Patents Assigned to Engineering
  • Publication number: 20200368674
    Abstract: An acid gas removal apparatus includes a reclaimer control device that performs: first supply water control in which at least one of reflux water, steam condensate, and desalinated water is supplied to a reclaimer as first supply water, at non-volatile component removal reclaiming; second supply water control in which at least one of the reflux water, the steam condensate, and the desalinated water is supplied to the reclaimer, and a washing liquid including an acid gas absorbing liquid is supplied to the reclaimer as second supply water, at an initial stage of finish reclaiming; and third supply water control in which supply of the second supply water is stopped and at least one of the reflux water, the steam condensate, and the desalinated water is supplied as the first supply water, at a later stage of the finish reclaiming
    Type: Application
    Filed: October 15, 2018
    Publication date: November 26, 2020
    Applicant: Mitsubishi Heavy Industries Engineering, Ltd.
    Inventors: Hiroshi Tanaka, Takuya Hirata, Takashi Kamijo, Tatsuya Tsujiuchi
  • Patent number: 10848092
    Abstract: Monitoring conditions of an electric motor using stator current and voltage signals from power supplied to the motor is disclosed herein. The stator voltage and current signals may be used to calculate instantaneous power values which may be used to calculate slip. The slip may be used to monitor for a locked rotor condition during startup of the motor. The slip value may be used to provide thermal protection to the electric motor.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: November 24, 2020
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Marcos A. Donolo, Jay Hartshorn
  • Patent number: 10847935
    Abstract: A face to face contact assembly having at least one electrically conductive spring element and at least one shielding spring element separated from one another by a spacing element. From the perspective of a centerline and extending radially outwardly, electrically conductive spring element is located closest to the centerline, then the spacing element, and then the shielding spring element. The electrically conductive spring element electrically connects two adjacent faces, which in one example can be adjacent printed circuit boards, and the shielding spring element at least partially shields such electrical connection. Other face to face contact assembly arrangements are also disclosed.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: November 24, 2020
    Assignee: Bal Seal Engineering, LLC
    Inventors: Wayne Young, Robert Riegen
  • Patent number: 10848316
    Abstract: A vehicle measurement station utilizing one or more displacement sensors disposed on each opposite side of an inspection region of a vehicle inspection lane to acquire displacement measurement data along associated measurement axes. At least a portion of the displacement measurement data is associated with the outermost wheel assemblies on an axle of a moving vehicle passing through the inspection region, and utilized to determine one or more vehicle characteristics, such as an axle total toe condition.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: November 24, 2020
    Assignee: Hunter Engineering Company
    Inventors: Michael T. Stieff, Timothy A. Strege, Daniel R. Dorrance
  • Patent number: 10843633
    Abstract: A pocket is structured to be removably securable to a vehicle door. In one arrangement, the pocket includes at least one positioning element receiving cavity structured to extend horizontally or substantially horizontally when the pocket is attached to a vehicle door.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 24, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Joshua S. Lynch
  • Patent number: 10843154
    Abstract: The present disclosure is directed to highly concentrated foam formulations for blast suppression and dispersion mitigation. for use in responding to a terrorism incident involving a blast dispersion device. The foam formulation is more concentrated and more stable than current blast suppression foams, which reduces the logistics burden on the user.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: November 24, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Patrick D. Burton, Mark D. Tucker, Keith E. Frakes
  • Patent number: 10843964
    Abstract: The present invention relates to structure including an interfacial seal between a glass-ceramic component and a metal component, as well as methods for forming such structures. In particular embodiments, the interfacial seal includes a metal oxide. Such interfacial seals can be beneficial for, e.g., hermetic seals between a glass-ceramic component and a metal component.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: November 24, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: Steve Xunhu Dai
  • Patent number: 10842358
    Abstract: Example embodiments relate to endoscopic systems. The system includes an outer assembly and main assembly. The outer assembly may include proximal and distal ends and outer anchor assembly. The outer anchor assembly may include a first expandable member and first outer pressure opening. The first expandable member may expand radially outwards. The main assembly may include proximal and distal ends and a navigation assembly. The navigation assembly may include an instrument, second expandable member, bendable section, extendible section, and first pressure opening. The extendible section may include proximal and distal ends. The proximal end of the extendible section may be secured in position relative to the distal end of the outer assembly. The extendible section may be configurable to extend and contract. The first main pressure opening may be configurable to apply a negative pressure.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: November 24, 2020
    Assignee: Bio-Medical Engineering (HK) Limited
    Inventors: Chung-Kwong Yeung, Steven Chu, Wing Fai Lam
  • Patent number: 10843594
    Abstract: A seat mounted on a slide slidable on a track. The track has comfort and entry zones. Pitch linkage mounts on the slide and supports a seat back. The linkage pivotally connects a seat back to the slide between recline and forward positions. A track latch fixes the slide to the track in a plurality of positions in the comfort zone. The entry zone is used to enter the vehicle. A forward stop blocks the slide from moving from the comfort to the entry zone. The forward stop moves between stop and release positions. The stop position blocks the slide from moving from the comfort to the entry zone. The release position does not block the slide from moving. A forward stop mechanism moves the forward stop into the stop position when the pitch linkage is in the recline position and the slide is in said comfort zone.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 24, 2020
    Assignee: Adient Engineering and IP GmbH
    Inventors: Aaron Escobedo, William S. Brewer, Kurt Seibold, Karl Noffz
  • Patent number: 10844306
    Abstract: Provided is a lubricating oil composition, which has low viscosity but also prolonged anti-shudder life without reduction of intermetallic friction coefficient. The lubricating oil composition is characterized in comprising (A) a lubricating base oil, and (C) (C-1) a borated succinimide compound with a mass average molecular weight of 4,000-7,000 and (C-2) a borated succinimide compound with a mass average molecular weight of greater than 7,000-10,000.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: November 24, 2020
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Takafumi Mori, Takehisa Sato, Takahiro Fukumizu, Masashi Ogawa, Junichi Nishinosono
  • Patent number: 10844961
    Abstract: A mechanical seal support system for a sealing device for sealing a piece of industrial equipment, includes a mechanical seal for sealing the piece of industrial equipment and a system vessel for containing barrier fluid for the mechanical seal and being circumferentially split into a plurality of sections detachably attached for retaining pressure. The system vessel includes a clean-in-place (CIP) assembly, a cooling element and device for sterilizing the system vessel. The device for sterilizing the a heating element is formed as a coiled tubular element for the barrier fluid to pass therethrough, with closed-loop pipe work included for connecting the system vessel to the mechanical seal and a drain and filling device for removing and adding the barrier fluid to the system vessel.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: November 24, 2020
    Assignee: AES Engineering Ltd.
    Inventor: Heath Stephenson
  • Patent number: 10843131
    Abstract: The present invention relates to a system and method for desulfurization and denitrification integrated treatment and recycling of flue gas by using red mud, and belongs to the recycling and environmental protection technology field. The system includes a desulfurization spray tower, an ozone generator, a denitration spray tower, a slurry mixing tank, a slurry storage tank, a vacuum filter, an ammonia water neutralization tank, an aluminum hydroxide precipitation tank, an ammonia water tank, an aluminum hydroxide storage tank, a filter press, an ammonia distillation tower, a dephlegmator, a cooler, a concentrated ammonia water storage tank, a gypsum precipitation tank, and an anaerobic biochemical pool. In the present invention, red mud slurry is used for desulfurization and denitrification treatment of flue gas to remove SO2 and NO in the flue gas, so that SO2 and NO in the flue gas reach an emission standard.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: November 24, 2020
    Assignees: Kunming University of Science and Technology, Pingxiang Huaxing Environmental Protection Engineering Technology Co., Ltd.
    Inventors: Ping Ning, Liangtao Yin, Qiulin Zhang, Lijuan Jia, Zaifei Yin, Bo Li, Shaoming Li, Bin Li
  • Patent number: 10843153
    Abstract: The present invention discloses a two-dimensional nanomaterial dispersant, a preparation method of a two-dimensional nanomaterial by liquid phase exfoliation, and use thereof.
    Type: Grant
    Filed: October 8, 2016
    Date of Patent: November 24, 2020
    Assignee: Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences
    Inventors: Liping Wang, Jia Chen, Mingjun Cui, Cheng Chen, Shihui Qiu, Haichao Zhao
  • Patent number: 10843276
    Abstract: A rotary tool accessory for installing a hood cushion in a vehicle component. The tool accessory includes a base portion structured to contact a hood cushion so as to enable rotation of the hood cushion by rotating the base portion. A hood cushion confinement portion is structured to enclose a portion of the hood cushion so as to limit or prevent radial expansion of the hood cushion during installation of the cushion into the vehicle component. The confinement portion is also structured and adjustably attachable to the base portion so as to control a movement of the base portion toward the surface of the component of the vehicle, such that a portion of the hood cushion extends past the surface of the vehicle component in a direction toward the base portion when the hood cushion has been completely installed in the vehicle component.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: November 24, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Paul E. Presley, Bryan Hodel
  • Patent number: 10843216
    Abstract: A fluid dispersion nozzle and system for spraying large areas with near-monodispersed, aerosolized fluid droplets. More specifically, the fluid dispersion nozzle receives pressurized and fluid from fluid dispersion machinery, aerosolizes the fluid into near-monodispersed droplets, and distributes the aerosolized, near-monodispersed droplets evenly over long distances. The nozzle is an adjustable, dual-contour, supersonic nozzle that includes a main adjustable contour, an auxiliary contour, an axial fluid injector, a resonator, and a plunger.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: November 24, 2020
    Assignee: Eco Shield Engineering LLC
    Inventors: Yevgeniy Raykhfeld, Igor Golenistsev
  • Publication number: 20200363111
    Abstract: A method and system for improving energy efficiency of a refrigeration system include system components such as a condenser, one or more expansion valves, an evaporator, one or more compressors, and a system controller electrically coupled to the one or more of the system components, according to one embodiment. The system controller is configured to selectively actuate, directly or indirectly, the one or more expansion valves, the condenser, and/or the one or more compressors, at least partially based on temperatures and/or pressures of the system fluid at various points of the system, to control a temperature of a refrigerated area.
    Type: Application
    Filed: July 31, 2020
    Publication date: November 19, 2020
    Applicant: DC Engineering, Inc.
    Inventors: Thomas Dean Wolgamot, Timothy Alan Gwyn, William Michael Crist
  • Publication number: 20200363594
    Abstract: A semiconductor module includes a photonic integrated circuit and a receptacle. The photonic integrated circuit includes a substrate, a waveguide disposed on the substrate, and a recess in the substrate and having a first width. The receptacle is bonded to a top surface of the substrate and aligning with the recess. The receptacle and the recess jointly form a cavity, and the receptacle has a second width greater than the first width. A method for manufacturing the semiconductor module is also disclosed.
    Type: Application
    Filed: May 15, 2019
    Publication date: November 19, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Chi-Han CHEN, Zong-Yu YANG, Pei-Jung YANG
  • Publication number: 20200365500
    Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, a lower encapsulant and an intermediate layer. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the upper dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The lower encapsulant surrounds a lateral peripheral surface of the lower conductive structure. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure to bond the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure.
    Type: Application
    Filed: May 13, 2019
    Publication date: November 19, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG
  • Publication number: 20200365485
    Abstract: A thermal conductive device includes a first conductive plate, a second conductive plate, a plurality of wicks and a fluid. The first conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The second conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The first portion and the second portion of the first conductive plate are respectively connected to the first portion and the second portion of the second conductive plate to define a chamber. The plurality of wicks are disposed within the chamber. The fluid is disposed within the chamber.
    Type: Application
    Filed: May 15, 2019
    Publication date: November 19, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ian HU, Chih-Pin HUNG, Meng-Kai SHIH
  • Publication number: 20200365478
    Abstract: A semiconductor package structure includes a package substrate, an encapsulant, at least one passage and at least one semiconductor element. The encapsulant is disposed on the package substrate and has a peripheral surface, and includes a first encapsulant portion and a second encapsulant portion spaced apart from the first encapsulant portion. The at least one passage is defined by the first encapsulant portion and the second encapsulant portion, and the passage has at least one opening in the peripheral surface of the encapsulant. The at least one semiconductor element is disposed on the package substrate and exposed in the passage.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 19, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: I-Chia LU, Mao-Sung HSU