Patents Assigned to Engineering
  • Patent number: 10765337
    Abstract: An ear plug for arrangement in an ear canal includes at least two electrodes for detecting an EEG signal from a skin surface when the ear plug is arranged in the ear canal. The ear plug further includes a housing having an outer wall made from a resilient material, and a signal acquisition circuit. The electrodes are provided with a skin contact part arranged on an outside surface of the housing and connected through the outer wall of the housing to a supporting member on the inner part of the housing. The skin contact part and the supporting member are arranged for clamping the outer wall.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: September 8, 2020
    Assignee: T&W Engineering A/S
    Inventor: Mikael Andersen
  • Patent number: 10766393
    Abstract: A cup holder assembly for a seat assembly of a vehicle includes a side shield and a net. The side shield includes an inner surface, an outer surface, a curved indentation wall extending from the outer surface, and a bottom wall. The net has an upper edge, a lower edge, and a pair of side edges. The lower edge has a length less than a length of the upper edge. The lower edge and the pair of side edges of the net engage with the outer surface of the side shield to bound at least a portion of the curved indentation wall. The net includes an apex that extends outwardly beyond the outer surface such that the net is configured to retain an object within the cup holder assembly.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: September 8, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shelby L. Brown, Lindsay A. Babian, Hamshivraj Dhamrat, Robert J. Hazlewood
  • Patent number: 10771132
    Abstract: Disclosed is a MIMO system including a transmitter and a receiver, in which an overall BER characteristic is improved. The transmitter (1) maps data, distributed among transmit antennas, onto an IQ plane to generate carrier symbols, and then, applies an inter-polarization interleave processing in a time direction to the carrier symbols between the transmit antennas, to generate OFDM signals. Receiving the OFDM signals, the receiver (2) demodulates the OFDM signals to generate complex baseband signals, and after that, applies a first deinterleave processing in a time direction to the complex baseband signals to generate time deinterleaved data. Further, the receiver (2) applies a MIMO separation processing to the time deinterleaved data to generate a plurality of sets of MIMO separated data and applies a second deinterleave processing between the receive antennas to the plurality of sets of MIMO separated data, so as to generate carrier symbols.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: September 8, 2020
    Assignees: NIPPON HOSO KYOKAI, NHK Engineering System, Inc.
    Inventors: Shingo Asakura, Madoka Honda, Kenichi Murayama, Takuya Shitomi, Susumu Saito, Yoshikazu Narikiyo, Hiroaki Miyasaka, Akihiko Satou, Tomoaki Takeuchi, Kenichi Tsuchida, Masahiro Okano, Masayuki Takada, Kazuhiko Shibuya
  • Patent number: 10770960
    Abstract: A permanent magnet motor, comprising a stator (1) and a rotor (4); the rotor comprises a rotor iron core (5) and permanent magnets (7a, 7b); in the radial direction of the rotor, each magnetic pole of the rotor iron core is provided with multiple layers of arc-shaped permanent magnet grooves (6a, 6b); a q-axis magnetic flux path is formed between two neighboring magnetic poles; the permanent magnets are disposed in the permanent magnet grooves; two neighboring magnetic poles of the rotor are respectively a first magnetic pole and a second magnetic pole having opposite polarities; an outer endpoint of a permanent magnet in the first magnetic pole is a first outer endpoint, said outer endpoint is farther from the q-axis; an outer endpoint of the permanent magnet in the second magnetic pole is a second outer endpoint, said outer endpoint is farther from the q-axis; an included angle A of the first outer endpoint and the second outer endpoint with respect to the center of the rotor is less than an electrical angl
    Type: Grant
    Filed: June 25, 2016
    Date of Patent: September 8, 2020
    Assignee: Green Refrigeration Equipment Engineering Research Center of Zhuhai Gree Co., Ltd.
    Inventor: Yong Xiao
  • Patent number: 10767027
    Abstract: The present invention relates, in part, to methods for depolymerizing a polymer, in which the method includes use of a magnetic catalyst. The magnetic catalyst can include, e.g., a ore-shell particle, such as a particle having a magnetic core and a shell including a metal-organic framework.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: September 8, 2020
    Assignees: National Technology & Engineering Solutions of Sandia, LLC, The Regents of the University of California
    Inventors: Jian Sun, Blake A. Simmons, Seema Singh
  • Patent number: 10767465
    Abstract: A system includes a receiver component that receives a model of a well system, the model comprising a representation of an electrically energized well casing and/or a fracture as a transmission line that leaks electric current as the current traverses the well casing and/or fracture. The receiver component also receives a value that indicates an amount of the current that is applied to the well casing and a location of a source of the current on the well casing. The system further includes an electromagnetic field calculator component that calculates an estimated electromagnetic field at at least one location on the surface of the earth based at least in part upon the representation of the electrically energized well casing and/or fracture, the value that indicates the amount of current that is applied to the well casing, and the location of the source of the current on the well casing.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: September 8, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: Lewis C. Bartel
  • Patent number: 10769158
    Abstract: A computer-implemented method of improving processing of overhead image data by a processor using a distance-based quality score in a geospatial-temporal semantic graph. An allowable range for each attribute in the subgraph search template is defined. For each match in a comparison, attribute values of each match element are compared against the preferred range and the allowable range to compute a corresponding distance of each match attribute from the subgraph search template. A corresponding overall match quality score is determined for each match from the subgraph search template, wherein determining the corresponding overall match qualities is performed using a corresponding required quality score and a corresponding optional quality score. All corresponding overall match quality scores are sorted into an ordered list and then displayed.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: September 8, 2020
    Assignee: National Technology & Engineering Solutions od Sandia, LLC
    Inventors: Randolph Brost, Diane Woodbridge
  • Patent number: 10766430
    Abstract: Autonomous vehicles are made by fitting sensors to non-autonomous vehicle platforms. A mounting structure to mount rear-facing sensors to the vehicle is needed to provide sensor data about the rear environment of the vehicle. The mounting structure is secured to the vehicle by utilizing existing vehicle body structures. The vehicle body structures include rearward roof chassis parts that provide stability and security to the mounting structure.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: September 8, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Scott L Frederick, Andrew L Sakowski, Bill Castleman
  • Patent number: 10765864
    Abstract: The present disclosure provides a method and device for filtering sensor data. Signals from an array of sensor pixels are received and checked for changes in pixel values. Motion is detected based on the changes in pixel values, and motion output signals are transmitted to a processing station. If the sum of correlated changes in pixel values across a predetermined field of view exceeds a predetermined value, indicating sensor jitter, the motion output signals are suppressed. If a sum of motion values within a defined subsection of the field of view exceeds a predetermined threshold, indicating the presence of a large object of no interest, the motion output signals are suppressed for that subsection.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: September 8, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Frances S. Chance, Christina E. Warrender
  • Patent number: 10765958
    Abstract: A drive train for a wind tunnel having a nacelle housing with a fan and a fan hub assembly. The drive train comprises: a ratio gear box directly connected to the fan; and a motor disposed remote from the nacelle for powering the fan via a jackshaft and the ratio gearbox. In an embodiment, the wind tunnel has a single fan and single hub assembly. The jackshaft operatively connects the motor and gearbox.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: September 8, 2020
    Assignee: Maida Engineering, Inc.
    Inventors: Joseph F. Maida, Arthur Armellini
  • Patent number: 10767670
    Abstract: A fluid-powered linear motor with rotary pistons is disclosed. An application is for a downhole motor but it could be used in other applications. Rotational pistons provide increased torque generation as the torque generated is proportional to motor length. Since downhole drills are long (generally up to a maximum length of 30 ft.), a high-torque motor can be produced using this method. A pressurized fluid is used to drive the piston assemblies to produce bit shaft power. This concept employs rotary pistons and a mechanical rectifier to convert the rotational reciprocation produced by a reciprocating rotational piston into continuous rotary motion.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: September 8, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: David W. Raymond
  • Patent number: 10766005
    Abstract: Nanostructured polyelectrolyte bilayers deposited by Layer-by-Layer deposition on nanoporous membranes can be selectively crosslinked to modify the polyelectrolyte charge density and control ionic selectivity independent of ionic conductivity. For example, the polyelectrolyte bilayer can comprise a cationic polymer layer, such as poly(ethyleneimine), and an anionic polymer layer, such as poly(acrylic acid). Increasing the number of bilayers increases the cation selectivity when the poly(ethyleneimine) layer is crosslinked with glutaraldehyde. Crosslinking the membranes also increases the chemical and mechanical strength of the polyelectrolyte films. This controllable and inexpensive method can be used to create ion-selective and mechanically robust membranes on porous supports for a wide range of applications.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: September 8, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Leo J. Small, Stephen Percival, Erik David Spoerke
  • Patent number: 10766412
    Abstract: Systems and methods for notifying other road users of a change in speed of a vehicle are disclosed herein. One embodiment receives sensor data from one or more sensors; detects, from the sensor data, one or more other road users; determines a lag time, relative to a commencement of the change in speed of the vehicle, that coincides with an estimated moment at which at least one of the one or more other road users perceives the change in speed of the vehicle; and outputs a signal from the vehicle in accordance with the lag time to notify the at least one of the one or more other road users of the change in speed of the vehicle.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 8, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Benjamin P. Austin, Joshua E. Domeyer, John K. Lenneman
  • Patent number: 10767679
    Abstract: A spring latching connector includes a housing having a bore therethrough, a piston slidably received in said bore, a circular groove formed in one of said bore and piston and a circular coil spring disposed in said groove for latching said piston and housing together. The groove is sized and shaped for controlling, in combination with a spring configuration, disconnect and connect forces of the spring latching connection.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: September 8, 2020
    Assignee: Bal Seal Engineering, LLC
    Inventor: Peter J. Balsells
  • Publication number: 20200276940
    Abstract: A vehicle includes a roof assembly including a roof having an outer facing surface and a roof ditch that extends below the outer facing surface. The roof ditch extends in a vehicle longitudinal direction between a front windshield and a rear window. A rear roof ditch molding is located at least partially within the roof ditch at a rear portion of the roof ditch. A cured roof ditch sealer extends along a front portion of the roof ditch and rearward in the vehicle longitudinal direction toward the rear roof ditch molding. A roof ditch sealer dam is located between a rear end of the cured roof ditch sealer and a front end of the rear roof ditch molding.
    Type: Application
    Filed: March 1, 2019
    Publication date: September 3, 2020
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Daniel G. Shriver, Prasanth Mohankumar
  • Publication number: 20200279796
    Abstract: A semiconductor package device includes a leadframe, a first die and a package body. The leadframe includes a first die paddle and a lead. The first die paddle has a first surface and a second surface opposite to the first surface. The first die is disposed on the first surface of the first die paddle. The package body covers the first die and at least a portion of the first surface of the first die paddle and exposing the lead. The package body has a first surface and a second surface opposite to the first surface. The second surface of the package body is substantially coplanar with the second surface of the first die paddle. The lead extends from the second surface of the package body toward the first surface of the package body. A length of the lead is greater than a thickness of the package body.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Applicant: Advanced Semiconductor Engineering Korea, Inc.
    Inventors: Junyoung YANG, Sangbae PARK
  • Publication number: 20200279788
    Abstract: The present disclosure provides a semiconductor substrate, including a first patterned conductive layer, a dielectric structure on the first patterned conductive layer, wherein the dielectric structure having a side surface, a second patterned conductive layer on the dielectric structure and extending on the side surface, and a third patterned conductive layer on the second patterned conductive layer and extending on the side surface. The present disclosure provides a semiconductor package including the semiconductor substrate. A method for manufacturing the semiconductor substrate and the semiconductor package is also provided.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE
  • Publication number: 20200279804
    Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, an intermediate layer and at least one lower through via. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the upper dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The lower through via extends through at least a portion of the lower conductive structure and the intermediate layer, and is electrically connected to the upper circuit layer of the upper conductive structure.
    Type: Application
    Filed: February 28, 2019
    Publication date: September 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Huei-Shyong CHO, Jhao-Yang CHEN
  • Publication number: 20200279814
    Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, an intermediate layer and at least one through via. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the upper dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The through via extends through the upper conductive structure, the intermediate layer and the lower conductive structure.
    Type: Application
    Filed: February 28, 2019
    Publication date: September 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Meng-Kai SHIH, Wei-Hong LAI, Wei Chu SUN
  • Publication number: 20200279815
    Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
    Type: Application
    Filed: February 28, 2019
    Publication date: September 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Huei-Shyong CHO