Patents Assigned to Engineering
  • Patent number: 6715268
    Abstract: A card package production system (100) for producing card packages (115) composed of printed paper carriers (113) with matching cards (128) attached to the carriers (113) selectively outputs the card packages through a card package multi-directional distribution module (136) having a carrier transport with a primary carrier transport path extending between a package inlet (262) and a primary package outlet (144) for transporting the card packages along the primary carrier transport path. A movable stacker gate assembly (214, FIG. 7) mounted for movement between a stacking position (FIG. 26). In the stacker position, the card packages are inserted laterally through a laterally facing inlet (145) of a stacker (146) in two stages with successive pairs of card packages (115, 115′) being kept in an interleaved state.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: April 6, 2004
    Assignee: Dynetics Engineering Corporation, Inc.
    Inventors: Jeffery L. Hill, Gregory S. Hill, Fred J. Kassabian
  • Patent number: 6716020
    Abstract: A machine and method for forming a spring coil in a length of hollow, cylindrical thermoplastic tubing comprises clamping the ends of a predetermined length of cylindrical thermoplastic tubing between first and second opposing spaced clamping members. In the machine, these clamping members include aligned first and second sections of a mandrel. These first and second clamping members then are rotated relative to one another by a predetermined amount selected to be slightly in excess of 360°, while the mandrels are simultaneously moved toward one another, to shorten the distance between the ends of the length of tubing, while the coil is formed. At the end of this relative rotation, the mandrel sections engage one another. The clamped tube, with the coil now formed around the mandrels, is rotated and simultaneously heated to the thermosetting temperature of the tubing. After a sufficient time to establish thermosetting of the coil, the heat is removed. Rotation continues while the tube is cooled.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: April 6, 2004
    Assignee: International Polymer Engineering, Inc.
    Inventor: Thomas E. Hargreaves
  • Patent number: 6716490
    Abstract: A method for making an enameled steel sheet includes the steps of spraying a slurry to form a slurry layer onto a surface of a substrate and firing the slurry layer. In this method, the slurry has a static surface tension of 50 dyne/cm or less and an apparent viscosity of 500 mPa·s that is measured with a model E viscometer at a rotation of 100 rpm. Alternatively, the method includes a step of spraying a slurry for forming an enamel layer onto a surface of a substrate, wherein the substrate is vibrated when the slurry is applied or when the slurry applied is still fluid.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: April 6, 2004
    Assignee: Kawasaki Steel Metal Products & Engineering Inc.
    Inventors: Kazuhiro Hayashi, Masao Taguchi, Yasumasa Fukushima, Masato Takagi, Shinichi Noma
  • Patent number: 6716358
    Abstract: The invention includes a method for demulsification of water-in-oil emulsions.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: April 6, 2004
    Assignee: ExxonMobil Research and Engineering Company
    Inventor: Ramesh Varadaraj
  • Patent number: 6716482
    Abstract: A method of forming a wear-resistant reinforcing coating on a substrate, such as concrete, wood, metal or particulate. A reinforcing fiber mat is placed on the substrate and a liquid matrix material is mixed with small colored stones. The mixture of matrix material and stones is poured onto the mat, and the liquid wets the mat and contacts the substrate. After curing, a composite coating is formed with stones as the wearing surface. A membrane can be interposed between the substrate and the reinforcing coating to prevent adhesion and “starving” of the mat.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: April 6, 2004
    Assignee: Engineered Composite Systems, Inc.
    Inventor: Steven E. Morton
  • Patent number: 6717253
    Abstract: An assembly package includes a substrate, a first die, at least one signal transmission plate, at least one second die, a plurality of conductive wires, and a molding compound. The first die is electrically connected with the substrate using flip-chip bonding. The signal transmission plate is provided on the first die and includes an insulating layer, a layout wire layer, and a solder mask layer. The layout wire layer is formed on the insulating layer, and the solder mask layer is formed on the layout wire layer. The solder mask exposes partial area of the layout wire layer at the center and peripheries of the signal transmission plate to form a plurality of die bonding pads and a plurality of wire bonding pads. The second die is electrically connected with the die bonding pads using flip-chip bonding, and the wire bonding pads are electrically connected with the substrate via the conductive wires so that the signals from the second die are transmitted to the substrate.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: April 6, 2004
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Chaur-chin Yang
  • Patent number: 6717352
    Abstract: A gap defined between cathode wires 2 having electron emitting sources 2a and control electrodes 4 is made uniform and a thickness of an insulation layer 3 interposed between both of them is made thin or the insulation layer 3 is eliminated whereby the electron emission characteristics and the high-frequency driving of high performance can be realized. The control electrodes 4 which have recessed portions 4c in plate-like members and have holes 4a for allowing electrons to pass therethrough in bottom portions thereof restrict the gap defined between the cathode wires 2 and the control electrodes 4 by adjusting a plate-thickness direction size of the holes 4a formed in the control electrodes 4.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: April 6, 2004
    Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.
    Inventors: Shigemi Hirasawa, Kenji Miyata, Tomio Yaguchi, Yuuichi Kijima, Hiroshi Kawasaki
  • Patent number: 6715662
    Abstract: A continuous controlled atmosphere brazing system includes a dry-off oven for driving off moisture from materials to be brazed, a pre-heat section for pre-heating the material and a brazing furnace for brazing the materials. Heated gas produced in the pre-heat section and the brazing furnace is conveyed along a flowpath to the chamber of the dry-off oven to provide substantially the sole source of heat for the oven. The flowpath for the heated gas is defined by a series of tubes in communication with each component of the brazing system and intermediate manifolds disposed between components. The discharge mouths of the tubes open into the oven chamber at the suction side of recirculation fans operating within the oven. The overall temperature of the oven can be regulated by controllably mixing ambient air with the heated gas in relation to the oven temperature.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: April 6, 2004
    Assignee: Rogers Engineering & Manufacturing Co., Inc.
    Inventors: William A. Rogers, Donald A. Marangoni, Steven G. Dennis
  • Patent number: 6716736
    Abstract: In a method for manufacturing an under-bump metallurgy (UBM) layer, a plate having a plurality of openings is prepared. Then, the plate is placed on the wafer. Finally, the material of the under-bump metallurgy layer is sputtered on the wafer using the plate as a sputter mask so as to quickly form the under-bump metallurgy layer.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: April 6, 2004
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Kuang Chen, Chih-Hsiang Hsu
  • Patent number: 6717024
    Abstract: A slurry Fischer-Tropsch hydrocarbon synthesis process for synthesizing liquid hydrocarbons from synthesis gas in a synthesis reactor also hydroisomerizes the synthesized hydrocarbon liquid, which comprises the slurry liquid, in one or more lift reactors immersed in the slurry body in the synthesis reactor. A monolithic catalyst is preferably used for the hydroisomerization, and slurry circulation up through the lift reactors from the surrounding slurry body, is achieved at least in part by the lift action of the hydroisomerization treat gas. Preferably, catalyst particles are also removed before the slurry contacts the catalyst. Hydroisomerization occurs while the synthesis reactor is producing hydrocarbons, without interfering with the synthesis reaction. A gas bubble reducing downcomer may be used to produce and feed the gas bubble reduced slurry into the lift reactor, thereby providing a hydraulic head assist in the slurry circulation up through and out of the lift reactor.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: April 6, 2004
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Robert Jay Wittenbrink, Charles John Mart, Janet Renee Clark, Jennifer Schaefer Feeley
  • Patent number: 6716739
    Abstract: A method of forming bumps on the active surface of a silicon wafer. A first under-ball metallic layer is formed over the active surface of the wafer. A second under-ball metallic layer is formed over the first under-ball metallic layer. A portion of the second under-ball metallic layer is removed to expose the first under-ball metallic layer. A plurality of solder blocks is implanted over the second under-ball metallic layer. A reflux operation is conducted and then the exposed first under-ball metallic layer is removed so that only the first under-ball metallic layer underneath the second under-ball metallic layer remains.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: April 6, 2004
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee
  • Patent number: 6717053
    Abstract: A work surface electrical power distribution system including a plurality of first housing portions each having a different visual indicator and an electrical power assembly. The electrical power assembly including at least one electrical power receptacle, a second housing portion removably mountable to a work surface, the at least one electrical power receptacle connected to the second housing portion and a selected one of the plurality of first housing portions removably attached to the second housing portion.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: April 6, 2004
    Assignee: Dekko Engineering, Inc.
    Inventor: Brian K. Rupert
  • Patent number: 6717877
    Abstract: A semiconductor integrated circuit device includes a first variable delay circuit which delays a timing signal for activating a sense amplifier which is supplied with a signal read out from a memory array and amplifies the signal so that a timing difference between a dummy signal read out from a dummy memory cell and the timing signal of the sense amplifier is detected by a detection circuit to be made small in accordance with an output of the detection circuit, and a second variable delay circuit which adjusts a relative timing difference between the dummy signal and the timing signal of the sense amplifier.
    Type: Grant
    Filed: January 8, 2002
    Date of Patent: April 6, 2004
    Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.
    Inventors: Takeshi Suzuki, Shigeru Nakahara, Keiichi Higeta, Takeshi Kusunoki
  • Patent number: 6715351
    Abstract: A improved vehicle wheel balancer for a wheel assembly including an adjustable wheel data acquisition arm configured to transition from at least a first operating position adapted for use with vehicle wheels having a first range of inner diameters, to at least a second operating position adapted for use with vehicle wheels having a second range of inner diameters which differ, at least in-part, from the first range of inner diameters.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: April 6, 2004
    Assignee: Hunter Engineering Company
    Inventors: William B. Feero, Nicholas J. Colarelli, III, Michael D. Gerdes, Michael W. Douglas
  • Patent number: 6715506
    Abstract: The present invention is a method and apparatus for ejecting a very small amount of liquid at high speed and precisely independent of the viscosity of the liquid. This apparatus and method begins by applying pressure to the liquid prior to starting ejection of the liquid and/or holding a pressure near an ejection orifice after the end of liquid ejection at a predetermined specific value so that an ejection rate of the liquid through the ejection orifice is kept constant. This apparatus and method is able to control the liquid temperature and able to refill the liquid without entrapment of bubbles occurring.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: April 6, 2004
    Assignee: Musashi Engineering, Inc.
    Inventor: Kazumasa Ikushima
  • Patent number: 6716258
    Abstract: This invention relates to a diesel fuel composition comprising a major amount of a base fuel and a relatively minor amount of at least one chemical component other than that generated in a refinery process stream which component is miscible with the base fuel in such proportions that the T30 temperature of the resultant composition is in the range from 205-240° C. The control of the T30 temperature within the specified range by blending with the minor component results in a significant reduction in particulate emissions.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: April 6, 2004
    Assignee: ExxonMobil Research and Engineering Company
    Inventor: Lisa I-Ching Yeh
  • Patent number: 6716718
    Abstract: A trench is formed by performing an anisotropic etching treatment on a silicon substrate with the use of a mask pattern including a pad oxide film, a polysilicon film, and a silicon nitride film formed on the silicon substrate, as a mask. Next, the side surface of the polysilicon film is retreated by etching so that the part of an oxide film formed on the side surface of the polysilicon film may not be hung over the part of an oxide film formed on the side surface of the pad oxide film. Next, an oxide film is formed by performing a thermal oxidation treatment on the inner wall surface of the trench including the exposed side surface of the polysilicon film. This produces a semiconductor device that prevents voids from being formed in a trench isolation structure.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: April 6, 2004
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
    Inventors: Hiroyuki Nagatani, Kouji Taniguchi
  • Publication number: 20040060982
    Abstract: A point of sale terminal including point of sale transaction circuitry, and a socket for selectably receiving and supporting a mobile computing/communicating device and for permitting communication between the mobile computing/communicating device and the point of sale transaction circuitry. The point of sale transaction circuitry is operative both independently of and in cooperation with the mobile computing/communicating device.
    Type: Application
    Filed: September 25, 2003
    Publication date: April 1, 2004
    Applicant: Lipman Electronic Engineering Ltd.
    Inventor: Shlomo M. Zenou
  • Publication number: 20040060354
    Abstract: Resin members, on the surfac s of which metal films are formed, are used for; an auxiliary air passage provided in a main air passage, in which a sensor element of a physical quantity sensor such as an air flow sensor, an intake-air temperature sensor, etc., is situated; a housing; and so forth; in order to decrease both the thermal conductivity and the emissivity of those components to respective small values, whereby the temperature increase of the sensor due to both the heat conduction and the heat radiation can be suppressed.
    Type: Application
    Filed: October 1, 2003
    Publication date: April 1, 2004
    Applicants: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Izumi Watanabe, Naoki Saito, Masayuki Kozawa, Keiichi Nakada, Kei Ueyama
  • Publication number: 20040064046
    Abstract: A breast tomography scanner including a stationary chamber configured to hold fluid, a movable chamber within the stationary chamber configured to hold fluid, and breast scanning apparatus. Various configurations for housing the ultrasonic transducers are disclosed, along with filling and draining apparatus, leakage protections turbulence-reduction configurations and control systems.
    Type: Application
    Filed: June 27, 2003
    Publication date: April 1, 2004
    Applicants: Alfred E. Mann Institute for Biomedical Engineering, at the University of Southern California
    Inventor: Ramez E.N. Shehada