Patents Assigned to Enthone Inc.
  • Tin-silver solder bumping in electronics manufacture
    Patent number: 7713859
    Abstract: A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: May 11, 2010
    Assignee: Enthone Inc.
    Inventors: Thomas B. Richardson, Marlies Kleinfeld, Christian Rietmann, Igor Zavarine, Ortrud Steinius, Yun Zhang, Joseph A. Abys
  • Manufacture of electroless cobalt deposition compositions for microelectronics applications
    Patent number: 7704306
    Abstract: A method of preparing an aqueous electroless deposition composition for electrolessly depositing Co or a Co alloy onto a substrate in manufacture of microelectronic devices by treating water or an aqueous electroless deposition composition with a deoxygenating treatment to reduce the oxygen concentration.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: April 27, 2010
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Richard Hurtubise, Vincent Paneccasio, Charles Valverde, Daniel Stritch
  • SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION
    Publication number: 20100075496
    Abstract: A method is disclosed for metallizing a substrate comprising an interconnect feature in the manufacture of a microelectronic device, wherein the interconnect feature comprises a bottom, a sidewall, and a top opening having a diameter, D. The method comprises the following steps: depositing a barrier layer on the bottom and the sidewall of the interconnect feature, the barrier layer comprising a metal selected from the group consisting of ruthenium, tungsten, tantalum, titanium, iridium, rhodium, and combinations thereof; contacting the substrate comprising the interconnect feature comprising the bottom and sidewall having the barrier layer thereon with an aqueous composition comprising a reducing agent and a surfactant; and depositing copper metal onto the bottom and the sidewall of the interconnect feature having the barrier layer thereon.
    Type: Application
    Filed: September 25, 2008
    Publication date: March 25, 2010
    Applicant: ENTHONE INC.
    Inventors: Qingyun Chen, Xuan Lin, Vincent Paneccasio, JR., Richard Hurtubise
  • Adhesion promotion in printed circuit boards
    Patent number: 7682432
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: March 23, 2010
    Assignee: Enthone Inc.
    Inventors: Abayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
  • Copper metallization of through silicon via
    Patent number: 7670950
    Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate comprising immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition comprising a source of copper ions, an organic sulfonic acid or inorganic acid, or one or more organic compounds selected from among polarizers and/or depolarizers, and chloride ions.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: March 2, 2010
    Assignee: Enthone Inc.
    Inventors: Thomas B. Richardson, Yun Zhang, Chen Wang, Vincent Paneccasio, Jr., Cai Wang, Xuan Lin, Richard Hurtubise, Joseph A. Abys
  • CYANIDE-FREE ELECTROLYTE COMPOSITION, AND METHOD FOR THE DEPOSITION OF SILVER OR SILVER ALLOY LAYERS ON SUBSTRATES
    Publication number: 20100044239
    Abstract: The invention relates to a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate as well as a method for depositing such layers with the help of said cyanide-free electrolyte composition. The electrolyte composition according to the invention comprises at least one silver ion source, a sulfonic acid and/or a sulfonic acid derivative, a wetting agent and a hydantoin. The silver or silver alloy layers deposited from such an electrolyte composition by means of the method according to the invention are dull and ductile.
    Type: Application
    Filed: October 9, 2007
    Publication date: February 25, 2010
    Applicant: ENTHONE INC.
    Inventors: Stefan Schäfer, Thomas B. Richardson
  • Insoluble anode
    Patent number: 7666283
    Abstract: The invention relates to an insoluble anode for electrolytic plating, the insoluble anode having two or more phases comprising an anode base body and a screen wherein the anode base body of steel, stainless steel, nickel, nickel alloy, cobalt, and cobalt alloy.
    Type: Grant
    Filed: April 12, 2006
    Date of Patent: February 23, 2010
    Assignee: Enthone Inc.
    Inventors: Andreas Möbius, Marc L. A. D. Mertens
  • DEPOSITION OF CONDUCTIVE POLYMER AND METALLIZATION OF NON-CONDUCTIVE SUBSTRATES
    Publication number: 20100012500
    Abstract: A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn(II) ions in an amount sufficient to provide an initial concentration of Mn(II) ions of at least about 0.
    Type: Application
    Filed: September 7, 2007
    Publication date: January 21, 2010
    Applicant: ENTHONE INC.
    Inventors: Agata Lachowicz, Andreas Glöcker
  • METHOD AND DEVICE FOR COATING SUBSTRATE SURFACES
    Publication number: 20090324804
    Abstract: The invention relates to a method for coating substrate surfaces with a metal or oxide layer in a coating bath. Said bath has at least one component the concentration of which changes during the coating process and which therefore has to be replenished or removed in order to maintain the quality of the bath. The method according to the invention is characterized in that the component is replenished and/or removed depending on the strength of the composition of the bath.
    Type: Application
    Filed: January 26, 2007
    Publication date: December 31, 2009
    Applicant: ENTHONE INC.
    Inventors: Helmut Horsthemke, Franz-Josef Stark
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7615491
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 10, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7611988
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 3, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7611987
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 3, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Method for etching non-conductive substrate surfaces
    Patent number: 7578947
    Abstract: An etching composition for non-conductive substrates such as polyester, polyether, polyimide, polyurethane, epoxy resin, polysulfone, polyethersulfone, polyetherimide, and polyamide, comprising a halogenide and/or nitrate of a metal selected from the group consisting of Na, Mg, Al, Si, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ca, Zn, and combinations thereof such as FeCl3, FeCl2, TiCl3, CaCl2, CuCl2, CrCl3, ZnCl2, MgCl2, MnCl2, and Cr(NO3)3; and a related method for etching.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: August 25, 2009
    Assignee: Enthone Inc.
    Inventors: Mark Peter Schildmann, Ulrich Prinz, Andreas Königshofen
  • Method for treating laser-structured plastic surfaces
    Patent number: 7578888
    Abstract: The present invention relates to a method for treating plastic substrates structured by means of a laser or generation of seed structures on the surface that are suitable for subsequent metallization. The substrates, after the laser structuring, are brought into contact with a process solution that is suitable for removal of the unintentional deposits that arise during the laser structuring. The treatment of the laser-structured substrates with a mixture of wetting agents and compositions that support the cleaning before metallization leads to sufficient removal of the unintentionally deposited metal seeds, without having a lasting damaging effect on the planned structured surface paths.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: August 25, 2009
    Assignee: Enthone Inc.
    Inventor: Mark Peter Schildmann
  • METROLOGY IN ELECTROLESS COBALT PLATING
    Publication number: 20090155468
    Abstract: Electrolessly depositing a cobalt-based alloy on a metal surface of a substrate in a process which involves monitoring for Co3+ ion concentration in a sample of the electroless cobalt deposition composition during said contacting; and replacing or regenerating the electroless cobalt deposition composition when the concentration of Co3+ ions exceeds a predetermined concentration of Co3+ ions.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 18, 2009
    Applicant: ENTHONE INC.
    Inventors: Nicolai Petrov, Paul Figura, Qingyun Chen, Charles Valverde, Richard Hurtubise
  • COMPOSITE COATINGS FOR WHISKER REDUCTION
    Publication number: 20090145764
    Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.
    Type: Application
    Filed: December 11, 2007
    Publication date: June 11, 2009
    Applicant: ENTHONE INC.
    Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, JR., Chen Xu
  • COMPOSITE COATINGS FOR WHISKER REDUCTION
    Publication number: 20090145765
    Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.
    Type: Application
    Filed: October 20, 2008
    Publication date: June 11, 2009
    Applicant: ENTHONE INC.
    Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, JR., Chen Xu
  • SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS
    Publication number: 20090121192
    Abstract: A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.
    Type: Application
    Filed: November 10, 2008
    Publication date: May 14, 2009
    Applicant: ENTHONE INC.
    Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
  • COPPER METALLIZATION OF THROUGH SILICON VIA
    Publication number: 20090035940
    Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate comprising immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition comprising a source of copper ions, an organic sulfonic acid or inorganic acid, or one or more organic compounds selected from among polarizers and/or depolarizers, and chloride ions.
    Type: Application
    Filed: August 4, 2008
    Publication date: February 5, 2009
    Applicant: ENTHONE INC.
    Inventors: Thomas B. Richardson, Yun Zhang, Chen Wang, Vincent Paneccasio, JR., Cai Wang, Xuan Lin, Richard Hurtubise, Joseph A. Abys
  • CORROSION PROTECTION OF BRONZES
    Publication number: 20080314283
    Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol.
    Type: Application
    Filed: June 21, 2007
    Publication date: December 25, 2008
    Applicant: ENTHONE INC.
    Inventors: Joseph A. Abys, Shenliang Sun, Edward J. Kudrak, Katrin Zschintzsch, Theodore Antonellis