Abstract: In various embodiments, metallic alloy powders are utilized as feedstock, or to fabricate feedstock, utilized in additive manufacturing processes to form three-dimensional metallic parts. Such three-dimensional parts are fabricated by providing a powder bed containing particles each comprising a mixture and/or alloy of constituent elemental metals, forming a first layer of the part by (i) dispersing a binder into the powder bed, and (ii) curing the binder, the first layer of the shaped part comprising particles bound together by cured binder, disposing a layer of the particles over the first layer of the part, forming subsequent layers of the part, and then sintering the part.

Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.

Abstract: The invention relates to a method for producing a carbide with a toughness-increasing structure, comprising the following steps: providing a hard material powder, wherein the average BET particle size of the hard material powder is less than 1.0 mm; mixing the hard material powder with a binder powder; shaping the mixture made of hard material powder and binder powder to form a green body; and sintering the green body. The invention also relates to a carbide with a toughness-increasing structure comprising a phase made of hard material particles and a phase made of binder metal heterogeneously distributed in the carbide, which is present in the form of binder islands, wherein the carbide with a toughness-increasing structure produced after the sintering has a phase made of hard material particles with an average particle size in the region between 1 nm and 1000 nm, and the binder islands have an average size of 0.1 ?m to 10.0 ?m and an average distance between the binder islands of 1.0 ?m to 7.0 ?m.

Abstract: In various embodiments, an electrothermal propulsion system for imparting velocity to a spacecraft features a joint-free monolithic integrated thruster component including an inlet section, a resistively heated heat-exchanger section, and a nozzle section.

Abstract: In various embodiments, additive manufacturing is utilized to fabricate three-dimensional metallic parts using metallic alloy wire as a feedstock material.

Abstract: In various embodiments, apparatuses for receiving and supporting one or more components during processing thereof at process temperatures greater than approximately 1000° C. feature refractory metal shelves separated by refractory metal support posts.

Abstract: In various embodiments, apparatuses for receiving and supporting one or more components during processing thereof at process temperatures greater than approximately 1000° C. feature refractory metal shelves separated by refractory metal support posts.

Abstract: A tantalum or tantalum alloy which contains pure or substantially pure tantalum and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a tantalum alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the tantalum alloy.

Abstract: A refractory metal plate is provided. The plate has a center, a thickness, an edge, a top surface and a bottom surface, and has a crystallographic texture (as characterized by through, thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND, which is substantially uniform throughout the plate.

Abstract: In various embodiments, three-dimensional layered metallic parts are substantially free of gaps between successive layers, are substantially free of cracks, and have densities no less than 97% of the theoretical density of the metallic material.

Abstract: In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb—Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

Abstract: In various embodiments, electronic devices such as thin-film transistors and/or touch-panel displays incorporate bilayer capping layers and/or barrier layers.

Abstract: The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of niobium or vanadium, and a third metal element selected from the group consisting of titanium, chromium, niobium, vanadium, and tantalum, wherein the third metal element is different from the second metal element, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in the second metal element, and a phase that is rich in the third metal element.

Abstract: In various embodiments, metallic alloy powders are formed at least in part by spray drying to form agglomerate particles and/or plasma densification to form composite particles.

Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

Abstract: In various embodiments, bilayers are formed in electronic devices at least in part by anodization of metal-alloy base layers.

Abstract: In various embodiments, wire composed at least partially of arc-melted refractory metal material is utilized to fabricate three-dimensional parts by additive manufacturing.