Abstract: A vehicle includes a cabin and a passenger seat assembly located in the cabin. The passenger seat assembly includes a base support assembly mounted to a floor of the cabin and comprising walls that form a storage compartment. A seat is supported by the base support assembly. The seat includes a seat back frame that supports one or more cushions thereon. A seat base frame supports one or more cushions thereon forming a seat base. The seat base frame is formed as a monolithic, single piece structure from a plastic resin material. The seat base frame has a sitting portion and a raised portion located forward of the sitting portion. The raised portion increases in elevation above the sitting portion to an apex of increased distance from the floor.

Abstract: A cutting insert includes a rake face, a seating face facing an opposite side to the rake face and seated on an insert mounting seat, and a flank face extending around the rake face and the seating face, in which two cutting edges each having an arcuate cutting edge portion extending in an arc shape and a linear cutting edge portion which is in contact with the arcuate cutting edge portion are formed on an intersecting ridgeline portion between the rake face and the flank face, a groove portion having a wall surface coming into contact with a projection portion protruding from a bottom surface of the insert mounting seat is formed on the seating face, and the groove portion has a narrow width portion in which a groove width decreases from one end side toward the other end side in a direction in which the groove portion extends.

Abstract: Example aspects of a fitting for engaging a brace member and a method for attaching a brace member to a mounting bracket are disclosed. The fitting for engaging a brace member can comprise a fitting body; a first jaw extending from the fitting body; a second jaw extending from the fitting body, the first jaw and second jaw defining a slot therebetween; and a continuous contact surface defining a top contact surface, a bottom contact surface, a left contact surface, and a right contact surface, the continuous contact surface configured to continuously engage a peripheral edge of the brace member.

Abstract: A sensor uses microneedle electrodes and multi-frequency electrical impedance spectroscopy to monitor plant water status in real time. The microneedle can be between 10 and 1000 microns in length, enabling precise placement in a variety of plant tissues. The impedance behavior can distinguish electrical properties and physiological functions of different plant tissue types. Therefore, impedance measurements can be used to monitor water stress to prevent irreversible damage to a plant and to enable improvement of plant biomass or fruit yield.

Abstract: A testing system for load test measuring a shaft resistance and a base resistance having first and second operating units with the first operating unit having a bottom loading plate, a base bearing plate and base mobilizer bars operably joined thereto; the second operating unit having a top loading plate, a shaft bearing plate and shaft mobilizer bars operably joining them together wherein the first and second operating units can move relative to one another; the system having a loading sources producing a test load between the top and bottom loading plates to move them apart wherein the shaft bearing plate that is positioned below a foundation element produces an upward compressive force test load on the foundation element to test shaft resistance and the base bearing plate that is positioned between the shaft bearing plate and the bottom surface of the foundation opening produces a downward compressive force test load on the bottom surface to test base resistance.

Abstract: Systems and methods are provided for processing a feed derived from a renewable source to form oligomerized compounds corresponding to waxes, ketone waxes, and/or lubricant boiling range compounds. The oligomerized compounds derived from the renewable source can have various novel properties relative to waxes and/or lubricant boiling range compounds derived from mineral sources or derived from renewable sources in a conventional manner. The oligomerized compounds can be derived from a renewable source including fatty acids and/or fatty acid derivatives, such as glycerides (including triglycerides) and fatty amides. Optionally but preferably, at least a portion of the fatty acids and/or fatty acid derivatives can include olefinic bonds.

Abstract: A grapple for mounting to a boom of a boom crane includes a body member for mounting to the end of a boom of a boom crane including a first wing member and a second wing member and opposing first and second jaw members. Each jaw is hingably coupled to the body member, and hinges with respect to the body member by the action of a hydraulic cylinder. A first end of the hydraulic cylinder is coupled to the jaw member and a second end of the hydraulic cylinder is coupled to a portion of one of the wing members. The first and second wing members extend to position the second end of each hydraulic cylinder rearward of an end of the boom of the boom crane or a coupling between the body member and the boom of the boom crane.

Abstract: A system, method, and algorithm for detecting and identifying special nuclear material (SNM) (including fissionable material), explosives, or drugs is disclosed. This material detection system relies on active interrogation of material using a short, intense neutron pulse, and characterization of the resulting prompt gamma response in two short time windows, the first concurrent with and the second immediately following the end of the neutron pulse, optionally subject to a total transit delay time of the neutrons from the neutron source to the target and from the target to the gamma detector. A high data rate analysis system implements data stream analysis and statistical correlations of the two short time window gamma responses to rapidly detect or identify SNM, explosives, or drugs. The duration of the neutron pulse is so short that minimal dose results. Various shields help to minimize the background signal falling on the gamma detector to improve sensitivity.

Abstract: A system for installing a structure is provided. The system includes a plurality of moveable objects, and a server including a controller including one or more processors, and machine readable instructions stored in one or more memory modules that, when executed by the one or more processors, cause the controller to: communicate with the plurality of moveable objects; receive a request for installing the structure at a location; select a group of moveable objects among the plurality of moveable objects based on locations of the plurality of moveable objects; instruct the group of moveable objects to move to the location; and instruct one or more of the group of moveable objects to morph at the location based on information about the structure.

Abstract: A semiconductor package structure includes a die paddle, a plurality of leads, an electronic component and a package body. Each of the plurality of leads is separated from the die paddle and has an inner side surface facing the die paddle. The electronic component is disposed on the die paddle. The package body covers the die paddle, the plurality of leads and the electronic component. The package body is in direct contact with a bottom surface of the die paddle and the inner side surface of the plurality of leads.

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

Abstract: A semiconductor device package includes a first dielectric layer, a conductive pad and an electrical contact. The first dielectric layer has a first surface and a second surface opposite to the first surface. The conductive pad is disposed within the first dielectric layer. The conductive pad includes a first conductive layer and a barrier. The first conductive layer is adjacent to the second surface of the first dielectric layer. The first conductive layer has a first surface facing the first surface of the first dielectric layer and a second surface opposite to the first surface. The second surface of the first conductive layer is exposed from the first dielectric layer. The barrier layer is disposed on the first surface of the first conductive layer. The electrical contact is disposed on the second surface of the first conductive layer of the conductive pad.

Abstract: A semiconductor device package includes a redistribution structure and an electrical connection. The redistribution structure has an electrical terminal adjacent to a surface of the redistribution structure and a seed layer covering a side surface of the electrical terminal. The electrical connection is disposed on a first surface of the electrical terminal. The seed layer extends to the first surface of the electrical terminal.

Abstract: A semiconductor package includes a semiconductor device and a second substrate. The semiconductor device is disposed on, and electrically connected to, the second substrate. The semiconductor device includes a first substrate and a multi-layered structure. The multi-layered structure is disposed on a top surface of the first substrate and a layer of the multi-layered structure extends outwardly beyond a lateral edge of a topmost surface of the multi-layered structure.

Abstract: A semiconductor device package includes a substrate, a first electronic component and a first encapsulant. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the substrate. The first encapsulant is disposed on the first surface of the substrate and covers the first electronic component. The first encapsulant has a first surface facing away the first surface of the substrate and includes a recess at an edge of the first surface of the first encapsulant.

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.

Abstract: A semiconductor package structure includes a semiconductor die and at least one pillar structure. The semiconductor die has an upper surface and includes at least one conductive pad disposed adjacent to the upper surface. The pillar structure is electrically connected to the conductive pad of the semiconductor die, and defines a recess portion recessed from a side surface of the pillar structure. A conductivity of the pillar structure is greater than a conductivity of the conductive pad.

Abstract: An electric power delivery system may be protected upon occurrence of a fault condition by the systems and methods disclosed herein by detecting the fault condition and signaling a protective action before the overcurrent condition reaches the protective equipment. The protective action may be an opening of a circuit breaker or engagement of a fault current limiter. The overcurrent condition may be a non-steady-state condition. The fault may be detected using traveling wave or incremental quantity techniques.

Abstract: A system includes a platform designed to mechanically support a plurality of personal vehicles. The system also includes a power source coupled to the platform and designed to at least one of store or generate power to propel the platform. The system also includes an actuator coupled to the platform and designed to facilitate transfer of the plurality of personal vehicles from a ground surface to the platform. The system also includes a plurality of transmitters each coupled to the platform and designed to transmit an electrical charge to an energy storage device of one of the plurality of personal vehicles. The system also includes a platform electronic control unit (ECU) coupled to the power source and the plurality of transmitters and designed to control the power source to transmit at least some of the power to, the plurality of personal vehicles via the plurality of transmitters.

Abstract: An anti-corrosion coating to protect against corrosion, comprising: a high-density protective coating on a substrate which is prone to corrosion, preferably metals and/or alloys thereof, containing pre-condensed coat-forming alkoxysilane precursors, wherein the molecules of the pre-condensed coat-forming alkoxysilane precursors are built up from monomer units selected from the group formed by coat-forming alkoxysilane precursors, wherein the molecules of the pre-condensed coat-forming alkoxysilane precursors are cross-linked with each other, wherein the high-density protective coating has a coating thickness of at least 50 ?m. The high-density protective coating formed by an inorganic-organic hybrid material, which is preferably produced without solvents (i.e. without the addition of solvents, in particular organic solvents), is comprised of at least one coat-forming alkoxysilane precursor, in particular selected from the group formed by trialkoxysilane precursors.