Patents Assigned to Enthone Inc.
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Publication number: 20060141784Abstract: An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyether groups. The method involves superfilling by rapid bottom-up deposition at a superfill speed by which Cu deposition in a vertical direction from the bottoms of the features to the top openings of the features is substantially greater than Cu deposition on the side walls.Type: ApplicationFiled: November 14, 2005Publication date: June 29, 2006Applicant: Enthone Inc.Inventors: Vincent Paneccasio, Xuan Lin, Paul Figura, Richard Hurtubise
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Publication number: 20060083850Abstract: An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.Type: ApplicationFiled: March 21, 2005Publication date: April 20, 2006Applicant: Enthone Inc.Inventors: Charles Valverde, Nicolai Petrov, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Richard Hurtubise, Christian Witt
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Publication number: 20060049058Abstract: The present invention relates to a method as well as and electrolyte for the electrolytic deposition of mat or half-glossy copper layers from an acid electrolyte in a pull-through device. The method according to the invention is operated with current densities comprises between 10 and 100 A/dm2 and is suitable for depositing sufficiently thick copper layers in high-speed pull-through devices. The electrolyte according to the invention comprises apart from copper, alkyl sulfonic acid.Type: ApplicationFiled: August 29, 2005Publication date: March 9, 2006Applicant: Enthone Inc.Inventors: Christel van Wijngaarden, Marco Schottle, Marlies Kleinfeld, Joachim Heyer
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Publication number: 20050266165Abstract: A method for metallizing plastic surfaces in which sulfides or polysulfides of activator metal are reduced to metal. This results in a conductive layer on which a metal layer can then be directly electrolytically deposited.Type: ApplicationFiled: May 27, 2005Publication date: December 1, 2005Applicant: Enthone Inc.Inventors: Andreas Mobius, Jurgen Hupe
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Publication number: 20050263403Abstract: A method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.Type: ApplicationFiled: April 14, 2005Publication date: December 1, 2005Applicant: Enthone Inc.Inventors: Katrin Zschintzsch, Joachim Heyer, Marlies Kleinfeld, Stefan Schafer, Ortrud Steinius
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Publication number: 20050224092Abstract: The present invention relates to a method for treating plastic substrates structured by means of a laser or generation of seed structures on the surface that are suitable for subsequent metallization. The substrates, after the laser structuring, are brought into contact with a process solution that is suitable for removal of the unintentional deposits that arise during the laser structuring. The treatment of the laser-structured substrates with a mixture of wetting agents and compositions that support the cleaning before metallization leads to sufficient removal of the unintentionally deposited metal seeds, without having a lasting damaging effect on the planned structured surface paths.Type: ApplicationFiled: April 8, 2005Publication date: October 13, 2005Applicant: Enthone Inc.Inventor: Mark Schildmann
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Publication number: 20050194256Abstract: A method for the regeneration of an electrolyte bath used for an electroless metallization process. A partial flow of electrolyte is removed from the process vessel and regenerated by dialysis or electrodialysis. Metallization components are replenished. The partial flow is returned to the process vessel.Type: ApplicationFiled: January 19, 2005Publication date: September 8, 2005Applicant: Enthone Inc.Inventors: Andreas Mobius, Axel Konig, Hubertus van Dun
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Patent number: 6897152Abstract: The present invention is directed to a copper bath composition and a process for the electroless and/or electrolytic plating of copper to fill vias and trenches during the manufacture of integrated circuits. Specifically, the copper bath composition comprises water, copper ions, hydroxide ions, a complexing agent to inhibit the formation of copper oxides, copper hydroxides and copper salts, a stabilizer to control the rate of electroless copper plating, a reducing agent to promote the electroless reduction of the copper ions to copper metal, and a catalyst to promote the electrolytic reduction copper ions to copper metal.Type: GrantFiled: February 5, 2003Date of Patent: May 24, 2005Assignee: Enthone Inc.Inventor: Han Verbunt
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Patent number: 6875260Abstract: The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at least about 95° C., and maintaining the precursor solution at said temperature for at least about 30 minutes, wherein the precursor solution comprises water, chlorine ions, copper ions, tin (II) ions, and an antioxidant compound which substantially prevents the oxidation of the tin (II) ions to tin (IV) ions.Type: GrantFiled: December 10, 2002Date of Patent: April 5, 2005Assignee: Enthone Inc.Inventor: Han Verbunt
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Patent number: 6855437Abstract: The subject of the invention is a layer system for the decorative coating of galvanizable work pieces. In order to have a layer system which meets strict requirements with regard to corrosion resistance and which, at the same time, has a high abrasion resistance and, in addition, provides a high degree of freedom with regard to decorative coloration, the invention proposes a layer system which is formed by galvanic deposition and comprises a base coat consisting of at least one bright layer and one discontinuous chrome layer as well as a cover coat of mechanically resistant materials deposited by the PVD process.Type: GrantFiled: January 26, 2001Date of Patent: February 15, 2005Assignee: Enthone Inc.Inventors: Hiltrud Tolls, Elmar Tolls
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Patent number: 6837981Abstract: The invention relates to a method for the electrolytic coating of materials, in particular metallic materials, whereby a chromium alloy is deposited from an electrolyte, comprising at least chromic acid, sulphuric acid, an isopolyanion-forming metal, a short-chain aliphatic sulphonic acid, the salts and/or halo-derivatives thereof and fluorides. According to the invention, an alloy can be deposited, which can comprise a high proportion of isopolyanion-forming metal as a result of the combined addition of the short-chain aliphatic sulphonic acid with the fluorides and is nevertheless smooth and lustrous. In comparison with the alloy coatings known in the state of the art, in particular chrome/molybdenum alloys the above is a definite advantage. Furthermore, the presence of fluorides in particular leads to the above deposited coatings having a significantly higher hardness.Type: GrantFiled: November 3, 2001Date of Patent: January 4, 2005Assignee: Enthone Inc.Inventor: Helmut Horsthemke
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Patent number: 6821323Abstract: The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is a created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the layer.Type: GrantFiled: July 31, 2002Date of Patent: November 23, 2004Assignee: Enthone Inc.Inventors: Jane Bell, Joachim Heyer, Jürgen Hupe, Ingo Kalker, Marlies Kleinfeld
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Patent number: 6797141Abstract: The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production interruptions for regeneration. Especially, it is envisaged to conduct the process for the precipitation of non-glaring metal coatings in such a manner that work can proceed in three shifts for five days per week, without encountering production interruptions due to coagulation of the fine dispersal phase, respectively, and without the additional operating cost of a heating/cooling circuit. The invention solves the problem in that during the extended use of an electrolyte a partial flow is split off which is filtered and, if applicable, regenerated by the addition of active substances and reintegrated in the operating cycle.Type: GrantFiled: October 3, 2002Date of Patent: September 28, 2004Assignee: Enthone Inc.Inventors: Ralf Wilhelm Ludwig, Gerd Schöngen, Elmar Tolls
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Patent number: 6776893Abstract: A copper electroplating bath and a method to plate substrates with the bath are provided. The bath and method are particularly effective to plate electronic components such as semiconductive wafer VLSI and ULSI interconnects with void-free fill copper plating for circuitry forming vias and trenches and other small features less than 0.2 microns with high aspect ratios. The copper bath contains a bath soluble organic divalent sulfur compound, and a bath soluble polyether compound such as a block copolymer of polyoxyethylene and polyoxypropylene, a polyoxyethylene or polyoxypropylene derivative of a polyhydric alcohol and a mixed polyoxyethylene and polyoxypropylene derivative of a polyhydric alcohol. A preferred polyether compound is a mixed polyoxyethylene and polyoxypropylene derivative of glycerine. A preferred copper bath also contains a pyridine compound derivative.Type: GrantFiled: November 20, 2000Date of Patent: August 17, 2004Assignee: Enthone Inc.Inventors: Elena H. Too, Paul R. Gerst, Vincent Paneccasio, Jr., Richard W. Hurtubise
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Publication number: 20040152303Abstract: The present invention is directed to a copper bath composition and a process for the electroless and/or electrolytic plating of copper to fill vias and trenches during the manufacture of integrated circuits. Specifically, the copper bath composition comprises water, copper ions, hydroxide ions, a complexing agent to inhibit the formation of copper oxides, copper hydroxides and copper salts, a stabilizer to control the rate of electroless copper plating, a reducing agent to promote the electroless reduction of the copper ions to copper metal, and a catalyst to promote the electrolytic reduction copper ions to copper metal.Type: ApplicationFiled: February 5, 2003Publication date: August 5, 2004Applicant: Enthone, Inc.Inventor: Han Verbunt
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Publication number: 20040144285Abstract: The invention concerns an electrolyte for electroless deposition of metal layers with internal compressive stresses containing a metal base salt, a reducing agent, a complexing agent, an accelerator and a stabilizer. In order to make available an electrolyte of the said kind, from which uniform pore-free and crack-free metal-phosphorus coatings can be deposited with constant layers properties and high phosphorus contents at an elevated deposition rate over a long period of time, it is proposed by means of the invention that the electrolyte contain as metal base salt a metal salt whose anions contain at least one carbon atom and that is present in a starting concentration from 0.01 to 0.3 mol/L. At least one salt consisting of metal acetate, metal formate, metal oxalate, metal propionate, metal citrate and metal ascorbate, especially preferably metal acetate, is used as the metal salt whose anion contains at least one carbon atom.Type: ApplicationFiled: October 3, 2003Publication date: July 29, 2004Applicant: Enthone Inc.Inventors: Franz-Josef Stark, Helmut Horsthemke, Ulrich Treuner
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Publication number: 20040132300Abstract: This invention concerns a method for metal plating plastic substrates, where the plastic surfaces are etched, activated, rinsed, optionally treated with an accelerator, and metal plated by chemical reductive or electrolytic means.Type: ApplicationFiled: December 18, 2003Publication date: July 8, 2004Applicant: Enthone Inc.Inventor: Andreas Konigshofen
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Publication number: 20040110374Abstract: The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at least about 95° C., and maintaining the precursor solution at said temperature for at least about 30 minutes, wherein the precursor solution comprises water, chlorine ions, copper ions, tin (II) ions, and an antioxidant compound which substantially prevents the oxidation of the tin (II) ions to tin (IV) ions.Type: ApplicationFiled: December 10, 2002Publication date: June 10, 2004Applicant: Enthone, Inc.Inventor: Han Verbunt
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Publication number: 20040096584Abstract: A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treated with a metal salt solution, containing at least one salt from the group consisting of a cobalt salt, a silver salt, a tin salt, and a lead salt. The plastic surface is treated with a sulfide solution. Finally, the plastic surface is metallized in a metallizing bath.Type: ApplicationFiled: November 6, 2003Publication date: May 20, 2004Applicant: Enthone Inc.Inventors: Leonas Naruskevicius, Grigorijus Rozovskis, Jonas Vinkevicius, Mykolas Baranauskas, Andreas Mobius, Peter Pies
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Patent number: 6723218Abstract: An apparatus for the electrodialytic regeneration of an electroless bath electrolyte. There are diluate compartments through which the bath electrolyte is channeled, concentrate compartments through which a regeneration electrolyte is channeled, an anode, and a cathode. The diluate compartments of the first electrodialysis unit are serially connected to the diluate compartments of the second electrodialysis unit via lines through which the bath electrolyte is sequentially channeled. The concentrate compartments of the first electrodialysis unit are serially connected to the concentrate compartments of the second electrodialysis unit via lines through which the regeneration electrolyte is sequentially channeled.Type: GrantFiled: March 7, 2002Date of Patent: April 20, 2004Assignee: Enthone Inc.Inventors: John Stuart Hadley, Peter Anton Adriaan Verhoeven