Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than ?20 dB.

Abstract: A catalytic reactor according to an embodiment includes a catalytic unit including at least one catalyst having a honeycomb structure in which a plurality of passages extending in an axial direction are formed, a reactor housing accommodating the catalytic unit, and a seal plate sealing between an outer periphery of the catalytic unit and an inner periphery of the reactor housing. The seal plate seals between the outer periphery of the catalytic unit and the inner periphery of the reactor housing at an upstream end portion of the catalytic unit with respect to a flow of a fluid flowing in the reactor housing.

Abstract: A downhole tool, comprising: a mandrel having first and second opposing ends and an outer mounting surface, the first end comprising a male threaded portion; a tool component mountable on the mounting surface by sliding said tool component onto the mounting surface from the first end of the mandrel; and a load sleeve defining a torque shoulder, wherein the load sleeve is mountable on the mandrel and securable adjacent the male threaded portion of the first end of the mandrel such that the torque shoulder and the male threaded portion define a pin connector to facilitate connection with a box connector of a separate component.

Abstract: Present disclosure provides a semiconductor package structure, which includes a redistribution layer (RDL) structure, an electronic device, a first reinforcement structure, a second reinforcement structure, and an encapsulant. The RDL structure has a passivation layer and a patterned conductive layer disposed in the passivation layer. The electronic device is disposed on the RDL structure. The first reinforcement structure is disposed on the RDL structure and has a first modulus. The second reinforcement structure is disposed on the first reinforcement structure and has a second modulus substantially less than the first modulus. The encapsulant is disposed on the RDL structure and encapsulates the electronic device, the first reinforcement structure and the second reinforcement structure.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.

Abstract: A semiconductor package includes a base material, a capture land, an interconnection structure, a semiconductor chip and an encapsulant. The base material has a top surface and an inner lateral surface. The capture land is disposed in or on the base material, and has an outer side surface. The interconnection structure is disposed along the inner lateral surface of the base material, and on the capture land. The interconnection structure has an outer side surface. An outer side surface of the semiconductor package includes the outer side surface of the capture land and the outer side surface of the interconnection structure. The semiconductor chip is disposed on the top surface of the base material. The encapsulant is disposed adjacent to the top surface of the base material, and covers the semiconductor chip.

Abstract: A method of forming a polyanion active material that includes providing a carbon source, providing a mobile ion source, providing an active metal material, providing a network material, providing a flux material, and mixing the various materials. In one aspect, the mixing step may include grinding or pulverizing materials to a uniform fine mixture. In one aspect, a ball mill may be utilized to mix the components. Following the mixing of the materials, the mixture is heated to a predetermined temperature in a non-oxidizing atmosphere to form a reaction product. In one aspect, the mixture is heated to a temperature above a melting temperature of the flux material. In this manner, the flux material provides a medium in which the various reactants may react to form the desired reaction product. Following the heating of the mixture the reaction product is washed, forming a carbon coated polyanion active material.

Abstract: A longitudinal adjuster for a vehicle seat having at least one pair of rails. The at least one pair of rails may be formed from a first seat rail for connecting to a seat structure, and from a second seat rail for connecting to a vehicle structure. The seat rails of the pair of rails are displaceable in the longitudinal direction relative to each other and mutually engage around each other to form an inner channel. A securing profile, which is fastened to the first seat rail, is arranged in the inner channel. A rack which is fixed relative to the second seat rail is arranged in the inner channel. The securing profile and the rack are normally spaced apart from each other and enter into engagement with each other in a form-fitting manner in reaction to a predetermined action of force.

Abstract: Systems and methods are disclosed herein relating to control of one or more components of an electric power system. A human machine interface (HMI) may be utilized to control and monitor a remote intelligent electronic device (IED) via a local intelligent electronic device (IED) connected to the HMI.

Abstract: A line-mounted device is used to provide power system signals to a device for detecting a fault and calculating a fault location using a traveling wave launched thereby. Current at the line-mounted device is used to separate incident and reflected traveling waves at a terminal. Times and polarities of traveling waves passing the line-mounted device and the terminal are compared to determine if the fault is located between the terminal and line-mounted device or at a location beyond the terminal or line-mounted device. Voltage of the traveling wave may be calculated using currents from the line-mounted device.

Abstract: A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

Abstract: A combination comprising, spatially separate from one another, a first component and a second component, where the first component comprises crosslinkable albumin and the second component comprises a polymer, wherein non-terminal monomer units of the polymer comprise at least partially, more particularly only partially, an albumin-crosslinking group. Additionally disclosed is a reaction product obtainable by means of the combination, to a medical device, to a medicinal product for innovative therapies, to a kit, to a discharge apparatus, and to a functionalized hyaluronic acid.

Abstract: A method of forming an inverse opal structure along a substrate that includes depositing polymer spheres along the substrate and electroplating the substrate and spheres at a first current density to form a first solid metal layer such that the spheres are raised from the substrate. The method includes electroplating the substrate and the spheres at a second current density to diffuse metals from the substrate and deposit the metal about the spheres. The second current density is greater than the first current density. The method includes electroplating the substrate and spheres to form a second solid metal layer disposed over the spheres, and removing the spheres to form the inverse opal structure disposed between the first and second solid metal layers. The first and second solid metal layers define planar interface surfaces disposed over a porous structure of the inverse opal structure.

Abstract: A mirror assembly can include a mirror and one or more actuators operatively positioned to cause the position and/or the orientation of the mirror to be adjusted. The one or more actuators include a bladder. The bladder can include a flexible casing. The bladder can define a fluid chamber. The fluid chamber can contain a dielectric fluid. The one or more actuators can include a first conductor and a second conductor operatively positioned on opposite portions of the bladder. The one or more actuators can be configured such that, when electrical energy is supplied to the first conductor and the second conductor, the first conductor and the second conductor can become oppositely charged. As a result, the first conductor and the second conductor are electrostatically attracted toward each other to cause at least a portion of the dielectric fluid to be displaced to an outer peripheral region of the fluid chamber.

Abstract: A method and sealant to seal microcracks as small as 30 ?m by causing methyl methacrylate combined with one or more nanoparticles to flow into the microcrack to be sealed.

Abstract: An assembly for the automated production of conical paper sleeves for plants uses paper stock precut in a trapezoid configuration which is continuously fed to the assembly. The precut sheets are folded diagonally twice to form a conical sleeve. The folding process includes application of an adhesive on the overlap of the folded sides to securely seal the sleeve. The precut sheets are transported along the assembly via a series of belts, rollers and electrical motors. The synchronization of the folding process and the application of adhesive is electronically monitored and controlled.

Abstract: The present disclosure is directed to methods that provide a secure communication protocol by utilizing one step process of authenticating and encrypting data without having to exchange symmetric keys or needing to renew or re-issue digital identities fundamental to asymmetric encryption methodology.

Abstract: The present invention relates, in part, to engineered viruses (e.g., engineered phages), phage cocktails, and methods of producing and/or identifying viruses for targeting pathogenic bacteria.

Abstract: A cover assembly for a hitch assembly includes a cover and a cover lock assembly. The cover is coupled to the body component for movement between an open position and a closed position. In the open position, the cover permits access to a hitch lock assembly configured to secure a hitch to a hitch receiver and in the closed position, the cover inhibits access to the hitch lock assembly. The cover lock assembly is configured to releasably secure the cover to the hitch receiver when the cover is in the closed position. The cover lock assembly includes a locked configuration and an unlocked configuration. In the locked configuration, the cover is inhibited from moving from the closed position to the open position. In the unlocked configuration, the cover is permitted to move from the closed position to the open position.