The modeling component generates a three-dimensional model of a mechanical device based on a library of stored data elements. The machine learning component predicts one or more characteristics of the mechanical device based on a machine learning process associated with the three-dimensional model. The three-dimensional design component provides a three-dimensional design environment associated with the three-dimensional model. The three-dimensional design environment renders physics modeling data of the mechanical device on the three-dimensional model based on the one or more characteristics of the mechanical device.

Abstract: Solar trackers that may be advantageously employed on sloped and/or variable terrain to rotate solar panels to track motion of the sun across the sky include bearing assemblies configured to address mechanical challenges posed by the sloped and/or variable terrain that might otherwise prevent or complicate use of solar trackers on such terrain.

Abstract: A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.

Abstract: The present disclosure provides a body-part tracking device and a body-part tracking method. The body-part tracking device includes a first electronic component and a first antenna element. The first antenna element is electrically connected to the first electronic component and configured to receive a first wave. The first electronic component is configured to, in response to the first wave, transmit a second wave.

Abstract: The present disclosure provides a semiconductor device package including a substrate, a waveguide component, and an antenna pattern. The substrate includes a feeding element. The waveguide component is disposed over the substrate. The antenna pattern is disposed over the substrate. The waveguide component is substantially aligned with the feeding element and the antenna pattern.

Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.

Abstract: A semiconductor package includes a first die. The first die includes a semiconductor substrate. The semiconductor substrate has a first surface, a second surface opposite to the first surface, and a through hole between the first surface and the second surface and having an inner wall. The inner wall has a first lever arm. A length of the first lever arm is less than a thickness of the semiconductor substrate.

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.