Abstract: A light emitting diode (LED) device and a method of manufacturing the LED device aforementioned are provided. The LED device (400) includes a LED chip (430), an encapsulant (440) and a ring-shape barrier (450?). The LED chip has a first surface and a reflection surface, and the encapsulant covers the LED chip. Wherein the reflection surface (450a) is inclined with respect to a side surface (430b) of the LED chip. A light output angle can be effectively adjusted, and the needs to re-design lenses when market demand changes may be reduced.

Abstract: A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface. An area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the micro-structures is A2, such that A1 and A2 satisfy the relation of 0.1?A2/(A1+A2)?0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.

Abstract: A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective plating layer and an external protective plating layer. The protective plating layer may be coated on the top surface, bottom surface and a portion of the side surface of the electrode. The external portative plating layer would be coated on the outer surface of the wing region. The light reflection of the device from top surface of the electrode portion can be maintained and the outer side surface of wing portion can be protected for improving the reliability of connection between light emitting device and outer substrate.

Abstract: The invention provides a light emitting sensing device and a manufacturing method thereof. The light emitting sensing device comprises: a non-translucent substrate having a first surface with at least one recess formed on the first surface; a light emitting element disposed in the at least one recess; a light sensing element disposed on the first surface; a first transparent material disposed in the at least one recess and covering the light emitting element; and a second transparent material disposed on the first surface and covering the light sensing element. The light emitting sensing device provided in this embodiment solves the problem in the prior art, the infrared light emitted by the light emitting chip irradiates into the sensing chip and causes the sensing chip to be interfered by the light of the light emitting chip resulting in reduced sensing accuracy.

Abstract: A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective plating layer and an external protective plating layer. The protective plating layer may be coated on the top surface, bottom surface and a portion of the side surface of the electrode. The external portative plating layer would be coated on the outer surface of the wing region. The light reflection of the device from top surface of the electrode portion can be maintained and the outer side surface of wing portion can be protected for improving the reliability of connection between light emitting device and outer substrate.

Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.

Abstract: The present invention provides a carrier, including: at least one electrode portion, each electrode portion having an electrode portion cross section; and a housing having a housing cross section, the housing covering at least a part of the at least one electrode portion, where the housing cross section or the electrode portion cross section may include at least a curved surface; a reflective concave cup for exposing a part of the electrode portion, the reflective concave cup has, on its outer side wall, at least a plastic block protruding outward and matching a material feeding hole of a fabrication mold for fabricating the reflective concave cup, and thus the production yield and quality of the reflective concave cup are improved.

Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.

Abstract: The present invention is directed to a light emitting device that includes an elongated package defining a plurality of recesses and a plurality of light emitting units to be disposed in the recesses. The package includes at least three electrodes and a molded body. At least one light emitting unit is disposed in each recess. The molded body has at least one dividing portion separating two adjacent recesses. The dividing portion partially covers the electrode shared by the light emitting diodes respectively disposed in two adjacent recesses.

Abstract: The present invention provides a light emitting apparatus and a lighting module, comprising: a circuit substrate, a plurality of optical sources and an optical element; the optical element comprises a translucent element and an interference element; the plurality of light sources are arranged on the circuit substrate for lighting the optical element; the optical element is arranged above the plurality of light sources; and the interference element is arranged on the translucent element, which is used to make light emitted from each of the light sources offset interference in a first polarization direction, enhance interference in a second polarization direction, and emit through the translucent element. The light emitting apparatus and the lighting module of the present invention are employed to provide a more diversified optical pattern to the user and improve the user experience.

Abstract: A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface. An area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the micro-structures is A2, such that A1 and A2 satisfy the relation of 0.1?A2/(A1+A2)?0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.

Abstract: An LED lamp and a component, a heat dissipating base and an LED wireless dimming system thereof are provided. The LED lamp component comprises a heat dissipating base, a light emitting module and a lens, the heat dissipating base has a bearing surface and a back surface opposite to the bearing surface, the bearing surface is provided with a first recessed section therein, the back surface is provided with heat dissipating structures; the heat dissipating base further comprises a first joint portion; the light emitting module is disposed in the first recessed section, and the lens covering the light emitting module.

Abstract: Various examples of a lighting device, backlight module and illumination module are described. A lighting device includes a carrier component, an LED chip, a thermistor, and a plurality of metal wires. The carrier component includes a plurality of electrodes. The LED chip and the thermistor are disposed on the carrier component and electrically coupled to each other. The plurality of metal wires form a circuit with the plurality of electrodes, the LED chip, and the thermistor. The thermistor has dimensions in chip-level scale when viewed from the top of the lighting device. A backlight module includes the aforementioned lighting device. An illumination module includes the aforementioned lighting device and a driver which is electrically coupled to the lighting device.

Abstract: A display device is provided and includes a light transmissive plate, a substrate, and a plurality of light-emitting units, which are disposed between the substrate and the light transmissive plate. Each of the light emitting units includes of a plurality of light emitting diodes, any one of which can be used as a light-detecting element. Therefore, whenever the display device is at displaying or full black state, the display device can have touch control function, object detection function and/or signal transmission function.

Abstract: A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface. An area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the micro-structures is A2, such that A1 and A2 satisfy the relation of 0.1?A2/(A1+A2)?0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.

Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.

Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

Abstract: A light-emitting device including a substrate, plural light-emitting units, and a sealing member is disclosed. The substrate includes plural electrode pads. The light-emitting units are disposed on the substrate and each include an LED chip. The LED chips are electrically connected with the electrode pads. The sealing member is disposed on the substrate, covers a side surface of each of the light-emitting units, and includes a surrounding portion surrounding the light-emitting units and a separating portion disposed between the light-emitting units. An LED package structure including the aforementioned substrate, light-emitting units, and sealing member is also disclosed. The light-emitting units can generate light of different colors or color temperatures and allow adjustment of the colors or color temperatures.

Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

Abstract: A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface. An area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the micro-structures is A2, such that A1 and A2 satisfy the relation of 0.1?A2/(A1+A2)?0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.