Abstract: A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treated with a metal salt solution, containing at least one salt from the following group: cobalt salt, silver salt, tin salt, and lead salt. The plastic surface is treated with a sulfide solution. Finally, the plastic surface is metallized in a metallizing bath.

Abstract: A process for the deposition of a metal on surfaces of a shaped plastic body. A catalyst for metal deposition is incorporated into a shaped body. After removing material from a surface of the body and activating the catalyst with an acid, metal is deposited on the surface by an electroless metal deposition process.

Abstract: The invention relates to a method for coating workpieces. According to said method, an alloy containing at least phosphorus and nickel is precipitated from an electrolyte to produce a functional, especially corrosion-resistant and wear-resistant metallic coating. The aim of the invention is to provide a means of increasing wear resistance and hardness and improving the anti-corrosion effect with a significantly higher rate of incorporation of elementary phosphorus. To this end, an at least quarternary alloy with the components nickel, cobalt, wolfram and phosphorus is electrolytically precipitated in the form of a coating. The invention also relates to a corrosion-resistant and wear-resistant coating with essentially the following composition: 0.5 to 2.0 wt. % wolfram; 1.0 to 2.0 wt % cobalt; 15 to 20 wt. % phosphorus and at least 10 wt. % nickel.

Abstract: There is provided an electrodeposit free of cobalt, cadmium and nickel which contains 1.25 to 1.55% w/w iron, 1 to 2 ppm zirconium; and 97.7 to 98.2% gold and has a pale yellow color less than 3N on the NIHS scale. The invention also provides an electroplating bath, free of cobalt, cadmium and nickel comprising gold, as cyanide, iron as a soluble salt or complex, a soluble zirconium salt or complex, a citrate, a weak acid, and optionally a heterocyclic sulphonate, which in a preferred form comprises gold as cyanide in an amount of 2.5 to 3.5 g/l gold, iron as iron nitrate in an amount of 0.6 to 0.8 g/l, zirconium as zirconium nitrate in an amount of 0.2 to 0.5 g/l, diammonium hydrogen citrate in an amount of 75 to 125 g/l, citric acid in an amount of 40 to 80 g/l, and 3-(1-pyridino)-1-propane sulphonate in an amount of 1 to 3 g/l.

Abstract: A dielectric coating for a circuit board which is adherent to electroless copper. The coating is an epoxy dielectric including an amount of a solubilized nitrile-free butadiene or isoprene agent for promoting adhesion of an electroless copper coating. A method for producing a circuit board is also disclosed.

Abstract: A method for depositing a zinc-nickel alloy from a zinc-nickel electrolyte to which an additive has been added in order to broaden the usable current density range. An electrolyte suitable for this method is also presented. The additive is an aromatic or aliphatic carboxylic acid, salt, or derivative. The additive provides for the use of ammonium-free electrolytes.

Abstract: A method for coating a light metal alloy component to form a protective layer comprising Sn. First, a surface of the light metal alloy component is cleaned and passivated. A layer comprising Zn is formed on the surface, and a layer comprising Sn is deposited. An intermediate layer is preferably deposited between the Zn-containing layer and the Sn containing layer. The Sn-containing layer may additionally be varnished.

Abstract: Process for the direct metallizing of the surface of a plastic object. The surface of the plastic object is roughened by pickling. The surface is activated with the aid of a colloidal or ionogenic aqueous solution of a first precious metal, which colloidal or ionogenic aqueous solution also contains a second base metal. This forms an activation coat on the surface containing the first precious and the second base metals. Electron conductivity of the activation coat is provided with the aid of a treatment solution, with which the second base metal is at least partially dissolved out of the activation coat and an electron conducting substance is adsorb in the activation coat. Then the electron-conductive activation coat is metallized. Before the electron conducting activation coat is metallized, the sequence of steps “activation of the surface and establishment of electronic conductivity” is repeated at least once.

Abstract: A plastic surface to be metallized is contacted with a preactivation solution after an etching step and before an activation step. The solution comprises permanganate, a crosslinking agent, and a pH buffer material. As a result of the preactivation treatment with the solution, the plastic surface is changed in such a manner that the activation step can be carried out more efficiently. The method enables plastics to be metallized more efficiently and at lower cost, or in some cases to be metallized at all.

Abstract: A method is provided for the selective deposition of an organic solderability preservative (OSP) coating on copper surfaces of articles such as electronic components, e.g., printed wiring boards, to serve as a protective coating and preserve the solderability of the copper surface while substantially excluding gold surfaces from attracting the same OSP coating which coating causes cosmetic defects in the form of staining and may reduce the conductivity of the gold contact surface. The method improves the conventional OSP process and utilizes a pre-treatment of the copper surface before applying the OSP coating comprising treating the cleaned and preferably micro-etched copper with an aqueous solution of benzimidazole or derivative thereof to form a precoat on the copper surface. After the pre-treatment step, the precoated copper surface is conventionally treated with a suitable OSP solution such as an aqueous solution of a substituted benzimidazole compound, preferably at the 2-position.

Abstract: A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof. The lubricant additive is especially adapted for inclusion in a non-aqueous flux vehicle that is mixed with a solder alloy powder to make a solder paste used in the manufacture of printed circuit boards.

Abstract: The present invention pertains to a method for the care and maintenance of an electrolyte, wherein the ion concentration and ion composition of the electrolyte are adjusted by means of an ion exchanger. Advantageously, the ion exchanger contains counterions that are contained in the electrolyte and that are relevant for the bath quality. For the exchange process, these counterions are exchanged with ions which negatively influence the bath quality from the electrolyte. Therefore, the composition of the electrolyte and the corresponding ion concentration are adjusted in an advantageous way. Therefore, e.g., the pH value of an electrolyte and its density can be held substantially constant, which considerably lengthens the lifetime of the electrolyte. By guaranteeing a substantially constant composition, the lifetime is no longer restricted. The extremely high effectiveness of the method according to the invention is dependent on these conditions.

Abstract: This invention provides a process for the electrolytic production of metal containing solutions and in particular a high concentration low impurity low alpha lead methane sulfonate solution using a specially designed electrolytic membrane cell. The process electrolytically dissolves low alpha lead in the anode compartment of the electrolytic cell using an anion exchange membrane that separates the anode compartment from the cathode compartment. The specially designed electrolytic cell can also be used to electrolytically dissolve other metals such as tin, copper, etc. in a suitable electrolyte and membrane. The cell utilizes a two-part membrane holder having a female member and a male member, one of which is attached to the cell walls and base with a water tight seal. The membrane holder effectively minimizes contamination between the anode and cathode compartments and allows the use of inexpensive materials such as stainless steel for the cathode.

Abstract: There is disclosed an electroplating bath for depositing zinc/manganese alloys on a substrate characterized in that it comprises an aqueous bath free or substantially free of ammonium halide and of fluoroborate which is made up from 10-150 g/l, alkali metal salt, 30-90 g/l boric acid, 10-200 g/l water soluble zinc salt, 10-50 g/l water soluble manganese salt, 60-140 g/l alkali metal gluconate or tartrate and a base e.g. an alkali metal hydroxide to bring the pH to the range 6.1-7.1.

Abstract: An electrically conductive paint for applying to substrates to make articles of manufacture including EMI/RFI shielded housings of electronic components and printing plates comprises a cross-linked organic resin binder containing cross-linkable functional groups such as OH groups, electrically conductive metallic particles, preferably a mixture of silver flakes and silver-coated copper flakes, a solvent, a cross-linking agent which cross-links with itself and with the functional groups of the organic binder and preferably a catalyst which accelerates cross-linking of the cross-linking agent and organic binder. Using such a paint formulation it has been found that thinner coatings can be used while still exceeding the properties needed for EMI/RFI shielding of housing for electronic components.

Abstract: A method of purifying an electrolyte by bringing the electrolyte into contact with a first effective surface of a separating unit that is permeable to contaminants to be removed from the electrolyte, and bringing a purifying liquid into contact with a second effective surface of the separating unit. A concentration level of contaminants in the purifying liquid is maintained to maintain a contaminant driving force gradient between the electrolyte and the purifying liquid so contaminants transfer from the electrolyte into the purifying liquid. An apparatus for purifying an electrolyte having a first volumetric region for holding the electrolyte, a second volumetric region for holding a purifying liquid, and a separating unit that is permeable to the contaminants to be removed from the electrolyte and which fluidically separates the first and second volumetric regions.

Abstract: Process for the planting of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.

Abstract: Shielding means comprising a non-conductive base material having thereon a combined electrolessly-deposited metal layer of copper over lain with a second layer.