Patents Assigned to Engineering Technologies, Inc.
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Patent number: 7238602Abstract: The method includes a step of picking and placing standard good dice on a base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The method of the chip-size package comprises the steps of separating dice on a wafer and picking and placing the dice on a base and filling a first material layer on the base into a space among the dice on the base. A dielectric layer with first openings is patterned to expose a portion of a conductive line of the dice. A conductive material is filled into the first openings and on the dielectric layer. Subsequently, a second material layer is formed to have a second openings exposing the conductive material and then welding solder balls on the second openings.Type: GrantFiled: October 26, 2004Date of Patent: July 3, 2007Assignee: Advanced Chip Engineering Technology Inc.Inventor: Wen Kun Yang
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Patent number: 7228997Abstract: An apparatus nails a plurality of cross members to an underlying stringer to produce a pallet. The carriage moves in a continuous motion without stopping over the cross members until the cross members are nailed to the stringer. The carriage includes at least one nailing gun for driving nails and a hydraulic accumulator mounted on the carriage in hydraulic communication with the at least one nailing gun for supplying hydraulic fluid to provide a force to the nailing gun to nail the cross members to the stringer. The nailing gun may be pivotally secured to the carriage wherein the nailing gun pivots with respect to the carriage while driving a nail into the cross member and the underlying stringer. The nail gun is also positioned into a nail driving position pneumatically and when in the nail driving position the hydraulic cylinder is actuated to drive the nail into the cross member.Type: GrantFiled: March 16, 2005Date of Patent: June 12, 2007Assignee: Engineering Technologies, Inc.Inventor: Terry Thompson
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Patent number: 7224061Abstract: A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.Type: GrantFiled: August 16, 2004Date of Patent: May 29, 2007Assignee: Advanced Chip Engineering Technology Inc.Inventors: Wen-Kun Yang, Shih-Li Chen, Wen-Bin Sun, Ming-Hui Lin, Chao-Nan Chou, Chih-Wei Lin
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Patent number: 7220113Abstract: Gauge distribution apparatus for plastic film has a frame, a rotor mounted on the frame for sequential reversed rotation about a substantially vertical axis, and at least one slot in the rotor through which two lengths of plastic film can pass upwardly with spaced adjacent faces from below the rotor. First and second turning members are mounted on the rotor for receiving a respective length of plastic film and changing the direction of motion thereof from upwardly to horizontally. A series of upstanding circumferentially spaced film engaging members extend around the rotor, each film engaging member having an outer surface for engagement by the plastic film. Third and fourth turning members are mounted on the frame for receiving a respective length of plastic film after it has engaged at least one of the film engaging members and changing its direction of motion from horizontally to vertically.Type: GrantFiled: April 11, 2005Date of Patent: May 22, 2007Assignee: Macro Engineering & Technology Inc.Inventors: Mirek Planeta, Joe Suhay
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Patent number: 7217769Abstract: A medical device with a hydrophilic and lubricious coating, wherein the coating includes a hydrophilic polymeric unit layer deposited on the medical device and cross-linked with a plasma deposited double bond monomer. The hydrophilic polymeric unit can include ethylene oxide with one or more primary or secondary alcohol groups or glycosaminoglycans such as hyaluronic acid, and the double bond monomer includes monomers containing at least one double bond, preferably a C?C, C?N or C?O bond, including N-trimethylsilyl-allylamine, ethylene, propylene and allyl alcohol.Type: GrantFiled: July 16, 2004Date of Patent: May 15, 2007Assignee: BioSurface Engineering Technologies, Inc.Inventors: Paul O. Zamora, Meng Chen, Shigemasa Osaki, Ting-Ting Hsieh, Ray Tsang
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Patent number: 7175194Abstract: An anti-jackknifing device adapted for engagement between a tractor having a fifth wheel engaged with a trailer. The device features a pair of catch arms rotationally engaged to a mount with the tractor. The distal ends of the catch arms move between an engaged position in a horizontal path between two trailer mounted engaging components adapted to engage the distal end and a disengaged position out of the path. The distal ends of the catch arms may be pivotally mounted. The distal ends of the catch arms and the engaging components may also be shaped to cooperatively engage on contact. A control causes the catch arms to rotate thereby engaging the distal ends of the arms between the engaging components either automatically above a threshold speed or manually. This engagement limits the angle of the trailer to the tractor to a predetermined angle when trailer rotates on the fifth wheel causing the engaging components to contact the distal ends of the catch arms.Type: GrantFiled: October 6, 2004Date of Patent: February 13, 2007Assignee: Impact Engineering Technologies, IncInventor: Michael Ball
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Patent number: 7176567Abstract: The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.Type: GrantFiled: July 6, 2005Date of Patent: February 13, 2007Assignee: Advanced Chip Engineering Technology Inc.Inventors: Wen-Kun Yang, Kuang-Chi Chao, Cheng-hsien Chiu, Chihwei Lin, Jui-Hsien Chang
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Patent number: 7166574Abstract: The invention provides synthetic heparin-binding growth factor analogs having at least one peptide chain that binds a heparin-binding growth factor receptor, covalently bound to a hydrophobic linker, which is in turn covalently bound to a non-signaling peptide that includes a heparin-binding domain. The synthetic heparin-binding growth factor analogs are useful as soluble biologics or as surface coatings for medical devices.Type: GrantFiled: August 20, 2002Date of Patent: January 23, 2007Assignees: BioSurface Engineering Technologies, Inc., Brookhaven National LaboratoryInventors: Louis A. Peña, Paul Zamora, Xinhua Lin, John D. Glass
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Publication number: 20060205652Abstract: Formulations, kits and methods for bone or cartilage repair, including treatment of osteogenic defects, including formulations of synthetic heparin-binding growth factor analogs, non-ionic polymers, gelling agents and calcium-containing agents.Type: ApplicationFiled: February 23, 2006Publication date: September 14, 2006Applicant: BioSurface Engineering Technologies, Inc.Inventors: Paul Zamora, Sarah Campion
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Publication number: 20060199764Abstract: The present invention provides a fibroblast growth factor heparin-binding analog of the formula: where R1, R2, R3, R4, R5, X, Y and Z are as defined, pharmaceutical compositions, coating compositions and medical devices including the fibroblast growth factor heparin-binding analog of the foregoing formula, and methods and uses thereof.Type: ApplicationFiled: February 23, 2006Publication date: September 7, 2006Applicant: BioSurface Engineering Technologies, Inc.Inventors: Paul Zamora, Louis Pena, Xinhua Lin, Kazuyuki Takahashi
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Patent number: 7097441Abstract: An annular co-extrusion die for extruding multi-layer tubular plastic film has inner die members stacked one upon another and having radially outwardly extending surfaces forming radially outwardly extending helical passages between respective pairs of inner die members. An annular outer die member surrounds the stacked inner die members and forms a longitudinally extending annular passage therebetween for conveying plastic material from the radially outwardly extending helical passages to an annular extrusion orifice. A lower inner die member has a first feed passage extending from a lower surface thereof to a substantially horizontal upper surface thereof at a position spaced from a central longitudinal axis of the longitudinally extending annular passage, the substantially horizontal upper surface having a first groove extending from the upper end of the first feed passage to the longitudinal axis.Type: GrantFiled: December 1, 2003Date of Patent: August 29, 2006Assignee: Marco Engineering & Technology Inc.Inventors: Surendra M. Sagar, Mirek Planeta
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Patent number: 7061106Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises an isolating base, a wafer level package, a lens holder, and a F.P.C.. The wafer level package having a plurality of image sensor dies and a plurality of solder balls is attached to the isolating base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dies. The lens holder is placed in the F.P.C., and the F.P.C. has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dies. Moreover, the image sensor dies may be packaged with passive components or other dies with a side by side structure or a stacking structure.Type: GrantFiled: April 28, 2004Date of Patent: June 13, 2006Assignee: Advanced Chip Engineering Technology Inc.Inventors: Wen-Kun Yang, Wen-Pin Yang
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Patent number: 7047830Abstract: A method and an apparatus for detecting, locating, and quantifying contamination in a fluid flow system like a pipe or duct. This characterization technique uses a conservative and one or more interactive tracers that are injected into the fluid flow system and then monitored at another location in the system. Detection, location, and quantification are accomplished by analysis of the characteristic features of measured curves of tracer concentration.Type: GrantFiled: July 10, 2003Date of Patent: May 23, 2006Assignee: Vista Engineering Technologies, Inc.Inventors: Wesley L. Bratton, Joseph W. Maresca, Jr.
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Patent number: 7001502Abstract: A process is provided for treating crude oil to visbreak and/or upgrade such oil using hydrogen gas. The process includes the steps of introducing hydrogen into a heated stream of crude oil or partially upgraded crude oil and mixing such introduced hydrogen with the oil to achieve intimate dispersion of hydrogen to enhance thereby visbreaking and/or upgrading.Type: GrantFiled: September 29, 1999Date of Patent: February 21, 2006Assignee: Canadian Enviromnental Equipment & Engineering Technologies, Inc.Inventors: Robert Satchwell, Jose Lourenco, Patrick J. Cochrane, Roderick M. Facey, Joao Rodrigues, Kenneth Bannard, Hannu Salokangas
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Publication number: 20060024347Abstract: The invention provides a coating and a method for coating medical devices with synthetic heparin-binding growth factor analogs, the coating and method including at least one heparin-binding growth factor analog with a region of amino acid residues binding a heparin-binding growth factor receptor, a hydrophobic linker region and a heparin-binding region, and further including heparin or an analog thereof. Also provided are medical devices, including aneurysm coils, coated with synthetic heparin-binding growth factor analogs, the coating further including heparin or an analog thereof.Type: ApplicationFiled: June 27, 2005Publication date: February 2, 2006Applicant: BioSurface Engineering Technologies, Inc.Inventors: Paul Zamora, Sarah Campion
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Patent number: 6990930Abstract: In one aspect, the invention provides a steam generation apparatus that is liquid fuel fired and addresses conversion of gaseous fuel SIB units to operate with liquid fuel. The invention also relates to a conversion unit for a steam injection boiler, a method for converting a steam injection boiler from gas firing to possible liquid fuel firing and a method for generating steam from a liquid fuel source. The invention employs a fired heater for heating the liquid fuel to a temperature suitable for firing and preheats the water to compensate for the shortfall in heat liberation when a gas boiler is converted to use liquid fuel. In another aspect of the invention, production of steam is achievable consistently by employing step-up heaters with a steam injection boiler. The heaters being connected in parallel to continue heating the water/steam to achieve a higher quality steam over that produced in the boiler while minimizing consideration as to the adverse effects of coil fouling in the boiler.Type: GrantFiled: May 21, 2004Date of Patent: January 31, 2006Assignee: ACS Engineering Technologies Inc.Inventor: Sujit K. Sarkar
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Publication number: 20050247398Abstract: A tool of wafer level package comprises a first base, an elastic material and a second base. The elastic material is coated on the first base, and the elastic material has viscosity in common state to adhere a plurality of dies. The second base is coated by adhesive material to adhere the dies. The plurality of dies are departed from the elastic material by a special environment after adhering.Type: ApplicationFiled: June 20, 2005Publication date: November 10, 2005Applicant: Advanced Chip Engineering Technology Inc.Inventors: Wen Yang, Wen Yang, Shih-li Chen
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Publication number: 20050222394Abstract: The invention provides synthetic heparin-binding growth factor analogs having two peptide chains each branched from a branch moiety, such as trifunctional amino acid residues, the branch moieties separated by a first linker of from 3 to about 20 backbone atoms, which peptide chains bind a heparin-binding growth factor receptor and are covalently bound to a non-signaling peptide that includes a heparin-binding domain, preferably by a second linker, which may be a hydrophobic second linker. The synthetic heparin-binding growth factor analogs are useful as pharmaceutical agents, soluble biologics or as surface coatings for medical devices.Type: ApplicationFiled: February 24, 2005Publication date: October 6, 2005Applicants: BioSurface Engineering Technologies, Inc., Brookhaven Science AssociatesInventors: Paul Zamora, Louis Pena, Xinhua Lin
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Publication number: 20050196425Abstract: Compounds of the present invention of formula I and formula II are disclosed in the specification and wherein the compounds are modulators of Bone Morphogenic Protein activity. Compounds are synthetic peptides having a non-growth factor heparin binding region, a linker, and sequences that bind specifically to a receptor for Bone Morphogenic Protein. Uses of compounds of the present invention in the treatment of bone lesions, degenerative joint disease and to enhance bone formation are disclosed.Type: ApplicationFiled: February 22, 2005Publication date: September 8, 2005Applicants: BioSurface Engineering Technologies, Inc., Brookhaven Science AssociatesInventors: Paul Zamora, Louis Pena, Xinhua Lin, Kazuyuki Takahashi
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Patent number: 6939110Abstract: A system for maintaining constant pressure, such as at a mosquito fogging nozzle, by electronically controlling the speed of an engine that is coupled to a blower. A pressure sensor measures the pressure provided by the blower and provides a pressure signal to the electronic engine controller. The engine controller is of the proportional-integral (PI) type and utilizes pulse-width modulation (PWM) techniques to control an electromechanical actuator attached to the throttle of the engine to vary the engine speed. Constant pressure is maintained despite changes in the ambient temperature, humidity and barometric pressure. A safety circuit prevents engine over-speed if the pressure signal is lost. An over-speed circuit monitors and controls the engine speed at higher RPMs.Type: GrantFiled: November 6, 2002Date of Patent: September 6, 2005Assignee: Clarke Engineering Technologies, Inc.Inventors: Larry D. Conner, Donald S. Foreman