Abstract: The present disclosure provides a detection module including a carrier configured to be adjustable to at least partially conform to a shape of a wearable object. The detection module further includes a sensing element in contact with the carrier and at least partially exposed from the carrier.
Type:
Application
Filed:
July 15, 2021
Publication date:
January 19, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: A construction method for a radiation-proof concrete hole reserved split bolt includes: 1) mounting a hole reserved sleeve; 2) mounting an inclined recoverable split bolt; 3) mounting an inclined split bolt; 4) fixing the inclined recoverable split bolt and an inclined split bolt main body; 5) pouring concrete, and dismantling related components; 6) plugging the inclined split bolt main body; and 7) plugging the hole reserved sleeve. According to the construction method, the hole reserved sleeve is obliquely arranged, the inner side of the hole reserved sleeve is sprayed with a radiation-proof coating with the functions of reducing radiation ray reflection and absorbing certain radiation rays, and in addition, after the construction of a pipeline or a line in the hole reserved sleeve is finished, the openings at both ends of the hole reserved sleeve are plugged with a radiation-proof mortar incorporated with a micro-expanding agent and a waterproof agent.
Type:
Application
Filed:
June 21, 2022
Publication date:
January 19, 2023
Applicants:
China Railway The Third Engineering Group Construction and Installation Engineering Co., Ltd., The Third Engineering Group Co., Ltd. of China Railway
Abstract: A support frame for dust collection system including a drum filter and a filter cleaning system is disclosed where the frame includes a plurality of octagonal supports spaced apart from each other in an axial direction defining an octagon-shaped peripheral profile. A plurality of axial members extend between adjacent octagonal supports, and end covers are secured to the frame members with each cover including a first inlet opening and a second inlet opening. The support frame may be used in a modular dust collection with a plurality of modular segments of filter media segments secured to the frame and a filter cleaner segments corresponding to the filter media segments.
Type:
Application
Filed:
July 13, 2021
Publication date:
January 19, 2023
Applicant:
Engineered Recycling Systems, LLC
Inventors:
Andreas Fischer, Michael P. Carver, SR., James P. Cunningham, Jamie Castro
Abstract: A method includes obtaining, via a power system device, a source media access control (SMAC) address. The method includes generating, via the power system device, an Ethernet frame of power system data with a destination media access control (DMAC) address comprising at least a portion of the SMAC address. The method includes sending, via the power system device, the Ethernet frame to an intelligent electronic device (IED) of a power system.
Type:
Application
Filed:
July 12, 2021
Publication date:
January 19, 2023
Applicant:
Schweitzer Engineering Laboratories, Inc.
Abstract: A semiconductor package structure and a method of manufacturing the same are provided. The semiconductor package structure includes a first electronic component, a second electronic component, and a reinforcement component. The reinforcement component is disposed above the first electronic component and the second electronic component. The reinforcement component is configured to reduce warpage.
Type:
Application
Filed:
July 15, 2021
Publication date:
January 19, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic device, a package structure and an electronic manufacturing method are provided. The electronic device includes a substrate, a first bump, a second bump and a first reflowable material. The first bump is disposed over the substrate, and has a first width. An end portion of the first bump defines a first recess portion. The second bump is disposed over the substrate, and has a second width less than the first width. The first reflowable material is disposed on the first bump and extends in the first recess portion.
Type:
Application
Filed:
July 16, 2021
Publication date:
January 19, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic structure, an electronic package structure and method of manufacturing an electronic device are provided. The electronic structure includes a carrier and a protection layer. The carrier includes a first pad, a second pad and a first dielectric layer. The first pad is at a side of the carrier and configured to bond with a conductive pad. The second pad is at the side of carrier and configured to electrically connect an exterior circuit. The first dielectric layer includes a first portion around the first pad and a second portion around the second pad, wherein a top surface of the first portion and a top surface of the second portion are substantially coplanar. The protection layer is on the second pad and covers the second pad.
Type:
Application
Filed:
July 16, 2021
Publication date:
January 19, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: Embodiments described herein generally relate a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core, a composite material pattern, and a surface coating pattern. The inner core is surrounded by an outer core having a thickness and an outer surface. The composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The surface coating pattern is on the outer surface and is changeable between a low emissivity state and a high emissivity state based on a surface temperature of the emitter device. In the low emissivity state, the emitter device transmits an omni-directional radiation and, in the high emissivity state, the emitter device transmits a focused radiation via the composite material pattern.
Type:
Application
Filed:
July 16, 2021
Publication date:
January 19, 2023
Applicant:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.
Type:
Application
Filed:
July 13, 2021
Publication date:
January 19, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Inventors:
Pang Yuan LEE, Kuei-Hao TSENG, Chih Lung LIN
Abstract: A coaxial dual supersonic oxygen flow cluster oxygen lance comprises an inner layer circular-hole supersonic nozzle assembly, an outer layer water-cooled casting assembly, and a middle layer annular-hole supersonic nozzle assembly arranged between the inner layer circular-hole supersonic nozzle assembly and the outer layer water-cooled casting assembly, wherein the circular-hole supersonic assembly generates a first beam of supersonic oxygen jets and the annular-hole supersonic assembly generates a second beam of supersonic oxygen jets surrounding the first beam of supersonic oxygen jets; and the second beam of supersonic oxygen jets and the first beam of supersonic oxygen jets are in the same direction, and the two beams of supersonic oxygen jets are independently supplied with gas, and are independently adjusted.
Abstract: An apparatus may include a first emitter and a second emitter. The first emitter may be configured to emit visible light comprising first heads up display information to be displayed to a driver of a vehicle. The second emitter may be configured to emit infrared light comprising second heads up display information to be displayed to one or more rear seat passengers of the vehicle.
Type:
Application
Filed:
July 14, 2021
Publication date:
January 19, 2023
Applicant:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: A system includes a processor operatively coupled to memory. The processor performs operations that include obtaining electrical measurements of a power system. The processor determines a scaled energy value of a first set of the electrical measurements that are scaled with respect to a second set of electrical measurements. The processor determines that a potential ringdown event occurred by comparing the scaled energy value to a threshold energy value. The processor determines that the potential ringdown event is a confirmed ringdown event by comparing a scaled error value to a threshold error value. The processor generates one or more mode estimates from the confirmed ringdown event.
Type:
Application
Filed:
July 16, 2021
Publication date:
January 19, 2023
Applicant:
Schweitzer Engineering Laboratories, Inc.
Inventors:
Md Arif Khan, Riley Grant Huddleston, Gregary C. Zweigle
Abstract: A package structure and a method for manufacturing a package structure are provided. The package structure includes a substrate, at least one redistribution structure, at least one electronic component and at least one semiconductor die. The substrate has a first surface and a second surface opposite to the first surface. The at least one redistribution structure is disposed on the first surface of the substrate. The at least one electronic component is disposed on the first surface of the substrate. The at least one semiconductor die is disposed on the at least one redistribution structure and electrically connected to the at least one electronic component through the substrate.
Type:
Application
Filed:
September 28, 2022
Publication date:
January 19, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: A bottle configured to house and dispense items. The bottle comprises a body, a finish positioned above the body, and a ramp protruding into an interior space defined by the body. The body includes a base and a sidewall extending up from the base. The body defines the interior space for housing the items. The finish presents an opening for dispensing the items from the body. The ramp is formed with a concave shape configured to support one or more of the items.
Type:
Grant
Filed:
December 16, 2020
Date of Patent:
January 17, 2023
Assignee:
R & D Tool & Engineering Co.
Inventors:
Brian R. Lefebure, Kent Wesley Bersuch, Michael J. Wilkerson, Jincheng Chen
Abstract: Products, systems and methods are disclosed for lowering the concentrations of at least one of preservatives and fibrils in a liquid insulin composition. One method comprises replacing at least a portion of at least one of phenol and m-cresol with at least one of cyclodextrins, cyclodextrin polymers, cyclodextrin beads, and an ion exchange resin.
Type:
Grant
Filed:
October 29, 2020
Date of Patent:
January 17, 2023
Assignee:
Cell and Molecular Tissue Engineering, LLC
Abstract: Solar trackers that may be advantageously employed on sloped and/or variable terrain to rotate solar panels to track motion of the sun across the sky include bearing assemblies and other mechanical features configured to address mechanical challenges posed by the sloped and/or variable terrain that might otherwise prevent or complicate use of solar trackers on such terrain.
Abstract: The present disclosure relates to a recloser control that monitors compliance of a standard for distributed energy resources (DERs). For example, a method includes obtaining power system measurements between a microgrid and an area electronic power system (EPS). The method includes determining a rate of change of power (RoCoP) based on the power system measurements. The method includes determining that a DER exceeded a threshold of the area EPS based at least in part on the RoCoP. The method includes sending a signal indicating that the DER has violated the threshold.
Type:
Grant
Filed:
June 9, 2020
Date of Patent:
January 17, 2023
Assignee:
Schweitzer Engineering Laboratories, Inc.
Abstract: A test method based on a test system for five-dimensional space effects of ground surface settlement caused by dual-mode shield construction is provided. First, manufacturing a formation similarity material model; then, laying ground surface monitoring points in longitudinal and transverse direction; installing a shield machine model, and performing shield construction, the shield machine model adopts a double-shield body mode; performing five-dimensional monitoring during shield construction; designing an observation method for ground surface settlement data in step length and time dimension, and acquiring five-dimensional data in combination with three-dimensional scanning; and finally, performing deformation information processing according to the monitored data, so as to realize an acquisition of the five-dimensional data.
Type:
Grant
Filed:
August 1, 2022
Date of Patent:
January 17, 2023
Assignees:
Qingdao University of Technology, China Construction Fifth Engineering Division Corp., Ltd., Guilin University of Technology
Inventors:
Guangming Yu, Penghui Zhang, Jun Lei, Bin Peng, Lijun Kuang, Weiting Luo, Zihan Yang, Xinpeng Yao, Zhiwen Tan, Qiang Yue, Jiaming Du, Ze Chen, Hao Liu, Li Zhang, Shuguang Zhang
Abstract: A sound absorbing structure includes a wall having a first side and a second side and at least one acoustic scatterer coupled to a first side of the wall. The first side of the wall may be positioned to face a source of noise, such as moving motor vehicles, airplanes, and the like. The at least one acoustic scatterer has an opening and at least one channel. The at least one channel has a channel open end and a channel terminal end with the channel open end being in fluid communication with the opening.
Type:
Grant
Filed:
September 29, 2020
Date of Patent:
January 17, 2023
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: The present invention relates to encapsulated microfluidic packages and methods thereof. In particular embodiments, the package includes a device, a cradle configured to support the device, and a lid having a bonding surface configured to provide a fluidic seal between itself and the device and/or cradle. Other package configurations, as well as methods for making such fluidic seals, are described herein.
Type:
Grant
Filed:
May 27, 2020
Date of Patent:
January 17, 2023
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Inventors:
Darren W. Branch, Philip R. Miller, Thayne L. Edwards, David R. Wheeler