Abstract: Systems and methods may be provided for forming enhanced infrared absorption microbolometers. An enhanced infrared absorption microbolometer may include a metal cap formed from a thin layer of oxidizing metal such as titanium and/or a titanium oxide. The metal cap may be formed within a bridge portion of the microbolometer. The bridge portion may include other layers such as first and second absorber layers disposed on opposing sides of a layer of temperature sensitive resistive material. The layer of temperature sensitive resistive material may be located between the metal cap and a reflecting metal layer formed on a readout integrated circuit for the microbolometer.

Abstract: Various systems and methods are disclosed for monitoring and controlling using small infrared imaging modules to enhance occupant safety and energy efficiency of buildings and structures. In one example, thermal images captured by infrared imaging modules may be analyzed to detect presence of persons, identify and classify power-consuming objects, and monitor environmental conditions. Based on the processed thermal images, various power-consuming objects (e.g., an HVAC system, lighting, a water heater, and other appliances) may be controlled to increase energy efficiency. In another example, thermal images captured by infrared imaging modules may be analyzed to detect various hazardous conditions, such as a combustible gas leak, a CO gas leak, a water leak, fire, smoke, and, an electrical hotspot. If such hazardous conditions are detected, an appropriate warning may be generated and/or various objects may be controlled to remedy the conditions.

Abstract: Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select a current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.

Abstract: An optical barrel assembly includes a barrel having an inner bottom surface and an inner lateral surface extending from the inner bottom surface, the inner bottom and lateral surfaces defining a cylindrical housing, and a first element surrounded by the inner lateral surface of the barrel, wherein an outer perimeter of the first element has a different shape than a perimeter defined by the cylindrical housing.

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

Abstract: Binocular system, including method and apparatus, for viewing a scene. The system may comprise a left camera and a right camera that create left and right video signals from detected optical radiation. At least one of the cameras may include a sensor that is sensitive to infrared radiation. The system also may comprise a left display and a right display arranged to be viewed by a pair of eyes. The left and right displays may be configured to present respective left video images and right video images formed with visible light based respectively on the left and right video signals.

Abstract: Described herein is an IR camera that can prepare a report on-board the camera in a standard file format that is substantially universally readable by a number of receiving devices, including but not limited to computers. The report preferably includes at least one IR image, at least one visual image and a table that can be populated with the output of any of the camera's measurement functions or any parametric information (time, date, emissivity, background temperature, GPS location, etc.). The report may also include text, voice, and/or visual/graphical comments and recommendations. The comments may be added directly to the report or hyperlinked to the report.

Abstract: Various techniques are disclosed for an illuminator and related methods to be used with a wafer prober to provide illumination (e.g., visible and/or non-visible electromagnetic radiation) to perform testing, calibration, and/or inspection of devices on a wafer. For example, an illuminator may include a plurality of radiation sources, a reflector, an actuator for the reflector, a shutter, an actuator for the shutter, and/or a light pipe. Various components of the illuminator may interface with a wafer prober to provide sufficiently uniform and stable illumination with fast-switching intensities, wavelengths, and/or other properties. Such illumination provided by various embodiments of the illuminator may permit the wafer prober to perform high-throughput testing, calibration, and/or inspection of devices that may be fabricated and/or packaged on a wafer.

Abstract: Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken.

Abstract: A synchronized infrared beacon/infrared detector system. The system may include (A) an infrared beacon module configured to generate a time-varying encoded infrared signal, (B) an infrared detector module configured to capture the encoded infrared signal generated by the beacon module, (C) a synchronizer configured to generate a synchronization signal that controls timing of the beacon module and the detector module, and (D) a processor, in communication with the detector module, configured to analyze the infrared signal captured by the detector module. The infrared signal may be modulated at frequencies undetectable by human vision. The synchronizer signal may be produced independent of the capture of, and without input from, the infrared signal.

Abstract: Techniques, methods, and systems for image processing may be provided. The image processing may be provided for upsampling and interpolating images. The upsampling and interpolating may include interpolating the image through at least an edge weight and a spatial weight. In various embodiments, the edge weight and/or the spatial weight may be calculated with a kernel. The kernel may be a kernel with a two dimensional (2D) distribution such as a Gaussian kernel, a Laplacian kernel, or another such statistically based kernel. The image processing may also include refining the upsampled and interpolated image through a refinement weight calculation and/or through back projection.

Abstract: Techniques are disclosed for systems and methods to provide monitoring systems including one or more modular cameras and at least one application-specific base. The application-specific base may include features and/or components corresponding to a particular type of monitoring. A monitoring system includes at least one modular camera that first establishes a communication link with an application-specific base and then downloads a monitoring system application corresponding to the application-specific base. After a modular camera receives the monitoring system application, the modular camera performs the application in order to capture monitoring information corresponding to the particular type of monitoring supported by the application-specific base.

Abstract: A system may be provided that includes a scope configured to mount to a firearm. The scope may include imaging components, processing components, and a display. The processing components may generate an adaptive electronic reticle for the scope. The adaptive electronic reticle may be displayed with the display and may have a shape, a color, a style, a position, and/or other features based on the firearm, an ammunition type, a target type, a target range, a wind speed, a color of an image of a target scene, and/or other target scene information. The reticle may be generated to be a reticle that maximizes the reticle contrast relative to the target scene, a textured reticle, a moving reticle, a Mil-Dot reticle, and/or a custom ballistic reticle. Laser rangefinder input may be used to automatically determine a reticle location based on ballistics data and the range to a target.

Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.

Abstract: Various techniques are provided to capture one or more thermal image frames using an infrared sensor array that is fixably positioned to substantially de-align rows and columns of infrared sensors. In one example, an infrared imaging system includes an infrared sensor array comprising a plurality of infrared sensors arranged in rows and columns and adapted to capture a thermal image frame of a scene exhibiting at least one substantially horizontal or substantially vertical feature. The infrared imaging system also includes a housing. The infrared sensor array is fixably positioned within the housing to substantially de-align the rows and columns from the feature while the thermal image frame is captured.

Abstract: Various techniques are disclosed for systems and methods using thermal imaging to monitor an infant or other persons that may need observation. For example, an infant monitoring system may include an infrared imaging module, a visible light camera, a processor, a display, a communication module, and a memory. The monitoring system may capture thermal images of a scene including at least a partial view of an infant, using the infrared imaging module enclosed in a portable or mountable housing configured to be positioned for remote monitoring of the infant. Various thermal image processing and analysis operations may be performed on the thermal images to generate monitoring information relating to the infant. The monitoring information may include various alarms that actively provide warnings to caregivers, and user-viewable images of the scene. The monitoring information may be presented at external devices or the display located remotely for convenient viewing by caregivers.

Abstract: A system is disclosed, including a processing chamber for a deposition process; a cathode within the chamber, configured to introduce a sputter gas and a reactive gas adjacent to a target; a substrate holder, disposed opposite the cathode within the processing chamber, configured to secure a substrate to receive a deposition from the target; and a control system configured to monitor a target voltage and to control a flow rate of the reactive gas to maintain the target voltage within a desired range during the deposition process. Methods and devices for deposition processes are also disclosed.

Abstract: Techniques are disclosed for systems and methods to provide wind sensor motion compensation for wind sensors mounted to moving platforms. A wind sensor motion compensation system may include a wind sensor, a wind sensor accelerometer, one or more additional sensors, actuators, controllers, user interfaces, and/or other modules mounted to or in proximity to a vehicle. The wind sensor motion compensation system may be implemented with one or more logic devices adapted to receive sensor signals and determine a sensor-motion compensated wind velocity. The logic devices may be adapted to receive a wind sensor acceleration and a relative wind velocity from a wind sensor, determine a wind sensor velocity from the wind sensor acceleration, and determine a sensor-motion compensated relative wind velocity from the wind sensor velocity and the relative wind velocity.