Patents Assigned to Engineering
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Publication number: 20200271942Abstract: According to various embodiments, a collimator includes a substrate defining a plurality of channels through the substrate. The substrate includes a first surface and a second surface opposite the first surface. Each of the channels includes a first aperture exposed from the first surface, a second aperture between the first surface and the second surface, and a third aperture exposed from the second surface. The first aperture and the third aperture are larger than the second aperture.Type: ApplicationFiled: May 11, 2020Publication date: August 27, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yuan-Feng CHIANG, Tsung-Tang TSAI, Min Lung HUANG
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Publication number: 20200274523Abstract: A system, method, and computer program product are provided for representation of high-frequency signal data. In use, input data is received including high-frequency signals, wherein the input data is of a first width. Next, the input data is processed to manage display of the input data, where specifically the input data is divided into one or more segments based on first criteria including the first width, and from each segment of the one or more segments, a maximum value is identified and a minimum value is identified. The maximum and minimum may be trend maximum and minimum values. The input data is transformed to a visualizable representation of the high-frequency signals, the visualizable representation of the high-frequency signals including a plot of the maximum value and the minimum value for each segment of the one or more segments. Additionally, the plot is displayed.Type: ApplicationFiled: May 11, 2020Publication date: August 27, 2020Applicant: Schweitzer Engineering Laboratories, Inc.Inventors: Matthew J. Halladay, Eric J. Hewitt
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Publication number: 20200273724Abstract: A method for manufacturing a semiconductor package structure includes providing a semiconductor chip, encapsulating the semiconductor chip via a package body, the package body having a first surface opposite to a second surface, and coating a first self-assembled monolayer (SAM) over the first surface and the second surface of the package body.Type: ApplicationFiled: February 25, 2019Publication date: August 27, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Huang Han CHEN, Ping-Feng YANG
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Publication number: 20200273823Abstract: A semiconductor device package includes a first substrate, a second substrate, an electrical contact and a support element. The first substrate has a first surface. The second substrate has a first surface facing the first surface of the first substrate. The electrical contact is disposed between the first substrate and the second substrate. The support element is disposed between the first substrate and the second substrate. The support element includes a thermosetting material.Type: ApplicationFiled: February 27, 2019Publication date: August 27, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsiang Chi CHEN, Cheng-Nan LIN
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Publication number: 20200268830Abstract: Cultures of Delftia bacteria are disclosed. Antimicrobial agents derived therefrom are also disclosed.Type: ApplicationFiled: March 28, 2018Publication date: August 27, 2020Applicants: Ministry of Health, State of Israel, Sami Shamoon College of Engineering (R.A), Tel HaShomer Medical Research Infrastructure and Services Ltd.Inventors: Israel NISSAN, Noa Lea TEJMAN-YARDEN, Chaim RUBINOVITZ, Yakov DAVIDOV, Galia RAHAV, Ari ROBINSON, Yoram SHOTLAND
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Publication number: 20200273722Abstract: A semiconductor package structure includes a first insulating layer, a first conductive layer, a multi-layered circuit structure, a protection layer, and a semiconductor chip electrically connected to the multi-layered circuit structure. The first insulating layer defines a first through hole extending through the first insulating layer. The first conductive layer includes a conductive pad disposed in the first through hole and a trace disposed on an upper surface of the first insulating layer. The multi-layered circuit structure is disposed on an upper surface of the first conductive layer. The multi-layered circuit structure includes a bonding region disposed on the conductive pad of the first conductive layer and an extending region disposed on the trace of the first conductive layer. The protection layer covers the upper surface of the first insulating layer and the extending region of the multi-layered circuit structure, and exposes the bonding region of the multi-layered circuit structure.Type: ApplicationFiled: May 8, 2020Publication date: August 27, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wen Hung HUANG, Yan Wen CHUNG
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Publication number: 20200271571Abstract: An optical device includes a carrier, a light source, a die, a light guiding structure and a reflecting structure. The carrier has a surface. The light source is disposed on the surface and configured to emit a light beam. The die is disposed on the surface and configured to sense the light beam. The light guiding structure is disposed on the surface and configured to guide the light beam. The light guiding structure includes a light receiving surface facing the light source and a light exit surface. The reflecting structure is disposed over the die. The reflecting structure includes a light reflecting surface facing the light exit surface of the light guide structure and is configured to reflect the light beam exiting from the light exit surface to the die. The light reflecting surface and the light exit surface are separated from each other and define a vent hole.Type: ApplicationFiled: May 11, 2020Publication date: August 27, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Shih-Tien FENG
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Publication number: 20200275030Abstract: An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.Type: ApplicationFiled: February 25, 2019Publication date: August 27, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Han WANG, Ian HU, Meng-Kai SHIH, Hsuan Yu CHEN
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Patent number: 10755000Abstract: Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object.Type: GrantFiled: November 6, 2016Date of Patent: August 25, 2020Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., University of MarylandInventors: Hannes Martin Hinrich Greve, F. Patrick McCluskey, Shailesh N. Joshi
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Patent number: 10751840Abstract: A multilayer composite bonding material with a plurality of thermal stress compensation layers is provided. The plurality of thermal stress compensation layers include a metal core layer, a pair of particle layers extending across the metal core layer such that the metal core layer is sandwiched between the pair of particle layers, and a pair of metal outer layers extending across the pair of particle layers such that the pair of particle layers are sandwiched between the pair of metal outer layers. A pair of low melting point (LMP) bonding layers extend across the pair of metal outer layers. The metal core layer, the pair of particle layers, and the pair of metal outer layers each have a melting point above a transient liquid phase (TLP) sintering temperature, and the pair of LMP bonding layers each have a melting point below the TLP sintering temperature.Type: GrantFiled: January 30, 2018Date of Patent: August 25, 2020Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Shailesh N. Joshi, Ercan M. Dede
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Patent number: 10754133Abstract: A cloaking device includes an object-side, an image-side, an object-side curved cloaking region (CR) boundary having an outward facing mirror surface and an inward facing surface, and an image-side curved CR boundary an outward facing mirror surface and an inward facing surface. A cloaked region is bounded by the inward facing surfaces of the object-side curved CR boundary and the image-side curved CR boundary. At least one exterior boundary with an inward facing mirror surface is spaced apart from the object-side curved CR boundary and the image-side curved CR boundary. Light from an object positioned on the object-side of the cloaking device and obscured by the cloaked region is redirected around the cloaked region to form an image of the object on the image-side of the cloaking device such that the light from the object appears to pass through the CR.Type: GrantFiled: July 26, 2017Date of Patent: August 25, 2020Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Kyu-Tae Lee, Debasish Banerjee
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Patent number: 10756434Abstract: A loop antenna is described herein that is suitable for operation in free space or in proximity to a ground plane. The loop antenna comprises a looped conductive element with a gap formed therein and a tab extending toward the gap. A length of the tab of the loop antenna is selected such that a detuning loss of the loop antenna from operation in free space to operation in proximity to a ground plane is low. In an exemplary embodiment, the length of the tab is selected such that a reactance of the loop antenna in free space is within a threshold level of a reactance of the loop antenna when the antenna is in proximity to a ground plane.Type: GrantFiled: September 11, 2018Date of Patent: August 25, 2020Assignee: National Technology & Engineering Solutions of Sandia, LLCInventor: John Joseph Borchardt
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Patent number: 10752186Abstract: A vehicle includes a vehicle body including a quarter panel assembly. The quarter panel assembly includes an inner quarter panel and an outer quarter panel located outboard of the inner quarter panel forming a volume therebetween. The outer quarter panel has a vent opening extending therethrough. A quarter vent assembly is connected to the outer quarter panel covering the vent opening. An exterior fascia covers the quarter vent assembly such that an air gap is provided between the quarter vent assembly and the exterior fascia. A service hole cover is located in the volume between the inner quarter panel and the outer quarter panel. The service hole cover includes a cover body and a noise reduction flange at a bottom of the cover body that extends inboard toward the inner quarter panel at the vent opening.Type: GrantFiled: November 21, 2018Date of Patent: August 25, 2020Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Matthew C. Tier, Koh Mizutani, Marc Siciliano, Jason T. Huang, Michael Camilleri, Robert Porcs
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Patent number: 10752849Abstract: Systems and methods are provided for upgrading catalytic slurry oil. The upgrading can be performed by deasphalting the catalytic slurry oil to form a deasphalted oil and a residual or rock fraction. The deasphalted oil can then be hydroprocessed to form an upgraded effluent that includes fuels boiling range products.Type: GrantFiled: March 22, 2018Date of Patent: August 25, 2020Assignee: ExxonMobil Research & Engineering CompanyInventors: Stephen H. Brown, Brian A. Cunningham, Randolph J. Smiley, Samia Ilias, Keith K. Aldous, Sara K. Green, Patrick L. Hanks, Kendall S. Fruchey
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Patent number: 10753976Abstract: The present disclosure relates to systems and methods for detecting transient high-torque events associated with rotating machinery in an electric power system. In one embodiment, a relay may include an electrical parameters module that receives a representation of a voltage and a current at a terminal of rotating machinery in an electric power system. A torque calculation module may continuously determine a calculated torque value for the rotating machinery using the representation of the voltage and the current at the terminal of the rotating machinery and compare each calculated torque value to a threshold. An action module may generate an alarm when the calculated torque value exceeds the threshold. A log module may generate a log comprising a peak of the calculated torque value and a time at which the peak torque value occurs.Type: GrantFiled: October 13, 2017Date of Patent: August 25, 2020Assignee: Schweitzer Engineering Laboratories, Inc.Inventors: Dale S. Finney, Normann Fischer, Derrick Haas
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Patent number: 10756528Abstract: A system and method for installing a section of heat shrink tubing on a wire is disclosed. The system includes an infeed guide that receives the continuous length of tubing and initially opens the tubing from a compressed condition. The continuous length of tubing is received in a cutting guide and cut to a desired length. After cutting, a pair of spaced support jaws move together to open the cut section of tubing. A funnel having a first opening and a second opening is moved into engagement with the section of tubing such that the second opening is received within the section of tubing. A wire is inserted into the funnel which guides the wire into the cut section of tubing. Once the wire is received within the cut section of tubing, the funnel and support jaws are removed and the wire is removed with the section of support tubing installed thereon.Type: GrantFiled: February 19, 2018Date of Patent: August 25, 2020Assignee: Artos Engineering CompanyInventor: Michael A. Kirst
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Patent number: 10752846Abstract: Systems and methods are provided for improving the processing of heavy or challenged feeds in a refinery based on integrated use of deasphalting, coking, and hydroprocessing. An optional fluid catalytic cracking unit can be included in the integrated system to allow for further improvements. The improved processing can be facilitated based on a process configuration where the vacuum resid fractions and/or other difficult fractions are deasphalted to generate a deasphalted oil and a deasphalter residue or rock fraction. The deasphalted oil can be passed into a hydroprocessing unit for further processing. The rock fraction can be used as the feed to a coking unit. Although deasphalter residue or rock is typically a feed with a high content of micro carbon residue, a high lift deasphalting process can allow a portion of the micro carbon residue in the initial feed to remain with the deasphalted oil.Type: GrantFiled: March 23, 2018Date of Patent: August 25, 2020Assignee: ExxonMobil Research & Engineering CompanyInventors: Stephen H. Brown, Brian A. Cunningham, Randolph J. Smiley, Samia Ilias, Brenda A. Raich, Tien V. Le
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Patent number: 10756956Abstract: A software-defined network controller (SDN controller) defines a first network flow to be selectively implemented by a networking device according to a first network operation profile. The SDN controller defines a second network flow to be selectively implemented by the networking device according to a second network operation profile. A memory device of the networking device may store at least first and second network operation profiles for selective implementation based on network packet characteristic matching and/or a “trigger alarm” event. The first network operation profile is implemented when an incoming network packet matches a pre-defined and/or customizable network packet characteristic match template. The second network operation profile is implemented when a “trigger alarm” event is received. A network operation profile may execute a write action to latch, or otherwise trigger, a physical alarm of a networking device or associated device.Type: GrantFiled: January 16, 2019Date of Patent: August 25, 2020Assignee: Schweitzer Engineering Laboratories, Inc.Inventors: Dennis Gammel, Rhett Smith
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Patent number: 10754068Abstract: A sighting system including a sighting axis which passes through one or more sighting elements each disposed at an angle to the sighting axis and which include coating comprising a plurality of layers which increase transmission of incident light along the sighting axis.Type: GrantFiled: June 4, 2018Date of Patent: August 25, 2020Assignee: Engineered Outdoor Products, LLCInventor: James Mandos, III
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Patent number: 10754201Abstract: A liquid crystal photoelectric apparatus including an upper substrate, a lower substrate, a plurality of alignment layers, and a liquid crystal material is provided. The alignment layers include an upper alignment layer, a lower alignment layer, and at least one intermediate alignment layer. The upper alignment layer has a first orientation direction. The lower alignment layer has a second orientation direction. The at least one intermediate alignment layer has an intermediate orientation direction. The intermediate orientation direction is between the first orientation direction and the second orientation direction. The liquid crystal material includes a plurality of liquid crystal material portions. Each of the liquid crystal material portions is disposed between any adjacent two alignment layers. A manufacturing method of the liquid crystal photoelectric apparatus is also provided.Type: GrantFiled: October 23, 2018Date of Patent: August 25, 2020Assignees: National Tsing Hua University, Advanced Comm. Engineering Solution Co., Ltd.Inventors: Ci-Ling Pan, Anup Kumar Sahoo, Chun-Ling Yen, Chan-Shan Yang, Yi-Hsin Lin, Hung-Chun Lin, Yu-Jen Wang