Patents Assigned to Engineering
  • Publication number: 20090008485
    Abstract: Crushing finely the chipped rubber such as that of waste tire is done by further small number of crushers, and the capture rate of the target size of the rubber particles is improved. With a crusher which finely crushes the chipped rubber (G) such as that of waste tire, the chipped rubber (G) is supplied to a crusher (10a) structured by a rotating roll (12) having relatively rough groove pitch and pluralities of fixed blades (14) each of which has pluralities of grooves forming crushing edges, thus conducting crushing. The rubber particles (G) discharged from the crusher (10a) are again supplied to the crusher (10a) to repeat the crushing to conduct rough-finishing operation. Then, thus roughly-finished rubber particles (G) are treated by similar crushing operation using a rotating roll (10b) having relatively small groove pitch to conduct finish treatment. The finely-crushed rubber particles are classified using a sieve (16) to specified size ranges.
    Type: Application
    Filed: August 22, 2006
    Publication date: January 8, 2009
    Applicants: Bridgestone Corporation, Bridgestone Plant Engineering Co., Ltd.
    Inventors: Eiji Yano, Tetuya Tomiyasu
  • Publication number: 20090010784
    Abstract: Improved resin-bonded powdered metal components are protected against corrosion and reduction of crush strength during contact with corrosive fluids such as alcohols, ethanol-containing fuels, glycols and peroxide-containing fuels by a resin system coating that, when cured, provides a relatively high crosslink density and relatively few hydrolysable radicals. Magnetic properties of resin-bonded powdered metal magnets are protected from heat degradation by the cured resin coating. The coating can be a heat-cured resin system comprising a phenol novolac resin and a compatible hardener. In one embodiment magnetizable powdered materials have an uncured resin system coating to provide a B-stage material that can be cured after compression shaping.
    Type: Application
    Filed: May 13, 2008
    Publication date: January 8, 2009
    Applicant: MBS Engineering, LLC
    Inventors: Edward E. Welker, Mitchell L. Spencer, Viswanathan Panchanathan
  • Publication number: 20090008511
    Abstract: A bracket (20) for attachment to a side of a radio or other multimedia instrument (40) having a leading edge (22) with an outwardly projecting, generally U-shaped rib (23) positioned inwardly of a free end of the leading edge, and/or an in-turned flange (26) positioned away from the leading edge of the bracket and having a tab (27) extending normally from the flange for engagement with the instrument to support and position the instrument during attachment of wiring elements to the instrument.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 8, 2009
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Erik A. Wippler, Kerry S. Zellner, JR.
  • Publication number: 20090008418
    Abstract: This invention relates to a driving device for the clothes press iron 4 or 14 for pressing a front side or rear side of the torso 3 for putting on the clothes 2 and press finish the clothes 2. The driving device of this invention is formed by the vertical-oriented cylinder device 5 oscillated in a forward or rearward direction of the torso 3 and the link device 6 fixed at the extremity end of the rod 5a of this cylinder device 5 to convert an extending or retracting operation of the rod 5a into an advancing or retracting operation of the clothes press iron 4 or 14. The main body 6a of the link device 6 is preferably set such that six link members 10 are connected in a substantial hexagonal shape as seen from the side of the torso 3 by the axle member 9 along a lateral direction of the torso 3. In accordance with this invention, it is possible to restrict a depth size of the finishing machine and a compact-sized finishing machine and its space saving can be attained.
    Type: Application
    Filed: July 3, 2008
    Publication date: January 8, 2009
    Applicant: Sankousha Engineering Co., Ltd.
    Inventor: Mitsuyuki Uchikoshi
  • Publication number: 20090011928
    Abstract: The invention relates to methods of preparing metal particles on a support material, including platinum-containing nanoparticles on a carbon support. Such materials can be used as electrocatalysts, for example as improved electrocatalysts in proton exchange membrane fuel cells (PEM-FCs).
    Type: Application
    Filed: July 2, 2008
    Publication date: January 8, 2009
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Sandia Corporation, Operator of Sandia National Laboratories, Toyota Motor Corporation
    Inventors: Tochi Tudor Nwoga, Kazuo Kawahara, Li Wen, Yujiang Song, John A. Shelnutt, James E. Miller, Craig John Medforth, Yukiyoshi Ueno, Tetsuo Kawamura
  • Patent number: 7473581
    Abstract: A method of wafer stacking packaging. The method comprises providing a die array including a plurality of singulated first dies cut from a first wafer; providing a second wafer with inseparate the second dies and an adhesive layer on an active surface thereof; pre-cutting the second wafer to a specified depth from the active surface thereof; stacking the active surface of second wafer onto a backside of the first dies, wherein each of the second dies only stack on one of the first dies; thinning the second wafer from the backside thereof to form a plurality of singulated the second dies stacked on the first dies simultaneously.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: January 6, 2009
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventor: Su Tao
  • Patent number: 7473989
    Abstract: A flip-chip package comprises a substrate with an opening. A dummy die is disposed onto the substrate corresponding to the opening so as to form a composite chip carrier with a chip cavity. The dummy die has a redistribution layer which includes a plurality of flip-chip pads for flip-chip connection of a chip and a plurality of connecting pads around the dummy die for connecting the substrate. The dummy die mounts at least a chip by flip chip connection for being an electrical interface medium between the chip and the substrate in order to achieve thinner package thickness, high heat dissipation, fine pitch flip-chip mounting and eliminating flip-chip stress on the chip.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: January 6, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chaur-Chin Yang, Sung-Fei Wang
  • Patent number: 7472720
    Abstract: A surge tank is sized to retain a volume of fluid. A fluid inlet/outlet port is attached to the tank, and an elastomeric bladder is disposed within the tank and separates the fluid from a volume of gas. A nozzle system is disposed within the tank and has a nozzle member comprising a first plurality of axially elongate perforations, and a second plurality of perforations. The nozzle member can extend a partial or complete distance with tank. The tank body includes a throat that extends outwardly from a portion of the tank adjacent the port, and a portion of the nozzle member comprising the first plurality of perforations is disposed within the throat. An annular space exists adjacent the nozzle member in the neck to facilitate the flow of solid constituent within the fluid from the tank and into the nozzle member.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: January 6, 2009
    Assignee: Young Engineering & Manufacturing, Inc.
    Inventor: Winston B. Young
  • Patent number: 7472784
    Abstract: A conveyor belt cleaner scraper blade for cleaning the surface of a conveyor belt and a method of manufacture of the scraper blade. The scraper blade includes a body having a base member adapted to be attached to a cross shaft of a conveyor belt cleaner and a scraping member which extends outwardly from the base member to a scraping tip. The scraper blade includes one or more electrical sensors that are embedded in an insert member. The insert member and the sensors are molded and embedded within the body of the scraper blade. Each of the sensors is adapted to provide an electrical output signal representing a physical condition of the scraper blade sensed by the sensor. A variety of sensor embodiments are described, as well as two embodiments of control and monitoring systems for use in conjunction with the various blade and sensor combinations.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: January 6, 2009
    Assignee: Martin Engineering Company
    Inventors: R. Todd Swinderman, Andrew J. Waters, Pablo F. Perez, Phillip E. Dietsch
  • Patent number: 7473998
    Abstract: A method of forming bump protective collars is disclosed. A wafer has an active surface with a plurality of bonding pads and a passivation layer. A plurality of reflowed bumps are formed over the bonding pads. A photoresist is coated on the active surface. Using the reflowed bumps as a photo mask, the photoresist is exposed and developed. After removing the photoresist, a plurality of bump protective collars are formed on the passivation layer and around the reflowed bumps for improving the reliability of the reflowed bumps.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: January 6, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Chi-Long Tsai
  • Patent number: 7472937
    Abstract: An apparatus and method for gripping containers, each having a circumference, for dumping material in a material collection vehicle including more than one gripping mechanisms, wherein each of the gripping mechanisms can engage a container around at least one-half of the circumference of the container. In one embodiment, the gripping mechanism is attached to a base member and includes an outer gripping member pivotally attached to the base member and an inner gripping member pivotally attached to the base member and an actuating mechanism for moving at least one gripping member toward the other gripping member.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: January 6, 2009
    Assignee: Wayne Engineering Corporation
    Inventors: Fred P. Smith, Todd R. Mendenhall
  • Patent number: 7472669
    Abstract: A pressure pulse generator includes a pressure pulse transmitting body displaceably arranged in a chamber divided by the body into a first and a second part, a first spring and a second spring, arranged to displace the body in a first direction and a second direction respectively in the chamber, a first conduit leading between a high pressure source and a first part of the chamber, wherein the pressure fluid in the first part acts on the body for displacing the latter in the second direction, and elements for opening/interrupting a communication between the first part and the high pressure source through the first conduit. The opening/interrupting elements interrupt communication while the body is displaced in the first direction from a predetermined starting position through a triggering of the first spring, and maintain communication while the body is displaced in the second displacement direction back to the starting position, whereby a biasing of the first spring is accomplished.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: January 6, 2009
    Assignee: Cargine Engineering AB
    Inventor: Mats Hedman
  • Patent number: 7473629
    Abstract: A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: January 6, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Chang Tai, Chi-Chih Chu, Meng-Jung Chuang, Cheng-Yin Lee, Yao-Ting Huang, Kuang-Lin Lo
  • Patent number: 7472948
    Abstract: The vehicle body structure is suitable for use in two-door automobiles. The strength of a rearward part of the vehicle body is increased to reliably suppress the deformation of the vehicle body in a possible collision from behind the vehicle. The vehicle body structure includes: a rear wheel house arranged to the rear of a center pillar; and a reinforcement member directly connecting a front part in front of the top portion of the rear wheel house with the center pillar, the front part being inclusive of the top portion of the rear wheel house.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: January 6, 2009
    Assignees: Mitsubishi Jidosha Engineering Kabushiki Kaisha, Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Takayuki Yatabe, Keishi Goto, Masashi Umeda, Akitoshi Shii
  • Patent number: 7474906
    Abstract: A system for evaluating the cardiovascular system parameters using indicator dilution and non-invasive or minimally invasive detection and calibration methods are disclosed. Intravascular indicators are stimulated, and emissions patterns detected for computation of cardiac output, cardiac index, blood volume and other indicators of cardiovascular health.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: January 6, 2009
    Assignee: Alfred E. Mann Institute for Biomedical Engineering at the University of Southern California
    Inventors: Eduardo H. Rubinstein, Daniel P. Holschneider, Jean-Michel I. Maarek
  • Patent number: 7474192
    Abstract: An improved Rogowski coil is formed on a toroidal core made of a thermoplastic or other moldable material, the core having a preferably continuous groove or grooves extending around the core. The grooves correspond in size to magnet wire which registers within the grooves, thus controlling the specific location of the wires. The grooving may be helical. A return loop can be provided for return path cancellation, or a reverse winding can be added in a direction opposite to the direction of advancement of the main coil. In using the return loop, a resistive network can be added to improve the cancellation of the return path due to the effect of geometries. In addition, it can compensate for thermal and other variations.
    Type: Grant
    Filed: June 4, 2007
    Date of Patent: January 6, 2009
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Veselin Skendzic, James R. Kesler
  • Patent number: 7473356
    Abstract: An object of the invention is to provide a wastewater treatment system using a superconducting magnetic separator that can wash the magnetic filter efficiently. The system comprises in a bore of a superconducting magnet a removably built-up multiunit magnetic filter consisting of a plurality of single-unit magnetic filters. The multiunit magnetic filter has a total longitudinal length at least equal or greater than that of the superconducting magnet. During excitation of the superconducting magnet, a single-unit magnetic filter is removed from the upstream side (sewage side) of the multiunit magnetic filter by pushing in another single-unit magnetic filter from the downstream side (clean water side), and washed and returned to the downstream side again.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: January 6, 2009
    Assignees: Niki Glass Co., Ltd, Tatsumi Air Engineering, Ltd, Futaba Shoj, Co., Ltd
    Inventors: Takefumi Niki, Yasuhiro Noda, Tatsuo Fukunishi
  • Patent number: 7473726
    Abstract: The invention relates to a fire-resistant composition containing at least one star polyamide and a flame retardancy system comprising a phosphinate and a melamine reaction product. The inventive composition can be used to produce elements having a low flame-spread rating upon combustion as well as satisfactory mechanical properties. Said composition is particularly suitable for producing molded elements that are used in the field of electrical and electronic connector technology.
    Type: Grant
    Filed: August 8, 2003
    Date of Patent: January 6, 2009
    Assignee: Rhodia Engineering Plastics S.R.L.
    Inventors: James Mitchell, Daniele Galli
  • Patent number: D584180
    Type: Grant
    Filed: April 10, 2008
    Date of Patent: January 6, 2009
    Assignee: Whelen Engineering Company, Inc.
    Inventor: William J. Pokorny
  • Patent number: D584544
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: January 13, 2009
    Assignee: Mikkelsen Graphic Engineering, Inc.
    Inventor: Ron Dir