Abstract: A white-light emitting device and its preparation method are provided. The white-light emitting device comprises an ultraviolet (UV) light emitting diode (LED) chip, a first phosphor, and a second phosphor, wherein the UV LED chip generates a first radiation; the first phosphor is composed of Zn(C3N2H4)2 powder and is excited by the first radiation to generate a second radiation; and the second phosphor is excited by the first radiation and/or the second radiation to generate a third radiation. The third radiation is then mixed with the first radiation and/or the second radiation to generate a white light.

Abstract: A light-emitting diode structure includes a base with a recessed portion, a light-emitting chip and a light-transmissive block. The light-emitting chip disposed in the recessed portion of the base and emits a light beam. The light-transmissive block disposed on the base covers the recessed portion and the light-emitting chip, so that the light beam emitted from the light-emitting chip is radiated outwardly via the light-transmissive block. The light-transmissive block is a flat-top multilateral cone including a bottom surface, a top surface, and several side surfaces connected to and located between the bottom surface and the top surface. A slot with a bottom portion is formed on the top surface of the light-transmissive block.

Abstract: A multi-chip package comprises a plurality of chip pads and a plurality of LED chips. The chip pads are arranged in an M×N array, M and N each a positive integer greater than 1. A peripheral area of each chip pad comprises a respective first bonding pad, a respective second bonding pad, and a respective third bonding pad arranged in sequence in a clockwise direction. A first orientation of the respective first to third bonding pads in a first row of the N rows differs from a second orientation of the respective first to third bonding pads in a second row of the N rows by 90 degrees. Each of the LED chips is disposed on a respective one of the chip pads and electrically connected to two of the respective first to third bonding pads on a same side of the respective LED chip.

Abstract: A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.

Abstract: A light emitting diode bulb comprises a heat sink, an insulator cover, a light emitting device package, a plurality of conductive terminals, a driving circuit, a holder, a metal screw thread, and an electrode. The light emitting device package, disposed between the insulator cover and heat sink, is covered by the insulator cover which exposes a portion of the light emitting device package. The conductive terminals are connected with the insulator cover and extend outwardly to be connected with the light emitting device package. The driving circuit converts an AC signal into a DC signal and includes upper conductive rods and lower conductive rods. The conductive rods are connected with the conductive terminals. The holder is connected with the metal screw thread and heat sink. The metal screw thread is connected electrically to one of the lower conductive rods. The electrode is connected electrically to the other lower conductive rods.

Abstract: A downlight that can be easily installed into and dismounted from a ceiling is provided. The housing of the downlight includes an adjustable spring clipping device. Utilization of the adjustable spring clipping device saves a user from having to spend much effort on installation or dismounting of the downlight, and allows installation and dismounting of the downlight to be easily and conveniently performed.

Abstract: A light tube including a heat sink, a light transmissive cover disposed on the heat sink, and at least one light source module is provided. A containing space is formed between the heat sink and the light transmissive cover. The light source module includes a carrier, a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of non-light-emitting passive devices. The carrier is disposed on the heat sink. The first light-emitting devices are arranged on the carrier along a first straight reference line to form a first line of light-emitting devices. The second emitting devices are arranged on the carrier along a second straight reference line to form a second line of light-emitting devices. The non-light-emitting passive devices are disposed on the carrier and between the first and second lines of light-emitting devices and electrically connected to the first and the second light-emitting devices.

Abstract: An LED package structure comprises an LED chip and a fuse electrically connected to the LED chip in series. The fuse has a low melting point such that the fuse melts under a high current to form an open circuit to prevent the high current from flowing through the LED chip.

Abstract: A chip package structure includes a substrate, chips and an elastic element. The substrate has a first surface, a second surface, a first patterned metal layer on the first surface and a second patterned metal layer on the second surface, wherein the substrate is suitable for being clipped between an upper mold chase and a lower mold chase of a package mold. The chips are disposed on the first surface, wherein the chips are suitable for being contained in containing spaces defined by the upper mold chase and the substrate. The elastic element is disposed on the second surface and surrounds the second patterned metal layer, wherein the elastic element is suitable for contacting the lower mold chase and is located between the lower mold chase and the substrate. In addition, a manufacturing process of the chip package and a package substrate structure are also provided.

Abstract: A color-temperature-tunable device comprises a first light emitting diode (LED) chip group comprising at least one first blue LED chip that emits a first light having a first peak wavelength, a second LED chip group comprising at least one second blue LED chip that emits a second light having a second peak wavelength different from the first peak wavelength, and a wavelength converting layer above at least a portion of the first LED chip group and a portion of the second LED chip group. The first LED chip group and the second LED chip group are driven by a first driving current and a second driving current, respectively.

Abstract: A light emitting diode device is provided. The light emitting diode device comprises a composite substrate and a light emitting diode disposed on the composite substrate. The composite substrate comprises a first carbon fiber composite layer which is able to conduct heat rapidly in the direction of carbon fiber, such that the heat generated from the light emitting diode module can be dissipated rapidly.

Abstract: A light emitting diode (LED) package including a carrier, a housing, at least one LED chip and at least one electrostatic discharge protector (ESD protector) is provided. The housing encapsulating a portion of the carrier has at least one first opening, at least one second opening and a barricade. The barricade separates the first opening from the second opening. The first opening and the second opening expose a first surface of the carrier. The LED chip is disposed on the first surface of the carrier, located in the first opening, and electrically connected to the carrier. The ESD protector is disposed on the first surface of the carrier, located in the second opening, and electrically connected to the carrier.

Abstract: A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.

Abstract: A lighting emitting diode (LED) device includes a first adjust module and a second adjust module. The first adjust module includes at least one first LED and has a first internal impedance having a first characteristic curve. A range covered by the first characteristic curve includes a first incomplete conduction region and a first conduction region. As the current increases from zero value and up, the first internal impedance decreases exponentially in the first incomplete conduction region, is approximately linear in the first conduction region. The second adjust module includes an impedance-providing component and an electronic component coupled in series. The second adjust module is coupled in parallel with the first adjust module. The second adjust module has a second internal impedance having a second characteristic curve. The first characteristic curve and the second characteristic curve match one another.

Abstract: Embodiments of a light emitting device, a surface mounted device-type light emitting device and a display device are provided. In one aspect, a light emitting device may include a main body and a light source. The main body may include a base and a number of terminals. The base may have a support surface. Each of the terminals may respectively have a welding portion such that the welding portions of the terminals form a connection surface with a first angle between the support surface and the connection surface. The first angle may be between 0 degree and 90 degrees. The light source may be disposed on the support surface and electrically connected to one or more of the terminals.

Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.

Abstract: A lighting unit is provided. The lighting unit includes a light source and an optical element. The light source provides a major light beam and a minor light beam. The optical element includes a first light entering surface, a second light entering surface, a light distributing surface, a light emitting surface and a normal line, wherein the normal line is perpendicular to the light emitting surface, and the second light entering surface is a scattering surface, and the major light beam enters the optical element through the first light entering surface, and is emitted from the light emitting surface, and the minor light beam enters the optical element through the second light entering surface, is reflected by the light distributing surface, and is emitted from the light emitting surface.