Patents Assigned to .Engineering, Inc.
  • Patent number: 11525930
    Abstract: The present specification describes an X-ray detector that includes at least one scintillator screen for absorbing incident X rays and emitting corresponding light rays, a wavelength shifting sheet (WSS) coupled with the at least one scintillator screen for shifting the emitted light rays, at least one wavelength shifting fiber (WSF) coupled with at least one edge of the WSS for collecting the shifted light rays, and a photodetector for detecting the collected light rays.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: December 13, 2022
    Assignee: American Science and Engineering, Inc.
    Inventors: Aaron J. Couture, Jeffrey M. Denker
  • Publication number: 20220392868
    Abstract: An apparatus and method for manufacturing a semiconductor package structure are provided. The method includes: providing a process line comprising a first semiconductor manufacturing portion configured to provide a first operation including a first process step, and a second semiconductor manufacturing portion configured to provide a second operation including a second process step; passing a packaging structure through the second semiconductor manufacturing portion, wherein the second semiconductor manufacturing portion applies the second process step to the packaging structure; passing the packaging structure through the first semiconductor manufacturing portion, wherein the first semiconductor manufacturing portion applies the first process step to the packaging structure; and passing the packaging structure through the second semiconductor manufacturing portion again without applying the second process step thereon.
    Type: Application
    Filed: June 2, 2021
    Publication date: December 8, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Min WU, Cheng-Lin LI
  • Publication number: 20220392871
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 8, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
  • Publication number: 20220384308
    Abstract: A semiconductor package structure includes a first electronic component, a conductive element and a first redistribution structure. The first electronic component has a first surface and a second surface opposite to the first surface, and includes a first conductive via. The first conductive via has a first surface exposed from the first surface of the first electronic component. The conductive element is disposed adjacent to the first electronic component. The conductive element has a first surface substantially coplanar with the first surface of the first conductive via of the first electronic component. The first redistribution structure is configured to electrically connect the first conductive via of the first electronic component and the conductive element.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiao-Yen LEE, Hung-Yi LIN
  • Publication number: 20220384309
    Abstract: A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a semiconductor substrate, at least one conductive via, a second insulation layer and a conductive layer. The conductive via is disposed in the semiconductor substrate and includes an interconnection metal and a first insulation layer around the interconnection metal. A portion of the first insulation layer defines an opening to expose the interconnection metal. The second insulation layer is disposed on a surface of the semiconductor substrate and in the opening. The conductive layer is electrically disconnected with the semiconductor substrate by the second insulation layer and electrically connected to the interconnection metal of the at least one conductive via.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hung-Yi LIN, Chin-Cheng KUO, Wu Chou HSU
  • Publication number: 20220384289
    Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi CHEN, Chang-Lin YEH, Jen-Chieh KAO
  • Publication number: 20220385854
    Abstract: Existence of instrumentation for automatic video recording creates an excess capacity of video recording for those who own automatic video recorders. Others may want to utilize this excess capacity to record their activities thus there is a need for a system that helps match those who would like to utilize the excess capacity with those who have such capacity. Such excess capacity is matched with demand to use such excess capacity by creating a network of automatic video recording units and tags that are associated with people who want to be recorded.
    Type: Application
    Filed: July 21, 2022
    Publication date: December 1, 2022
    Applicant: H4 Engineering, Inc.
    Inventors: Christopher T. Boyle, Konstantin Othmer, Gordon Jason Glover, Alexander G. Sammons
  • Publication number: 20220384208
    Abstract: A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia-Pin CHEN, Chia Sheng TIEN, Wan-Ting CHIU, Chi Long TSAI, Cyuan-Hong SHIH, Yen Liang CHEN
  • Publication number: 20220382924
    Abstract: A method for generating computer-readable instructions to automatically generate a three-dimensional architectural model including: receiving a human-readable text file comprising a description of functional elements of a structure, parsing the text file to identify keywords comprised by the text file, generating a plurality of datasets responsive to the key words; generating instructions to create level objects responsive to the datasets, instructions to create floor objects responsive to the datasets and the level objects, instructions to create exterior wall objects responsive to the plurality of datasets and the one or more level objects, instructions to create interior wall objects responsive to the and level objects, instructions to create room objects responsive to the datasets, level objects, exterior wall objects, and interior wall objects, and providing the instructions to architectural modeling software.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 1, 2022
    Applicant: BRPH Architects Engineers, Inc.
    Inventors: Henry Alexander Marroquin, Mark Elton Myers
  • Publication number: 20220384310
    Abstract: A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a semiconductor substrate, a conductive structure and at least one via structure. The conductive structure is disposed on an upper surface of the semiconductor substrate. The at least one via structure is disposed in the semiconductor substrate. A portion of the at least one via structure extends beyond the conductive structure.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chin-Cheng KUO
  • Publication number: 20220384381
    Abstract: An electronic device package is provided. The electronic device package includes a redistribution layer (RDL), a first electronic component and an interconnector. The RDL includes a topmost circuit layer, and the topmost circuit layer includes a conductive trace. The first electronic component is disposed over the RDL. The interconnector is disposed between the RDL and the first electronic component. A direction is defined by extending from a center of the first electronic component toward an edge of the first electronic component, and the direction penetrates a first sidewall and a second sidewall of the interconnector, the second sidewall is farther from the center of the first electronic component than the first sidewall is, and the conductive trace is outside a projection region of the second sidewall.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chung-Hung LAI, Chin-Li KAO, Chih-Yi HUANG, Teck-Chong LEE
  • Patent number: 11511954
    Abstract: A vehicle leveler which includes a first portion with a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The leveler also includes a second portion with a leading edge and a trailing edge, the leading edge of the second portion is removably attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The second portion also includes an extension portion. The vehicle leveler has opposing side portions which have a top surface that forms a walkway. A safety barrier with two opposed gates is mounted adjacent to the vehicle leveler. The safety barrier when in an open position acts as a fall protection barrier for a user.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: November 29, 2022
    Assignee: Leum Engineering, Inc.
    Inventors: Grant Leum, Eric Demerath
  • Patent number: 11513540
    Abstract: According to an embodiment of the disclosure, an apparatus for a flow of fluid includes a first and a second element that form an exponentially changing restriction between them for a flow of a fluid. At least one of the first and second elements is configured to move in response to changing pressures to change the restriction. One of the first and second elements includes a wall with one or more cutouts that have an admittance that changes exponentially with respect to the movement of the first or second element.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: November 29, 2022
    Assignee: IMI Hydronic Engineering, Inc.
    Inventor: John M. Trantham
  • Publication number: 20220377161
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.
    Type: Application
    Filed: May 19, 2021
    Publication date: November 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Chung Ju YU, Jui-Hsien WANG, Chai-Chi LIN, Hong Jie CHEN
  • Publication number: 20220370943
    Abstract: An apparatus and a method are provided for a heating, ventilation, and air conditioning (HVAC) home air filter to remove airborne molecular contaminants and volatile organic compounds (VOCs) from air within residential spaces. The HVAC home air filter comprises a supportive frame having a shape and size suitable to orient the HVAC home air filter within a residential HVAC system. A filter medium is retained within the supportive frame to remove the airborne molecular contaminants and VOCs from air flowing through the residential HVAC system. The filter medium comprises a combination of media layers configured to exhibit a relatively high filtration efficiency and a low air pressure drop across the filter medium. The supportive frame comprises a plurality of elongate sections and corner sections disposed along perimeter edges of the filter medium to support the filter medium within the residential HVAC system so as direct air through the filter medium.
    Type: Application
    Filed: June 3, 2022
    Publication date: November 24, 2022
    Applicant: K&N Engineering, Inc.
    Inventors: Steve Williams, Jere James Wall
  • Publication number: 20220372939
    Abstract: A filter oil composition and a method for removing airborne molecular contaminants from air are provided. The composition includes a first portion comprising paraffinic oil by volume of the composition, a second portion comprising polyalphaolefin (PAO) by volume of the composition, and a third portion comprising red dye by volume of the composition. Applying the filter oil composition to a cotton air filter material causes tackiness throughout the air filter material, thereby enhancing filtration of air passing through the filter. The composition generally is substantially non-reactive, has an excellent oxidation stability, possesses good thermal stability, and retains a suitable viscosity at a normal operating temperatures of an automobile engine. In an embodiment, the composition comprises 96.74% paraffinic oil by volume, 3.20% polyalphaolefin (PAO) by volume, and 0.06% red dye by volume. A viscosity of the composition at 100 degrees-C ranges between substantially 7.2 and 7.6 centistokes (cSTs).
    Type: Application
    Filed: August 1, 2022
    Publication date: November 24, 2022
    Applicant: K&N Engineering, Inc.
    Inventors: Steve Williams, Jere James Wall, Rick Daniels
  • Publication number: 20220373670
    Abstract: At least some embodiments of the present disclosure relate to a wearable device. The wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically connected to the detecting module. The control module is configured to receive a signal from the detecting module and to control the wearable device in response to the signal.
    Type: Application
    Filed: May 19, 2021
    Publication date: November 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Chung Ju YU, Wei-Fan WU, Chai-Chi LIN, Hong Jie CHEN
  • Publication number: 20220375809
    Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Application
    Filed: August 8, 2022
    Publication date: November 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Han WANG, Ian HU
  • Patent number: 11506155
    Abstract: An apparatus and a method are provided for an air box configured to cool an engine control unit (ECU) by way of an airstream being communicated to an air intake system of an internal combustion engine of a vehicle. The air box is comprised of a housing to support an air filter within an interior of the housing. An opening in the housing fixedly receives at least one surface of the ECU to transfer heat from the ECU to the airstream. A mount portion within the housing receives the air filter. A conduit to a clean side of the air filter is configured to be coupled with the air intake system. An inlet to the housing is configured to couple with an air inlet duct of the vehicle so as to direct the airstream into the interior of the housing.
    Type: Grant
    Filed: October 27, 2018
    Date of Patent: November 22, 2022
    Assignee: K&N Engineering, Inc.
    Inventors: Jonathan Richard Fiello, Steve Williams
  • Patent number: D970552
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: November 22, 2022
    Assignee: Advanced Flow Engineering, Inc.
    Inventors: Shahriar Nick Niakan, Matthew Thomas Emge