Abstract: A sputtering target that includes at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being free of any microstructure due to an added bonding agent (e.g., powder, foil or otherwise), and being essentially free of any visible joint line the target that is greater than about 200 ?m width (e.g., less than about 50 ?m width). A process for making the target includes hot isostatically pressing, below a temperature of 1080° C., consolidated perform blocks that may be surface prepared (e.g., roughened to a predetermined roughness value) prior to pressing.

Abstract: In various embodiments, tubular sputtering targets comprising molybdenum are provided and sputtered to produce thin films comprising molybdenum. The sputtering targets may be formed by forming a tubular billet having an inner diameter IDI and an outer diameter ODI, the formation comprising pressing molybdenum powder in a mold and sintering the pressed molybdenum powder, working the tubular billet to form a worked billet having an outer diameter ODf smaller than ODI, and heat treating the worked billet. The sputtering targets may have a substantially uniform texture of (a) a 110 orientation parallel to a longitudinal direction and (b) a 111 orientation parallel to a radial direction.

Abstract: A process for producing a homogenous multi compound system which is hydroxide- and/or oxide-based includes a first alternative process comprising providing a first and a second refractory metal in respective hydrofluoric solutions, and mixing the first and second hydrofluoric solutions to provide a mixed hydrofluoric solution comprising a dissolved first and second refractory metal. A second alternative process comprises dissolving the first and the second refractory metal in an alternative mixed hydrofluoric solution. The mixed hydrofluoric solution or the alternative mixed hydrofluoric solution is precipitated with a precipitant to provide a solids mixture in a suspension. The first and second refractory metal is from the group consisting of Mo, W, Nb, Re, Zr, Hf, V, Sb, Si, Al, and Ta. The first and second refractory metal are different. At least one of the first and second refractory metal is provided as a fluoro and/or as an oxyfluoro complex.

Abstract: In various embodiments, electronic devices such as thin-film transistors incorporate electrodes featuring a conductor layer and, disposed below the conductor layer, a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.

Abstract: In various embodiments, metallic products are formed by alloying niobium with at least one of yttrium, aluminum, hafnium, titanium, zirconium, thorium, lanthanum, or cerium and processing the alloy.

Abstract: The invention relates to a process for producing sinterable molybdenum metal powder in a moving bed, sinterable molybdenum powder and its use.

Abstract: The invention relates to sputter targets and methods for depositing a layer from a sputter target. The method preferably includes the steps of; placing a sputter target in a vacuum chamber; placing a substrate having a substrate surface in the vacuum chamber; reducing the pressure in the vacuum chamber to about 100 Torr or less; removing atoms from the surface of the sputter target white the sputter target is in the vacuum chamber (e.g., using a magnetic field and/or an electric field). The deposited layer preferably includes a molybdenum containing alloy including about 50 atomic percent or more molybdenum, 0.1 to 45 atomic percent titanium; and 0.1 to 40 atomic percent of a third metal element that is tantalum or chromium.

Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.

Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.

Abstract: A refractory metal plate is provided. The plate has a center, a thickness, an edge, a top surface and a bottom surface, and has a crystallographic texture (as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND, which is substantially uniform throughout the plate.

Abstract: In various embodiments, protective layers are bonded to a steel layer, overlapped, and at least partially covered by a layer of unmelted metal powder produced by cold spray.

Abstract: A niobium suboxide powder comprising niobium suboxide particles having a bulk nitrogen content of between 500 to 20,000 ppm. The nitrogen is distributed in the bulk of the powder particles. The nitrogen at least partly is present in the form of at least one of Nb2N crystals or niobium oxynitride crystals.

Abstract: Processes comprising: melting a mixture comprising a valve metal precursor and a diluting agent in at least one first vessel under a first set of temperature and residence time conditions; transferring the mixture to at least one second vessel; and initiating, in the at least one second vessel, a reaction of the valve metal precursor to form a valve metal under a second set of temperature and residence time conditions; valve metal powder prepared thereby and uses therefor.

Abstract: The invention is directed to a pulverulent compound of the formula NiaM1bM2cOx(OH)y where M1 is at least one element selected from the group consisting of Fe, Co, Zn, Cu and mixtures thereof, M2 is at least one element selected from the group consisting of Mn, Al, Cr, B, Mg, Ca, Sr, Ba, Si and mixtures thereof, 0.3?a?0.83, 0.1?b?0.5, 0.01?c?0.5, 0.01?x?0.99 and 1.01?y?1.99, wherein the ratio of tapped density measured in accordance with ASTM B 527 to the D50 of the particle size distribution measured in accordance with ASTM B 822 is at least 0.2 g/cm3·?m. The invention is also directed to a method for the production of the pulverulent compound and the use as a precursor material for producing lithium compounds for use in lithium secondary batteries.

Abstract: The invention relates to sputter targets and methods for depositing a layer from a sputter target. The method preferably includes the steps of: placing a sputter target in a vacuum chamber; placing a substrate having a substrate surface in the vacuum chamber; reducing the pressure in the vacuum chamber to about 100 Torr or less; removing atoms from the surface of the sputter target while the sputter target is in the vacuum chamber (e.g., using a magnetic field and/or an electric field). The deposited layer preferably is a molybdenum containing alloy including about 50 atomic percent or more molybdenum, 0.5 to 45 atomic percent of a second metal element selected from the group consisting of niobium and vanadium; and 0.5 to 45 atomic percent of a third metal element selected from the group consisting of tantalum, chromium, vanadium, niobium, and titanium.

Abstract: In various embodiments, planar sputtering targets are produced by forming a billet at least by pressing molybdenum powder in a mold and sintering the pressed powder, working the billet to form a worked billet, heat treating the worked billet, working the worked billet to form a final billet, and heat treating the final billet.

Abstract: The invention comprises semifinished products with a structured surface, the semifinished product comprising an oxidized and subsequently re-reduced surface containing at least one refractory metal, and also a process for their production and their use for producing high-capacitance components.

Abstract: At least one of a valve metal sintered capacitor anode body and a suboxide valve metal sintered capacitor anode body with a particle density of >88% of a theoretical density.

Abstract: A process for producing anodes includes providing a foil comprising tantalum or niobium. A surface of the foil is oxidized so as to form oxides on the foil surface. The foil is heated so that the oxides formed on the foil surface diffuse into the foil. A paste comprising a powder selected from the group consisting of a tantalum powder, a niobium powder, a niobium oxide powder and mixtures thereof is applied to the foil. The foil with the applied paste is sintered.