Patents Assigned to Foxconn Technology Co., Ltd.
  • Publication number: 20130258601
    Abstract: A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and plural of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.
    Type: Application
    Filed: May 18, 2012
    Publication date: October 3, 2013
    Applicants: Foxconn Technology Co., Ltd., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventor: Ji-Yun QIN
  • Publication number: 20130255921
    Abstract: An exemplary heat pipe includes a tube, an evaporation section and a condenser section located at two opposite ends of the tube, a grid wick structure received in the tube and abutting an inner wall of the tube, and a working fluid sealed in the tube. The grid wick structure includes a plurality of rhombuses. Each rhombus includes two opposite first included angles, one of the first included angles is at a point of the rhombus nearest one of the ends of the tube, the other first included angle is at a point of the rhombus nearest the other end of the tube. Each first included angle is smaller than 90 degrees.
    Type: Application
    Filed: March 27, 2013
    Publication date: October 3, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, YU-LIANG LO, JIA-HONG WU
  • Publication number: 20130259692
    Abstract: An exemplary fan includes a hub and an impeller. The hub is made of metal, and includes a flange. The impeller is made of plastic. The impeller is formed around the hub and has the flange embedded therein. A method for manufacturing the fan is also provided.
    Type: Application
    Filed: December 17, 2012
    Publication date: October 3, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: WEN-CHENG CHEN
  • Publication number: 20130255929
    Abstract: A heat dissipation device includes a base and a plurality of fins. Two latch parts project from a top surface of the base, the two latch parts cooperatively define a recess therebetween. Each fin defines a tenon at a bottom portion. The tenon has a configuration in complement with that of the recess. The latch parts located between two neighboring fins is punched to make the fins fix on the base.
    Type: Application
    Filed: August 16, 2012
    Publication date: October 3, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: QIAO-LONG CHEN, ZI-FU YANG, MENG FU, CHUN-CHI CHEN
  • Patent number: 8545058
    Abstract: A lens includes a light incident surface and a light exiting surface. The light exiting surface includes a first concave surface, a first convex surface, a second convex surface, a first curved surface, and a second curved surface. The first concave surface is located at the center of the light exiting surface for diverging the light exiting therefrom. The first and second convex surface are arranged at two opposite sides of the first concave surface respectively for converging the light exiting therefrom; the first convex surface, the first concave surface, and the second convex surface connect in sequence along a first direction. The first and second curved surfaces are arranged at another two opposite sides of the first concave surface respectively; the first curved surface, the first concave surface, and the second curved surface connect in sequence along a second direction perpendicular to the first direction.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: October 1, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chin-Chung Chen, Sheng-Jie Qiao
  • Patent number: 8544530
    Abstract: A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: October 1, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu, Chun-Chi Chen
  • Publication number: 20130248152
    Abstract: An exemplary heat pipe includes a tube, a first wick structure and a second wick structure received in the tube, and working liquid filling the tube. The first wick structure is disposed in an evaporating section of the tube. The second wick structure is located between the first wick structure, and supports the first wick structure partially contacting an inner face of the evaporating section of the tube. The first wick structure defines a gap between two opposite ends thereof. The second wick structure extends from the evaporating section through an adiabatic section to a condensing section of the tube.
    Type: Application
    Filed: December 20, 2012
    Publication date: September 26, 2013
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: CHING-BAI HWANG, CHIH-PENG LEE
  • Publication number: 20130251292
    Abstract: A bearing device includes a body, a circular cover, and a through hole commonly defined through both the body and the cover. The body is an injection molded piece made from metal powder and molten binder. The cover is an injection molded piece made from metal powder and molten binder. Two passages are defined between the body and the cover, and each passage communicates the through hole with an exterior of the bearing device, whereby lubricant can flow from the through hole to the passages. A bearing assembly having the bearing device is also provided, and a method of manufacturing the bearing device is further provided.
    Type: Application
    Filed: December 19, 2012
    Publication date: September 26, 2013
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: WEN-CHENG CHEN, MING-HSIU CHUNG
  • Publication number: 20130242571
    Abstract: An LED lamp includes a shell having an opening and defining a cavity, a light source received in the cavity of the shell, a fence arranged at the opening of the shell, and four locking members. Each locking member includes a securing portion and an elastic portion connected to the securing portion. The securing portions are fixed on the shell. The elastic portions cooperatively provide an elastic force to fix the fence to the shell. By bending the elastic portions of the locking members outwardly, the fence is released from its secure attachment to the shell.
    Type: Application
    Filed: August 28, 2012
    Publication date: September 19, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: BAO-MIN YANG, GUANG YU
  • Publication number: 20130239410
    Abstract: An exemplary method for manufacturing a heat pipe is disclosed. A mixture including metal powder and organic cement is made. The mixture is then injected to a mold to form two blanks. The two blanks are debinded to remove the organic cement therefrom. The two blanks are further sintered to join together and form a tube. A working liquid is filled in the tube from an open end thereof. The tube is then vacuumed to exhaust air therein. The open end of the tube is finally sealed to form a hermetic space in the tube.
    Type: Application
    Filed: December 3, 2012
    Publication date: September 19, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: MING-HSIU CHUNG, NIEN-TIEN CHENG
  • Publication number: 20130240179
    Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.
    Type: Application
    Filed: May 2, 2013
    Publication date: September 19, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: YI-SHIH HSIEH, RUI-WEN SUN
  • Patent number: 8538046
    Abstract: An electronic device includes an enclosure and a speaker set received in the enclosure. The speaker set includes a shell, a pair of first and second speakers received in the shell. The first speakers provide high frequency acoustic output, and the second speakers provide low and middle frequency acoustic output. The shell includes a fixing plate. The fixing plate defines two tweet outlets aligning respectively with the first speakers, and two middle woof outlets aligning respectively with the second speakers. A central point of each middle woof outlet is located nearer to an imaginary central line of the fixing plate than a central point of each tweet outlet. A portion of each of the middle woof outlets is shaded by a portion of the electronic device. The tweet outlets are located beside the portion of the electronic device but not shaded by the portion.
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: September 17, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Hwang-Miaw Chen
  • Patent number: 8534998
    Abstract: An exemplary centrifugal fan includes a casing defining an air outlet, and an impeller in the casing. An air channel is defined in the casing between a sidewall of the casing and outermost free ends of the impeller. The sidewall includes a first curved section adjoining a second curved section. The first curved section is located at a more upstream portion of the sidewall than the second curved section along a rotation direction of the impeller. The first curved section extends along a part of an Archimedes spiral or a part of a logarithmic spiral. The second curved section is located farther away from the impeller than an imaginary extension line of the first curved section along the Archimedes spiral or the logarithmic spiral. An air guide plate is formed in the casing and extends from the air outlet to an inner region of the air channel.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: September 17, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: En-Ming Liang, Fang-Xiang Yu, Jer-Haur Kuo
  • Patent number: 8534872
    Abstract: An LED illumination device includes a heat dissipation part, an optical part and an electric part. The optical part includes an LED module attached on the heat dissipation part and an envelope mounted on the heat dissipation part and covering the LED module. The electric part includes a casing and a lamp cap. The casing is cup-shaped. The lamp cap includes a sleeve electrode and a spring electrode attached at a bottom of the sleeve electrode. The sleeve electrode and the spring electrode electrically power the LED module. One end of the casing along an axis thereof is mounted on bottom ends of the heat dissipation part and the optical part. The sleeve electrode is disposed around the other end of the casing. The spring electrode is resiliently deformable along an axis of the sleeve electrode.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: September 17, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Na Zhang, Jian-Bing Qian
  • Publication number: 20130233519
    Abstract: An exemplary flat heat pipe includes a cover, a wick structure adhered to part of an inner surface of the cover and working medium contained in the wick structure. The cover defines a receiving chamber therein. The wick structure is received in the receiving chamber and includes an interface surface away from the inner surface of the cover. The interface of the wick structure and the exposed inner surface of the cover cooperatively define a vapor passage therebetween.
    Type: Application
    Filed: April 1, 2012
    Publication date: September 12, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, YU-LIANG LO
  • Publication number: 20130233522
    Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.
    Type: Application
    Filed: May 2, 2013
    Publication date: September 12, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: YI-SHIH HSIEH, RUI-WEN SUN
  • Patent number: D690649
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: October 1, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen
  • Patent number: D690650
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 1, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen
  • Patent number: D690651
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: October 1, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen
  • Patent number: D691087
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 8, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Ching Lin, Chien-Yao Liao, Wen-Cheng Chen