Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.

Abstract: There is provided a semiconductor integrated circuit for an optical sensor for receiving environmental light through a cover member that attenuates visible light and transmits infrared light and a collecting lens, performing luminosity factor correction based on an amount of received light, and detecting an illuminance, wherein the semiconductor integrated circuit includes a first light receiving element having a first spectral property; a second light receiving element having a second spectral property; and a luminosity factor correction unit configured to perform the luminosity factor correction according to output of the first light receiving element and output of the second light receiving element, wherein the luminosity factor correction unit includes an AD conversion unit performed by time division on the output of the first light receiving element and the output of the second light receiving element, and a calculating unit subtracting digital signals obtained by the conversion.

Abstract: A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at least three leads. The common terminal is capable of being divided into a plurality of electrodes connected with each other. The leads are extended outwards from the edge of the common terminal, and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals of the lead units.

Abstract: Various examples of a lamp that produces omnidirectional light are described. The lamp may include a light-emission module. The light-emission module may include a substrate having a first primary surface. The first primary surface of the substrate may define a first horizontal plane that is substantially perpendicular to a longitudinal axis of the lamp. The light-emission module may also include at least one first light source and at least one second light source disposed on the first primary surface of the substrate. Each of the at least one second light source may include a light-emitting surface at an individually adjustable angle with respect to the first horizontal plane.

Abstract: Various examples of a carrier structure and lighting device are described. A carrier structure configured to carry an LED includes a housing and a lead frame. The housing has a concave. The lead frame includes a main board portion having a main board through hole, at least two insertion portions extending from the main board portion into the main board through hole, and two electrode portions configured to be electrically coupled to the LED. The housing is disposed over the at least two insertion portions with the at least two insertion portions inserted into the housing. The concave of the housing expose the electrode portions. Each of the electrode portions has a respective protrusion sub-portion that extends outside of the housing. Additionally, a lighting device utilizing the carrier structure is also provided.

Abstract: A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at least three leads. The common terminal is capable of being divided into a plurality of electrodes connected with each other. The leads are extended outwards from the edge of the common terminal, and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals of the lead units.

Abstract: A method of operating a color-temperature-tunable device is described. The method drives a first light emitting diode (LED) chip with a first driving current from a first power source. The first LED chip is configured to emit a first light having a first peak wavelength. The method also drives a second LED chip with a second driving current from a second power source. The second LED chip is configured to emit a second light having a second peak wavelength. The method further maintains a total driving current, which includes the first driving current and the second driving current, approximately constant. The second peak wavelength is different from the first peak wavelength.

Abstract: Various examples of a lighting device, backlight module and illumination module are described. A lighting device includes a carrier component, an LED chip, a thermistor, and a plurality of metal wires. The carrier component includes a plurality of electrodes. The LED chip and the thermistor are disposed on the carrier component and electrically coupled to each other. The plurality of metal wires form a circuit with the plurality of electrodes, the LED chip, and the thermistor. The thermistor has dimensions in chip-level scale when viewed from the top of the lighting device. A backlight module includes the aforementioned lighting device. An illumination module includes the aforementioned lighting device and a driver which is electrically coupled to the lighting device.

Abstract: An illuminating device includes a case, a heat sink block, an LED array, two waterproof plastic sheets and two covers. The case has a fluid inlet, a fluid outlet and two partition grooves. The heat sink block has a carrying platform and a fluid channel. The fluid channel is conformally disposed in the partition grooves and communicated with the fluid inlet and the fluid outlet. The LED array is located on the carrying platform. The waterproof plastic sheets respectively overlay the fluid inlet and the fluid outlet. The waterproof plastic sheets have a first opening communicated with the fluid channel. The covers respectively overlay the waterproof plastic sheet and a part of the case and have a second opening corresponding to the first opening. A fluid flows through the fluid channel via the second openings and the first openings so as to discharge heat from the LED array.

Abstract: Phosphor compositions for highly reliable white light-emitting diode (LED) devices are disclosed. The phosphor compositions include a first oxynitride-based phosphor that emits green light and a second nitride-based phosphor that emits red light. When the weight ratio of the first oxynitride-based phosphor to the second nitride-based phosphor is from about 8:2 to 9:1, the emission spectra of the phosphor compositions are very similar to that of a yellow YAG phosphor with a peak at 550 nm. The phosphor compositions have emissions with CIE color coordinates satisfying an equation expressed as: y=0.0805x3?154.06x2+97017x?2E+07.

Abstract: A light-emitting device with multi-color temperature and multi-loop configuration is provided. The light-emitting device comprises a substrate, multiple light sources disposed on the substrate, and a light-emitting unit covering the light sources and at least a portion of the substrate. Each of the light sources is configured to emit a respective primary radiation. The light-emitting unit comprises multiple wavelength conversion components, each of which may include a respective fluorescent material. Each wavelength conversion component emits a respective converted radiation, upon absorbing a portion of the primary radiation from one or more of the light sources, and mixes the respective converted radiation with a portion of the primary radiation from the one or more of the light sources that is not absorbed to form a respective mixed radiation. Each wavelength conversion component is adjacent to, and at least partially contacts, at least another one of the wavelength conversion components.

Abstract: An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element.

Abstract: A light emitting device includes a carrier, a light emitting element disposed and electrically connected to the carrier, and a transparent plate disposed on the carrier and including a flat-portion and a lens-portion. The lens-portion covers the light emitting element and has a light incident surface, a light emitting surface, a first side surface and a second side surface. The light emitting element is suitable for emitting a light beam. A first partial beam of the light beam passes through the light incident surface and leaves from the light emitting surface. A second partial beam of the light beam passes through the light incident surface and is transmitted to the first side surface or the second side surface, and the first side surface or the second side surface reflects at least a part of the second partial beam of the light beam to be passed through the light emitting surface.

Abstract: In one aspect, an LED package structure comprises a fluorescent substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The fluorescent substrate has a first surface and a second surface opposite the first surface. The fluorescent substrate comprises a mixture of a fluorescent material and a glass material. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The electrically conductive element passes through the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the electrically conductive element.

Abstract: A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.

Abstract: Various embodiments of a digit display are provided. In one aspect, a digit display comprises at least one display unit. The at least one digit unit comprises twenty-eight character segments that are arranged in a manner including a quadrilateral, a cross, and four X-shaped arrangements. The quadrilateral is formed by eight of the twenty-eight character segments with two character segments on each of four sides of the quadrilateral. The cross is formed by four of the twenty-eight character segments and dividing the quadrilateral into four quadrants. Each of the four X-shaped arrangements is disposed in a respective one of the four quadrants and formed by respective four of the twenty-eight character segments.

Abstract: A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess.