Abstract: The present invention is directed to devices and methods of using a surgical drain, and more particularly to a surgical drain having at least one sensor for monitoring and/or recording the condition of the anatomical site or fluid emitted from the site where the surgical drain is placed. The invention may also include modifications of the surgical drain to improve stabilization or immobilization in the proximity of the anatomical site to be monitored.

Abstract: An advanced modular plug connector assembly incorporating an insert assembly disposed in the rear portion of the connector housing. In one embodiment, the connector has a plurality of ports in multi-row configuration, and the insert assembly includes a substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. The substrate also interfaces with the conductors of two modular ports of the connector, and is removable from the housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet and 10/100). In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: A spade drill insert and drilling tool assembly is provided wherein the spade drill insert body comprises curved cutting edges and a lip groove having a trough substantially parallel to a plane formed through each adjacent curved cutting edge, which provides a significant improvement in chip formation during cutting operations.

Abstract: A method for determining contamination in marine diesel lubricating oils. The method has been found to have particular utility in estimating residual fuel and insolubles contamination in marine diesel lubricating oils.

Abstract: The present disclosure is directed toward a process for the simultaneous production of two different types of engineered wood products, or oriented strand wood products, each product having different predetermined properties. The present disclosure provides a process which has enhanced utilization of wood resources and can simultaneously produce engineered wood product of various grades and properties from the same log source.

Abstract: A wafer-level chip package process is provided. First, a transparent substrate having a chip sealing layer and a transparent layer is provided. Then, the chip sealing layer is cut to form a first groove of a predetermined depth, and an adhesive is formed on the chip sealing layer. Next, a wafer having a back surface and an active surface is provided, and the transparent substrate is disposed on the active surface of the wafer, wherein the chip sealing layer is adhered to the active surface by the adhesive. Next, the transparent layer is cut to form a second groove corresponding to the first groove. Next, the back surface of the wafer is cut to form a third groove corresponding to the first groove. After that, the wafer and the transparent substrate are singulated to form a plurality of chip package structures.

Abstract: A hand-held, fleet deployable infrared camera with integrated hardware and software providing real time processing of infrared images. The camera senses variable temperature images over a selected object of interest and senses variable emissivities over the object. The camera also measures and corrects for reflected environmental radiation as well as corrections for the atmospheric path through which the object is viewed. A calibrated reference patch having known emissivity and reflectance is attached to an object of interest and viewed through the camera. The calibrated patch is used to provide correction for the environmental radiation reflected off the object. Once the environmental radiation correction is known, it can be used to correct measurements taken from the rest of the object of interest.

Abstract: A hinged hanging device adapted to be mounted over the top of a door. The device can be adjusted to extend outwardly from the surface of the door to provide a support for conventional hangers or to fold substantially flat against the door surface.

Abstract: The method includes a step of picking and placing standard good dice on a base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The method of the chip-size package comprises the steps of separating dice on a wafer and picking and placing the dice on a base and filling a first material layer on the base into a space among the dice on the base. A dielectric layer with first openings is patterned to expose a portion of a conductive line of the dice. A conductive material is filled into the first openings and on the dielectric layer. Subsequently, a second material layer is formed to have a second openings exposing the conductive material and then welding solder balls on the second openings.

Abstract: A fluid feeding apparatus capable of excluding the outer environmental influences in feeding a fluid susceptible to contamination, decomposition or denaturation on contact with the outer environment. The includes comprises at least one liquid source container, a cleaning and/or diluting liquid container, a waste liquid collection container, an inert gas feed pipe A, an inert gas feed pipe B, an evacuation pipe connecting to a vacuum source, and a fluid feed pipe for introducing the fluid to a process. The source container has two pipes. The first pipe has valves arranged therein at positions nearer to and farther from the source container, respectively. The second pipe has two valves arranged therein at positions nearer to and farther from the container, respectively. The path between the valves 1 and 4 and the path between the valves 2 and 5 are connected via a connecting pipe C having a valve 3.

Abstract: A nozzle design and method for designing such a nozzle being adapted for three phase slurry flow from the choke into the flash tank during pressure let-down in autoclave mining operations that uses a selection of the expansion ratio in the choke to select a nozzle dispersion angle to select a spread of the flow over the slurry pool in the flash tank, to generally maximize the use of the pool for energy dissipation without causing undo wear and tear on the tank walls.

Abstract: The present invention provides a polycrystalline silicon conducting structure (e.g., a resistor) whose resistance value is controlled, and can be less variable and less dependent on temperature with respect to any resistant value, and a process of producing the same. Use is made of at least a two-layer structure including a first polycrystalline silicon layer of large crystal grain size and a second polycrystalline silicon layer of small crystal grain size, and the first polycrystalline silicon layer has a positive temperature dependence of resistance while the second polycrystalline silicon layer has a negative temperature dependence of resistance, or vice versa. Moreover, the polycrystalline silicon layer of large grain size can be formed by high dose ion implantation and annealing, or by depositing the layers by chemical vapor deposition at different temperatures so as to form large-grain and small-grain layers.

Abstract: An isolated polypeptide comprising an amino acid sequence that is at least 62% identical to SEQ ID NO:2. The polypeptide, when present in a cell, increases the cell's ability to tolerate glyphosate. Also disclosed are related nucleic acid, antibody, vector, transgenic plant, as well as uses thereof.

Abstract: The system includes a distance protective relay for power lines which includes a logic capability which is responsive to settings entered into the relay by an end user to implement the value of those settings into stored thermal model equations which emulate the temperature of the power line conductor. The logic within the relay is organized and has the capability of receiving the setting values entered by the user and to use those in the logic equations to determine the temperature of the conductor.

Abstract: A surface finishing method for aluminum shapes by barrel polishing, wherein caps are mounted at both open ends of a hollow aluminum shape, and two aluminum shapes each mounted with the caps are set on two right and left holders so as not to interfere with each other, the two aluminum shapes held above and below by the two right and left holders are next put in a barrel pot, and water, a compound, and a medium are put in the barrel pot, and then the barrel pot is closed by a lid. A plurality of barrel pots are installed on a centrifugal barreling machine, and the centrifugal barreling machine is operated so that the aluminum shapes are rotated and revolved.

Abstract: The present invention is a stay for retaining cables or other long, flexible structures in a coiled or bundled condition. The stay retains an end of the cable in an shape in which the end is wrapped around the coil or bundle when desired, such that a user of the cable can wrap the end of the cable around the coil or bundle and have the end retained in such position without having to knot the end to keep it wrapped around the cable or bundle. The stay may use a ductile or malleable element oriented along an end of the cable, such that the cable end to which the stay is affixed may be bent into a position in which the end is wrapped around a cable coil or bundle. The stay may use a helical form such that an end of a cable forms a helical shape, such that helical shape may be wrapped around a cable coil or bundle to retain the end around the coil or bundle.

Abstract: In wafer-level formation of a package structure of semiconductor, multitudes of conductive connection structures are formed protruded from a transparent substrate. Multitudes of grooves are formed in a semiconductor wafer and an adhesive is filled therein. The wafer and the transparent substrate are jointed in which each of the conductive connection structures are positioned in one of the grooves and exposed outside of another surface of the semiconductor wafer. A package structure is obtained by sawing the wafer and has electrical connection between the signals of the active side and back side through the conductive connection structures.