Abstract: Drilling tools are frequently subject to rotation with respect to the central drilling axis caused by torque. A mechanical linkage can be configured to apply force that is proportional to the weight-on-bit on the borehole surface while transmitting axial loads used to generate weight-on-bit. The device can be used to manage drill string twist that could lead to drilling dysfunctions.

Abstract: A processing method of a base material sheet includes winding out the base material sheet wound up by a first core and a first porous sheet wound up by a second core, winding up by a third core the base material sheet and the first porous sheet to be overlapped with each other, and processing the base material sheet by a first processing liquid held in the first porous sheet; and winding out the base material sheet and the first porous sheet overlappingly wound up by the third core, winding up the first porous sheet by the second core, and winding up the base material sheet by the first core.

Abstract: The invention relates to a method for producing a concrete workpiece (1, 60), wherein fresh concrete is poured into a negative (35, 80) of the workpiece (1, 60), and the concrete at least partly hardens in the negative and is then removed. The invention is characterized in that a positive (5, 71) is produced from me concrete workpiece (1, 60) to be produced, the positive is arranged in a casting formwork (20, 70), and negative fresh concrete is then poured onto the positive. The negative fresh concrete is removed after being at least partly hardened (35, 80), and the concrete body produced in this manner is used as a negative (35, 80) in order to produce the workpiece (1, 60) therein using the fresh concrete poured into the negative (35, 80).

Abstract: User alert systems, apparatus, and related methods for use with vehicles are disclosed. A disclosed alert system for a vehicle includes an intrusion detection system (IDS) operatively coupled to the vehicle. The alert system also includes a network access device (NAD) operatively coupled to the vehicle and control circuitry configured to detect, via the IDS, a malicious message transmitted through a controller area network (CAN) bus of the vehicle. The control circuitry is also configured to generate a primary alert indicative of the malicious message and transmit, via the NAD, the primary alert to a primary user device corresponding to a driver of the vehicle. The control circuitry is also configured to generate a secondary alert indicative of the malicious message and transmit, via the NAD, the secondary alert to one or more secondary user devices different from the primary user device.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes an upper conductive structure, a lower conductive structure and a redistribution structure. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The redistribution structure is disposed between the upper conductive structure and the lower conductive structure to electrically connect the upper conductive structure and the lower conductive structure. The redistribution structure includes a dielectric structure and a redistribution layer embedded in the dielectric structure. The redistribution layer includes at least one circuit layer.

Abstract: Systems and methods for generating autonomous navigation routes to match user preferences include an autonomous vehicle and a routing system configured to (i) generate a unique route to satisfy driving past at least one user event request to navigate the autonomous vehicle arrive at a destination and (ii) navigate the autonomous vehicle to the destination along the unique route tailored to meet the at least one user event request.

Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

Abstract: A skiver for precise removal of outside material from an elongated device, such as a medical catheter or the like, includes a longitudinal recess in a surface and a transverse replaceable blade therein. A removable cover holds the blade in place. In some embodiments, the skiver has a handle extending from the skiver. In other embodiments, an automated mechanism is used to move the elongated device through the skiver.

Abstract: The present application discloses a construction method for pouring concrete in a karst cave. Concrete streaming is pumped into a hollow passage of a drill stem, then opens the one-way openable sealing cover with a pre-tensioned spring on a reaming drill bit and enters the karst cave to complete pouring of the concrete. When the karst cave is relatively low, low-slump plain concrete mixed with quick-setting agents is injected through a drilling rig and the hollow drill stem to form a concrete pier; when the karst cave is relatively high, the hollow drill stem is sleeved into a thin-walled steel shell, and the thin-walled steel shell is synchronously sunk into the drilled hole while drilling, enters the karst cave and is socketed into a stable rock stratum, then concrete is pumped into the thin-walled steel shell from the bottom of the pile, and finally, a reinforcement cage is inserted to form a cast-in-place pile.

Abstract: A semiconductor device and method for manufacturing the same are provided. The method includes providing a first substrate. The method also includes forming a first metal layer on the first substrate. The first metal layer includes a first metal material. The method further includes treating a first surface of the first metal layer with a solution including an ion of a second metal material. In addition, the method includes forming a plurality of metal particles including the second metal material on a portion of the first surface of the first metal layer.

Abstract: A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.

Abstract: A vehicle leveler which includes a first portion with a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The leveler also includes a second portion with a leading edge and a trailing edge, the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The vehicle leveler has a door interlock system with at least one pair of photoelectric sensors with a sensor path. When a vehicle is being loaded or unloaded on the vehicle leveler, and at least one of the vehicle doors is opened, the door blocks the sensor path of the photoelectric sensors and prevents the vehicle leveler from lowering or raising.

Abstract: A polybutylene terephthalate resin composition, comprising comprising a thermoplastic resin (A) containing a polybutylene terephthalate resin and, per 100 parts by mass of the thermoplastic resin (A), from 0 to 30 parts by mass of an elastomer (B), from 0.3 to 4 parts by mass of an epoxy compound (C), from 15 to 80 parts by mass of a reinforcing filler (D), and from 1 to 15 parts by mass of a masterbatch (E) containing a silicone compound with a weight-average molecular weight of 10,000 to 80,000 and a thermoplastic resin.

Abstract: A package substrate and method of manufacturing a package substrate and a semiconductor device package are provided. The package substrate includes a circuit layer, an optically-cured dielectric layer, a plurality of block layers and a sacrificial layer. The circuit layer includes a plurality of conductive pads. The optically-cured dielectric layer has an upper surface and a lower surface opposite to the upper surface. The optically-cured dielectric layer covers the circuit layer, and first surfaces of the conductive pads are at least partially exposed from the upper surface of the optically-cured dielectric layer. The block layers are respectively disposed on the first surfaces of the conductive pads exposed by the optically-cured dielectric layer. The sacrificial layer is disposed on the optically-cured dielectric layer and covering the block layers.

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

Abstract: An optical assembly includes a light-emitting device, a partition structure and a cover. The partition structure defines a first space for accommodating the light-emitting device. The cover is disposed over the partition structure. The cover has a first surface facing the partition structure and a second surface opposite to the first surface. A light emitted by the light-emitting device forms a first irradiance pattern projected on the second surface of the cover, and the first irradiance pattern includes a first dark zone traversing the first irradiance pattern.

Abstract: A package substrate and method of manufacturing a package substrate and a semiconductor device package are provided. The package substrate includes a circuit layer, a molding layer and a sacrificial layer. The circuit layer includes conductive traces and conductive pads. The molding layer has an upper surface and a lower surface opposite to the upper surface, wherein the molding layer partially covers the conductive traces and the conductive pads, and first surfaces of the conductive traces and first surfaces of the conductive pads are exposed from the upper surface of the molding layer. The sacrificial layer covers the lower surface of the molding layer, second surfaces of the conductive pads.

Abstract: Apparatus and associated methods relate to a vibrational sensing system (VSS) including an accelerometer and a data processor, which determines an “operational state” of a mechanical drive unit, the processor further employing the “operational state” to gate learning of long-term vibrational data to exclude collection of non-operational data, the long-term data collected to calculate alarm thresholds. For example, vibrations from a target motor are sensed by a coupled accelerometer. Vibrational data from the accelerometer is fed into a data processor which determines the operational state of the motor. The operational state (e.g., on/off indication) may gate data collection such that data is only acquired during on-time, which may advantageously create accurate baselines from which alarm thresholds may be generated, and nuisance alarms may be avoided.

Abstract: In the gas disperser (3), a flow conditioning device (5, 6) is located in the inlet duct section (32). The flow conditioning device comprises a hole plate (5) and a flow straightener (6) positioned in parallel with and at a distance (h) in the axial direction (axd) from the downstream side of the hole plate (5). The hole plate (5) has a predefined hole plate thickness (tp) in the axial direction (axd) and each flow straightener (6) has a predefined flow straightener length (Is) in the axial direction (axd), the flow straightener length (Is) being substantially larger than the hole plate thickness (tp).

Abstract: The present disclosure provides an ear tip. The ear tip includes a main body, a first conductive element at least partially embedded in the main body, a second conductive element at least partially embedded in the main body and spaced apart from the first conductive element. The main body includes a central portion having a top and a tail portion extending from the top of the central portion. The first conductive element is proximal to the top of the central portion and the second conductive element is distal from the top of the central portion. A wearable device is also disclosed.