Patents Assigned to Engineering Technologies, Inc.
  • Patent number: 7238602
    Abstract: The method includes a step of picking and placing standard good dice on a base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The method of the chip-size package comprises the steps of separating dice on a wafer and picking and placing the dice on a base and filling a first material layer on the base into a space among the dice on the base. A dielectric layer with first openings is patterned to expose a portion of a conductive line of the dice. A conductive material is filled into the first openings and on the dielectric layer. Subsequently, a second material layer is formed to have a second openings exposing the conductive material and then welding solder balls on the second openings.
    Type: Grant
    Filed: October 26, 2004
    Date of Patent: July 3, 2007
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventor: Wen Kun Yang
  • Patent number: 7228997
    Abstract: An apparatus nails a plurality of cross members to an underlying stringer to produce a pallet. The carriage moves in a continuous motion without stopping over the cross members until the cross members are nailed to the stringer. The carriage includes at least one nailing gun for driving nails and a hydraulic accumulator mounted on the carriage in hydraulic communication with the at least one nailing gun for supplying hydraulic fluid to provide a force to the nailing gun to nail the cross members to the stringer. The nailing gun may be pivotally secured to the carriage wherein the nailing gun pivots with respect to the carriage while driving a nail into the cross member and the underlying stringer. The nail gun is also positioned into a nail driving position pneumatically and when in the nail driving position the hydraulic cylinder is actuated to drive the nail into the cross member.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: June 12, 2007
    Assignee: Engineering Technologies, Inc.
    Inventor: Terry Thompson
  • Patent number: 7224061
    Abstract: A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: May 29, 2007
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Shih-Li Chen, Wen-Bin Sun, Ming-Hui Lin, Chao-Nan Chou, Chih-Wei Lin
  • Patent number: 7220113
    Abstract: Gauge distribution apparatus for plastic film has a frame, a rotor mounted on the frame for sequential reversed rotation about a substantially vertical axis, and at least one slot in the rotor through which two lengths of plastic film can pass upwardly with spaced adjacent faces from below the rotor. First and second turning members are mounted on the rotor for receiving a respective length of plastic film and changing the direction of motion thereof from upwardly to horizontally. A series of upstanding circumferentially spaced film engaging members extend around the rotor, each film engaging member having an outer surface for engagement by the plastic film. Third and fourth turning members are mounted on the frame for receiving a respective length of plastic film after it has engaged at least one of the film engaging members and changing its direction of motion from horizontally to vertically.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: May 22, 2007
    Assignee: Macro Engineering & Technology Inc.
    Inventors: Mirek Planeta, Joe Suhay
  • Patent number: 7217769
    Abstract: A medical device with a hydrophilic and lubricious coating, wherein the coating includes a hydrophilic polymeric unit layer deposited on the medical device and cross-linked with a plasma deposited double bond monomer. The hydrophilic polymeric unit can include ethylene oxide with one or more primary or secondary alcohol groups or glycosaminoglycans such as hyaluronic acid, and the double bond monomer includes monomers containing at least one double bond, preferably a C?C, C?N or C?O bond, including N-trimethylsilyl-allylamine, ethylene, propylene and allyl alcohol.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: May 15, 2007
    Assignee: BioSurface Engineering Technologies, Inc.
    Inventors: Paul O. Zamora, Meng Chen, Shigemasa Osaki, Ting-Ting Hsieh, Ray Tsang
  • Patent number: 7175194
    Abstract: An anti-jackknifing device adapted for engagement between a tractor having a fifth wheel engaged with a trailer. The device features a pair of catch arms rotationally engaged to a mount with the tractor. The distal ends of the catch arms move between an engaged position in a horizontal path between two trailer mounted engaging components adapted to engage the distal end and a disengaged position out of the path. The distal ends of the catch arms may be pivotally mounted. The distal ends of the catch arms and the engaging components may also be shaped to cooperatively engage on contact. A control causes the catch arms to rotate thereby engaging the distal ends of the arms between the engaging components either automatically above a threshold speed or manually. This engagement limits the angle of the trailer to the tractor to a predetermined angle when trailer rotates on the fifth wheel causing the engaging components to contact the distal ends of the catch arms.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: February 13, 2007
    Assignee: Impact Engineering Technologies, Inc
    Inventor: Michael Ball
  • Patent number: 7176567
    Abstract: The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.
    Type: Grant
    Filed: July 6, 2005
    Date of Patent: February 13, 2007
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Kuang-Chi Chao, Cheng-hsien Chiu, Chihwei Lin, Jui-Hsien Chang
  • Patent number: 7166574
    Abstract: The invention provides synthetic heparin-binding growth factor analogs having at least one peptide chain that binds a heparin-binding growth factor receptor, covalently bound to a hydrophobic linker, which is in turn covalently bound to a non-signaling peptide that includes a heparin-binding domain. The synthetic heparin-binding growth factor analogs are useful as soluble biologics or as surface coatings for medical devices.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: January 23, 2007
    Assignees: BioSurface Engineering Technologies, Inc., Brookhaven National Laboratory
    Inventors: Louis A. Peña, Paul Zamora, Xinhua Lin, John D. Glass
  • Publication number: 20060205652
    Abstract: Formulations, kits and methods for bone or cartilage repair, including treatment of osteogenic defects, including formulations of synthetic heparin-binding growth factor analogs, non-ionic polymers, gelling agents and calcium-containing agents.
    Type: Application
    Filed: February 23, 2006
    Publication date: September 14, 2006
    Applicant: BioSurface Engineering Technologies, Inc.
    Inventors: Paul Zamora, Sarah Campion
  • Publication number: 20060199764
    Abstract: The present invention provides a fibroblast growth factor heparin-binding analog of the formula: where R1, R2, R3, R4, R5, X, Y and Z are as defined, pharmaceutical compositions, coating compositions and medical devices including the fibroblast growth factor heparin-binding analog of the foregoing formula, and methods and uses thereof.
    Type: Application
    Filed: February 23, 2006
    Publication date: September 7, 2006
    Applicant: BioSurface Engineering Technologies, Inc.
    Inventors: Paul Zamora, Louis Pena, Xinhua Lin, Kazuyuki Takahashi
  • Patent number: 7097441
    Abstract: An annular co-extrusion die for extruding multi-layer tubular plastic film has inner die members stacked one upon another and having radially outwardly extending surfaces forming radially outwardly extending helical passages between respective pairs of inner die members. An annular outer die member surrounds the stacked inner die members and forms a longitudinally extending annular passage therebetween for conveying plastic material from the radially outwardly extending helical passages to an annular extrusion orifice. A lower inner die member has a first feed passage extending from a lower surface thereof to a substantially horizontal upper surface thereof at a position spaced from a central longitudinal axis of the longitudinally extending annular passage, the substantially horizontal upper surface having a first groove extending from the upper end of the first feed passage to the longitudinal axis.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: August 29, 2006
    Assignee: Marco Engineering & Technology Inc.
    Inventors: Surendra M. Sagar, Mirek Planeta
  • Patent number: 7061106
    Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises an isolating base, a wafer level package, a lens holder, and a F.P.C.. The wafer level package having a plurality of image sensor dies and a plurality of solder balls is attached to the isolating base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dies. The lens holder is placed in the F.P.C., and the F.P.C. has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dies. Moreover, the image sensor dies may be packaged with passive components or other dies with a side by side structure or a stacking structure.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: June 13, 2006
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Wen-Pin Yang
  • Patent number: 7047830
    Abstract: A method and an apparatus for detecting, locating, and quantifying contamination in a fluid flow system like a pipe or duct. This characterization technique uses a conservative and one or more interactive tracers that are injected into the fluid flow system and then monitored at another location in the system. Detection, location, and quantification are accomplished by analysis of the characteristic features of measured curves of tracer concentration.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: May 23, 2006
    Assignee: Vista Engineering Technologies, Inc.
    Inventors: Wesley L. Bratton, Joseph W. Maresca, Jr.
  • Patent number: 7001502
    Abstract: A process is provided for treating crude oil to visbreak and/or upgrade such oil using hydrogen gas. The process includes the steps of introducing hydrogen into a heated stream of crude oil or partially upgraded crude oil and mixing such introduced hydrogen with the oil to achieve intimate dispersion of hydrogen to enhance thereby visbreaking and/or upgrading.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: February 21, 2006
    Assignee: Canadian Enviromnental Equipment & Engineering Technologies, Inc.
    Inventors: Robert Satchwell, Jose Lourenco, Patrick J. Cochrane, Roderick M. Facey, Joao Rodrigues, Kenneth Bannard, Hannu Salokangas
  • Publication number: 20060024347
    Abstract: The invention provides a coating and a method for coating medical devices with synthetic heparin-binding growth factor analogs, the coating and method including at least one heparin-binding growth factor analog with a region of amino acid residues binding a heparin-binding growth factor receptor, a hydrophobic linker region and a heparin-binding region, and further including heparin or an analog thereof. Also provided are medical devices, including aneurysm coils, coated with synthetic heparin-binding growth factor analogs, the coating further including heparin or an analog thereof.
    Type: Application
    Filed: June 27, 2005
    Publication date: February 2, 2006
    Applicant: BioSurface Engineering Technologies, Inc.
    Inventors: Paul Zamora, Sarah Campion
  • Patent number: 6990930
    Abstract: In one aspect, the invention provides a steam generation apparatus that is liquid fuel fired and addresses conversion of gaseous fuel SIB units to operate with liquid fuel. The invention also relates to a conversion unit for a steam injection boiler, a method for converting a steam injection boiler from gas firing to possible liquid fuel firing and a method for generating steam from a liquid fuel source. The invention employs a fired heater for heating the liquid fuel to a temperature suitable for firing and preheats the water to compensate for the shortfall in heat liberation when a gas boiler is converted to use liquid fuel. In another aspect of the invention, production of steam is achievable consistently by employing step-up heaters with a steam injection boiler. The heaters being connected in parallel to continue heating the water/steam to achieve a higher quality steam over that produced in the boiler while minimizing consideration as to the adverse effects of coil fouling in the boiler.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: January 31, 2006
    Assignee: ACS Engineering Technologies Inc.
    Inventor: Sujit K. Sarkar
  • Publication number: 20050247398
    Abstract: A tool of wafer level package comprises a first base, an elastic material and a second base. The elastic material is coated on the first base, and the elastic material has viscosity in common state to adhere a plurality of dies. The second base is coated by adhesive material to adhere the dies. The plurality of dies are departed from the elastic material by a special environment after adhering.
    Type: Application
    Filed: June 20, 2005
    Publication date: November 10, 2005
    Applicant: Advanced Chip Engineering Technology Inc.
    Inventors: Wen Yang, Wen Yang, Shih-li Chen
  • Publication number: 20050222394
    Abstract: The invention provides synthetic heparin-binding growth factor analogs having two peptide chains each branched from a branch moiety, such as trifunctional amino acid residues, the branch moieties separated by a first linker of from 3 to about 20 backbone atoms, which peptide chains bind a heparin-binding growth factor receptor and are covalently bound to a non-signaling peptide that includes a heparin-binding domain, preferably by a second linker, which may be a hydrophobic second linker. The synthetic heparin-binding growth factor analogs are useful as pharmaceutical agents, soluble biologics or as surface coatings for medical devices.
    Type: Application
    Filed: February 24, 2005
    Publication date: October 6, 2005
    Applicants: BioSurface Engineering Technologies, Inc., Brookhaven Science Associates
    Inventors: Paul Zamora, Louis Pena, Xinhua Lin
  • Publication number: 20050196425
    Abstract: Compounds of the present invention of formula I and formula II are disclosed in the specification and wherein the compounds are modulators of Bone Morphogenic Protein activity. Compounds are synthetic peptides having a non-growth factor heparin binding region, a linker, and sequences that bind specifically to a receptor for Bone Morphogenic Protein. Uses of compounds of the present invention in the treatment of bone lesions, degenerative joint disease and to enhance bone formation are disclosed.
    Type: Application
    Filed: February 22, 2005
    Publication date: September 8, 2005
    Applicants: BioSurface Engineering Technologies, Inc., Brookhaven Science Associates
    Inventors: Paul Zamora, Louis Pena, Xinhua Lin, Kazuyuki Takahashi
  • Patent number: 6939110
    Abstract: A system for maintaining constant pressure, such as at a mosquito fogging nozzle, by electronically controlling the speed of an engine that is coupled to a blower. A pressure sensor measures the pressure provided by the blower and provides a pressure signal to the electronic engine controller. The engine controller is of the proportional-integral (PI) type and utilizes pulse-width modulation (PWM) techniques to control an electromechanical actuator attached to the throttle of the engine to vary the engine speed. Constant pressure is maintained despite changes in the ambient temperature, humidity and barometric pressure. A safety circuit prevents engine over-speed if the pressure signal is lost. An over-speed circuit monitors and controls the engine speed at higher RPMs.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: September 6, 2005
    Assignee: Clarke Engineering Technologies, Inc.
    Inventors: Larry D. Conner, Donald S. Foreman