Patents Assigned to Foxconn Technology Co., Ltd.
  • INSTRUMENT FOR MEASURING LED LIGHT SOURCE
    Publication number: 20130307549
    Abstract: A LED light source measuring instrument includes a shell portion and a test portion. The shell portion supports the test portion. The test portion includes a carrier plate for placing a LED light source to be tested. A conductive structure is set on the carrier plate for electrically connecting with an underside surface of the LED light source; a cooling chip is set on the carrier plate; a vacuum suction device is provided for generating a vacuum force on the test portion for securely attaching the LED light source to the carrier plate. The cooling chip is used for controlling the temperature of the LED light source within a limited range. A fan is provided for generating a cooling airflow to the LED light source. A heat sink fin extends from the carrier plate toward the fan.
    Type: Application
    Filed: March 28, 2013
    Publication date: November 21, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: TAY-JIAN LIU
  • Heat sink assembly having a fin also functioning as a supporting bracket
    Patent number: 8584736
    Abstract: An exemplary heat sink assembly includes a base plate, a number of fins, a heat spreader and a heat pipe. The fins are mounted on and thermally connect with the base plate for dissipating heat of the base plate. A bottom one of the fins has a body parallel to the base plate and a number of supporting tabs extending downwardly from the body. The supporting tabs engage with a top surface of the base plate to support the fins onto the base plate and reinforce a whole strength of the heat sink assembly. The heat spreader is mounted below the base plate. The heat pipe includes a horizontal evaporating portion sandwiched between the heat spreader and the base plate and a vertical condensing portion extending from a free end of the evaporation portion and passing through the fins.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: November 19, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu
  • Heat dissipation device and centrifugal fan thereof
    Patent number: 8585359
    Abstract: A centrifugal fan includes a casing and an impeller received in the casing. The casing defines an air outlet at one side thereof. An air channel is defined in the casing between a sidewall of the casing and outermost free ends of blades of the impeller. The air channel has an upstream end and a downstream end along a rotation direction of the impeller. A plurality of air guide plates is formed in the casing and disposed at a junction between the downstream end of the air channel and an area of the air outlet directly communicating with the downstream end of the air channel. The air guide plates are structured and arranged in a streamlined manner and pattern with respect to air flowing from the downstream end of the air channel towards the air outlet.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: November 19, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Xian-Min Jin, Jer-Haur Kuo
  • Fastener
    Patent number: 8585336
    Abstract: A fastener includes a bolt, a ring engaged around the bolt, and a coil spring. The bolt includes a head, a threaded engaging portion, a shaft portion between the head and the threaded engaging portion, and a bottom flange extending radially and outwards from an end of the shaft portion connecting the threaded engaging portion. The shaft portion includes a main part connecting the head, a tail part connecting the bottom flange, and a guiding part connecting the main part and the tail part. A diameter of tail part is smaller than a diameter of the main part. A diameter of the guiding part increases from the tail part to the main part along an axial direction of the bolt. The coil spring coils the shaft portion and is sandwiched between the head of the bolt and the ring.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: November 19, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tao Tao, Bo Hong
  • ELECTRONIC DEVICE WITH HEAT DISSIPATION DEVICE ASSEMBLY
    Publication number: 20130299213
    Abstract: A heat dissipation device assembly for dissipating heat from an electronic component located on a printed circuit board (PCB), includes a heat dissipation module and a fixing device for fixing the heat dissipation module to the PCB board. The heat dissipation module includes a heat pipe, and the heat pipe includes an evaporating section for directly contacting the electronic component and a condensing section. The fixing device includes a base, and a plurality of latches extending from a bottom surface of the base. The latches cooperatively define a space matching with the evaporating section of the heat pipe and partially receiving the evaporating section. The base abuts on the evaporating section thereby pressing the evaporating section to firmly and directly contact the electronic component.
    Type: Application
    Filed: June 29, 2012
    Publication date: November 14, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHIH-YAO LI, JUI-WEN HUNG
  • INSTRUMENT FOR MEASURING LED LIGHT SOURCE
    Publication number: 20130300452
    Abstract: A LED light source measuring instrument includes a shell portion and a test portion. The shell portion supports the test portion. The test portion includes a carrier plate for carrying a LED light source, and provides automatic electrical connections to a bottom surface of an SMT LED light source. The test portion further includes a flexible tube and a vacuum pump, at least one air hole set in the test portion, the flexible tube connecting with the air hole and the vacuum pump, the vacuum provided by the vacuum pump holding the LED light source firmly to the under test zone of the carrier plate.
    Type: Application
    Filed: April 12, 2013
    Publication date: November 14, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: TAY-JIAN LIU
  • METHOD OF MANUFACTURING A BEARING
    Publication number: 20130302203
    Abstract: A method of manufacturing a bearing includes, firstly, injecting a mixture of metal powder into a mold to form a semi-finished product. Then the semi-finished product is sintered. After that, the sintered semi-finished product is fine machined, and then washed, to form the bearing.
    Type: Application
    Filed: December 5, 2012
    Publication date: November 14, 2013
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: MING-HSIU CHUNG, CHIH-JEN LIU
  • Heat dissipation device with heat pipe
    Patent number: 8579016
    Abstract: An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Heat dissipation device with multiple heat sinks
    Patent number: 8579017
    Abstract: An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Heat dissipation device
    Patent number: 8579019
    Abstract: An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Manufacturing method of a heat dissipation device with guiding lines and soldered heat pipes
    Patent number: 8578605
    Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: November 12, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ming-Tang Zhang, Wei-Hsiang Chang, Nien-Tien Cheng
  • LAMP COVER AND ILLUMINATION DEVICE USING THE SAME
    Publication number: 20130286643
    Abstract: A luminous device comprises a light emitting diode (LED) light bar, a heat dissipating device thermally connected with the LED light bar, and a lamp cover made of light permissive material, engaging with the heat dissipating device and covering the LED light bar. The lamp cover is semicylindrical shaped and comprises an outer surface and an inner surface opposite to the outer surface and facing the LED light bar. A thickness of the lamp cover in a radial cross section thereof gradually reduces from a middle of the lamp cover to two opposite lateral sides thereof. Light generated by the LED light bar converges toward a plane orthogonally extending through the middle of the lamp cover after the light travels through the lamp cover.
    Type: Application
    Filed: June 29, 2012
    Publication date: October 31, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: CHIN-CHUNG CHEN, SHENG-JIE QIAO, WEN XU, MIN-CHI ZENG, SHAN-YUE WANG
  • Heat dissipation device with rotation-locked heat sink
    Patent number: 8567484
    Abstract: An exemplary heat dissipation device includes a heat sink and a fixing frame. The heat sink defines receiving depressions at an outer peripheral surface thereof. The fixing frame includes a peripheral side plate encircling the heat sink, fixing legs extending downwards from the side plate, and an elastic member disposed on the side plate. Protruding members extend inwardly from the fixing legs. The heat sink is rotatably received in the fixing frame. When the heat sink is in an unlocked state, the protruding members align with the receiving depressions, respectively. When the heat sink is rotated to a locked state, the protruding members abut a bottom of the heat sink thereby limiting axial movement of the heat sink relative to the fixing frame and the elastic member is received in a corresponding receiving depression and limit rotation of the heat sink in both clockwise and counterclockwise directions.
    Type: Grant
    Filed: May 3, 2010
    Date of Patent: October 29, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Heng Liu, Jing Zhang
  • METHOD FOR MANUFACTURING FAN BLADE AND FAN USING SUCH FAN BLADES
    Publication number: 20130272862
    Abstract: A method for manufacturing a fan blade includes the steps of, firstly, providing a mold. Then a mixture of metal powder and adhesive material is injected into the mold to forming a green body of the blade. Next, the adhesive material is removed from the green body of the blade. Finally, the green body of the blade is sintered to form the fan blade. A fan with such blades is also provided.
    Type: Application
    Filed: June 25, 2012
    Publication date: October 17, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: MING-HSIU CHUNG
  • HEAT DISSIPATION DEVICE
    Publication number: 20130264042
    Abstract: A heat dissipation device includes a first heat sink and a second heat sink. The first heat sink includes a first heat spreader and a plurality of fins. The first heat spreader includes a receiving structure having a first tooth and two second teeth. The first tooth is located between the second teeth to define two first grooves between the first tooth and the second teeth. The second heat sink includes a second heat spreader and a plurality of fins. The second heat spreader includes a protruding structure having two first inserting portions. When the second heat sink is assembled to the first heat sink, the each of the first inserting portions is inserted in the first groove of the first heat spreader and deformed to be firmly engaged in the first groove and clasped by the first tooth.
    Type: Application
    Filed: June 27, 2012
    Publication date: October 10, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: JI-YUN QIN, QIANG YAN
  • Heat dissipation fan and rotor thereof
    Patent number: 8550781
    Abstract: A rotor includes a hub, rotary blades extending outwardly from the hub, and an annular wall surrounding the rotary blades. Each rotary blade includes a windward lateral surface and a leeward lateral surface at opposite sides thereof. The annular wall adjoins the outer ends of the rotary blades and is rotatable therewith. A perforation is defined in the annular wall between two neighboring rotary blades and adjacent to the leeward lateral surface of a leading rotary blade of the neighboring rotary blades.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: October 8, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xin-Xiang Zha, Ye-Fei Yu, Jer-Haur Kuo
  • Loop heat pipe
    Patent number: 8550150
    Abstract: An exemplary loop heat pipe includes a plate-type evaporator, a pipe, a condenser thermally connected with the pipe and a working medium contained in the closed loop. The plate-type evaporator defines an exit for vapor in a lateral portion thereof and an entrance for liquid in a top portion thereof. The pipe connects the exit and the entrance to form a closed loop. A first wick structure has a lower end thereof attached to a bottom portion of the evaporator and has an upper end thereof attached to the top portion of the evaporator. The entrance for liquid corresponds to the upper end of the wick structure.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: October 8, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Chuen-Shu Hou
  • Lens
    Patent number: D691321
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: October 8, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chin-Chung Chen, Yue-Shan Wang
  • Motor shell
    Patent number: D691556
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 15, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen
  • LED lamp
    Patent number: D692170
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: October 22, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: You-Xue Liu, Qian-Jin Cai, Shi-Song Zheng, Yi-San Liu, Chin-Chung Chen