Abstract: The light detector includes a light detection substrate having at least one light receiving region and a light incident surface on which a detection target light is incident, and a meta-lens including a plurality of unit structures arranged in a grid pattern and disposed on the light incident surface to focus the detection target light. When viewed in a thickness direction of the light detection substrate, an opening region in which no unit structure is formed is provided in a region including a center of the meta-lens.

Abstract: A gallium nitride semiconductor device includes: a chip formation substrate made of gallium nitride and having one surface and an other surface opposite to the one surface; a one surface side element component disposed on the one surface and providing a component of an one surface side of a semiconductor element; and a metal film constituting a back surface electrode in contact with the other surface. The other surface has an irregularity provided by a plurality of convex portions with a trapezoidal cross section and a plurality of concave portions located between the convex portions; and an upper base surface of the trapezoidal cross section in each of the plurality of convex portions is opposed to the one surface.

Abstract: A semiconductor chip includes: an epitaxial film made of gallium nitride; a semiconductor element disposed in the epitaxial film; a chip formation substrate including the epitaxial film and having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; and a convex and a concavity on the side surface.

Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.

Abstract: An active energy radiation unit includes a light source which radiates ultraviolet rays onto a target object, and a main gas supply mechanism which is disposed to be adjacent to the light source and ejects an inert gas. The main gas supply mechanism includes a receiving part which receives nitrogen gas, a first ejection port which is provided at a position between the receiving part and the light source in a transfer direction and closer to the target object than the receiving part and a second ejection port which is provided between the receiving part and the first ejection port in the transfer direction.

Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.

Abstract: A photoelectric tube includes a housing including a light transmitting portion, an electron emitting portion held by a recess provided in the housing, the electron emitting portion including a concave photoelectric surface facing a light transmitting portion side inside the housing, and an electron capturing portion disposed between the light transmitting portion and the photoelectric surface inside the housing. At least a part of the electron capturing portion is located inside a region on an inside of the photoelectric surface.

Abstract: The manufacturing method is a method for manufacturing a light emitter that generates ultraviolet light. The light emitter contains a YPO4 crystal to which at least scandium (Sc) is added, and receives an electron beam or excitation light having a shorter wavelength than a wavelength of the ultraviolet light, to generate the ultraviolet light. The manufacturing method includes: producing a first mixture; producing a second mixture; producing a third mixture; and sintering the third mixture. The first mixture containing a compound of yttrium (Y), a compound of scandium (Sc), phosphoric acid or a phosphate compound, and a liquid is produced. In the producing the second mixture, the second mixture in a powder form is produced by evaporating the liquid. In the producing the third mixture, the third mixture is produced by mixing either one or both of an alkali metal halide and an alkali metal carbonate with the second mixture.

Abstract: An imaging unit includes a housing having a wall portion in which a slit for passing radiation is formed, a scintillator having an input surface to which radiation passing through the slit is input, a first mirror that reflects scintillation light output from the input surface, and a line scan camera that detects scintillation light reflected by the first mirror. The scintillator is placed to make the input surface parallel to both the conveying direction and a line direction. The first mirror is positioned outside an irradiation region connecting the peripheral edge of the slit to the input surface of the scintillator.

Abstract: A photoelectric-surface electron source includes: a glass substrate that receives laser light from a substrate light-receiving surface including microlenses and that focuses the laser light toward a substrate main surface located on the opposite side from the substrate light-receiving surface; a photoelectric surface that is provided to the substrate main surface, and that receives the focused laser light and emits photoelectrons; and an extraction electrode that is fixed to the substrate main surface and that extracts the photoelectrons from the photoelectric surface. The extraction electrode is disposed away from the photoelectric surface along the normal direction of the substrate main surface and has: an electrode part in which electrode holes for allowing the photoelectrons to pass therethrough are provided; and a frame part that is fixed to a region surrounding the photoelectric surface in the substrate main surface.

Abstract: A workpiece cutting method includes: a first step of pasting an expandable sheet on a workpiece; a second step of irradiating, after the first step, the workpiece with laser light to form a modified region and expanding the expandable sheet to divide the workpiece into a plurality of chips, and meanwhile, to form a gap disposed between the plurality of chips and extending to a side surface of the workpiece; a third step of irradiating the expandable sheet with an ultraviolet light after the first step; a fourth step of filling, after the second step and the third step, the gap with resin from an outer edge part of the workpiece including the side surface; a fifth step of curing the resin after the fourth step; and a sixth step of taking out the chips from above the expandable sheet after the fifth step.

Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

Abstract: A light detection device includes: a first support part disposed on a mounting surface of the wiring board; a Fabry-Perot interference filter disposed in a first support region of the first support part; and a temperature detector, wherein the temperature detector is disposed on the mounting surface such that at least a part of the temperature detector overlaps a part of the Fabry-Perot interference filter when seen in a first direction perpendicular to the mounting surface and such that at least a part of the temperature detector overlaps a part of the first support part when seen in a second direction in which the first support part and the light detector are aligned with each other, and wherein a first distance between the temperature detector and the first support part in the second direction is smaller than a first width of the first support region in the second direction.

Abstract: A photon counting device includes a plurality of pixels each including a photoelectric conversion element configured to convert input light to charge, and an amplifier configured to amplify the charge converted by the photoelectric conversion element and convert the charge to a voltage, an A/D converter configured to convert the voltage output from the amplifier of each of the plurality of pixels to a digital value and output the digital value, a correction unit configured to correct the digital value output from the A/D converter so that an influence of a variation in a gain and an offset value among the plurality of pixels is curbed, a calculation unit configured to output a summed value obtained by summing the corrected digital values corresponding to at least two pixels, and a conversion unit configured to convert the summed value output from the calculation unit to a number of photons.

Abstract: A spectrometer includes a support having a bottom wall part and a side wall part arranged on one side of the bottom wall part, a light detection element supported by the support to face a surface of the bottom wall part on the one side through a spectroscopic space, a resin molded layer provided at least on the surface of the bottom wall part on the one side, and a reflecting layer provided on the resin molded layer and included in an optical function part on the bottom wall part. The resin molded layer has a first part having a shape corresponding to the optical function part and a second part which surrounds the first part and is thinner than the first part.

Abstract: A dispersion measurement apparatus includes a pulse forming unit, an imaging unit, and an operation unit. The pulse forming unit forms a light pulse train including a plurality of light pulses having time differences and center wavelengths different from each other from a light pulse output from a pulsed laser light source. The imaging unit includes an image sensor capable of performing imaging at an imaging interval shorter than a minimum peak interval of the light pulse train, and images a light pulse train passed through a measurement object to generate imaging data. The operation unit receives the imaging data, detects a temporal waveform of the light pulse train for each pixel of the image sensor, and estimates a wavelength dispersion amount of the measurement object for each pixel of the image sensor based on a feature value of the temporal waveform.

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes: a first step of expanding an area irradiated with the laser light toward a first side in the objective area; and a second step of expanding the area irradiated with the laser light toward a second side different from the first side in the objective area.

Abstract: An inspection device includes a laser irradiation unit irradiating a wafer with laser light, a display displaying information, and a control unit. The control unit is constituted to execute deriving of an estimated processing result including information a modified region and a crack extending from the modified region formed on the wafer when the wafer is irradiated with the laser light by the laser irradiation unit on the basis of set recipes (processing conditions), and controlling the display so as to display an estimated processing result image depicting both a graphic image of the wafer and a graphic image of the modified region and the crack in the wafer in consideration of positions of the modified region and the crack in the wafer derived as the estimated processing result.

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes a processing step of scanning the objective area with an irradiation spot of the laser light while increasing a moving average in intensity of the laser light per unit area.

Abstract: Disclosed is a laser device including: a rod-shaped laser medium extending in a first direction; a first light source unit including a first base having a first notch through which the laser medium passes and a plurality of excitation light sources attached to the first base; and a holder supporting the laser medium and the first light source unit. At least one of the first base and the holder includes a first regulating part configured to regulate a position of the first base with respect to the holder.