Abstract: A method for producing an optical element includes: disposing a joint layer on a substrate; forming a first portion and a second portion in a second surface of the joint layer; and forming a plurality of structural bodies, which are made of a dielectric, on the second surface of the joint layer. The joint layer has a first surface facing the substrate, and the second surface located on a side opposite the first surface. The first portion is covered with a resist layer, and the second portion is exposed from the resist layer. After the dielectric is laminated on at least the second portion, the resist layer is removed to form the plurality of structural bodies on the second surface.

Abstract: A light emitting element includes: a substrate; a mesa portion formed on the substrate and including an active layer, a first semiconductor layer, and a second semiconductor layer; a metal layer including a first metal part disposed on a top surface of the mesa portion and connected to the second semiconductor layer and a second metal part formed integrally with the first metal part and extending along a side surface of the mesa portion; an insulating layer formed on the side surface; and a resin layer formed on the insulating layer. The first metal part includes an opening region formed with a light passage opening and a connection region for external connection. The second metal part is formed on the side surface via the insulating layer and the resin layer and overlaps the active layer when viewed in a direction perpendicular to a thickness direction of the substrate.

Abstract: There is provided a photodetector including: a photodetecting element having a surface and including a plurality of light-receiving regions arranged along the surface; and a plurality of meta-lens portions arranged on the surface to correspond to the plurality of light-receiving regions, wherein, in one light-receiving region and one meta-lens portion corresponding to each other among the plurality of light-receiving regions and the plurality of meta-lens portions, the one meta-lens portion includes a plurality of meta-lenses arranged along the surface.

Abstract: A sample observation device includes a light source unit configured to output a pulse train in which multiple optical pulses with different center wavelengths are arranged at predetermined time intervals as excitation light; a measurement unit configured to perform time-resolved measurement on an optical response that is transmitted from the sample and corresponds to irradiation with the optical pulses included in the pulse train while scanning the sample with the excitation light, and to acquire measurement data with respect to the optical pulses; and a processing unit configured to perform linear unmixing processing on the measurement data with respect to the optical pulses on the basis of an excitation spectrum for every target included in the sample.

Abstract: A laser device includes a support, a first heat sink, a plurality of laser light sources attached to the support, and a plurality of electrodes bridged between the plurality of laser light sources and the first heat sink. Each of the plurality of laser light sources is movable with respect to the support. Each of the plurality of electrodes is electrically connected to one of the plurality of laser light sources at a first connection portion, and is thermally connected to the first heat sink at a second connection portion. In each of the plurality of electrodes, an extension part between the first connection portion and the second connection portion has flexibility, and a length of the extension part is larger than a linear distance between the first connection portion and the second connection portion.

Abstract: A dispersion stability evaluation method is a method for evaluating a dispersion stability of dispersoid dispersed in a dispersion medium. The dispersion stability evaluation method includes a first step of holding a sample including the dispersion medium and the dispersoid on a reflective surface, and a second step of causing terahertz waves to be incident on the reflective surface from a side opposite to the sample and detecting the terahertz waves reflected by the reflective surface. In the second step, while a state where the dispersoid are allowed to move toward the reflective surface is maintained, a plurality of detection results respectively corresponding to a plurality of times apart from each other are acquired.

Abstract: A light emitting sealed body includes a housing which stores a discharge gas in an internal space and is provided with a first window portion to which first light is incident and a second window portion from which second light is emitted. The housing includes at least one flow path which is partitioned from the internal space and extends toward at least one of the first window portion and the second window portion.

Abstract: An actuator device includes a support portion; a first movable portion; a second movable portion; a first connection portion that connects the first and second movable portions such that the first movable portion is swingable around a first axis; a second connection portion that connects the second movable portion and the support portion such that the first movable portion is swingable around the first axis. Two natural angular frequencies ?1 and ?2 (where ?1<?2) for vibration of the first and second movable portions around the first axis satisfy one of the following equation (1) and equation (2) and do not satisfy the other, [ Equation ? 1 ] 0 < 1 - ( ? 1 ? ii ) 2 ? 0.2 ( 1 ) [ Equation ? 2 ] 0 < ( ? 2 ? ii ) 2 - 1 ? 0.

Abstract: A semiconductor device inspection method includes: performing a first inspection irradiation on at least one portion in an area to be inspected; outputting first information indicating presence or absence of a defective portion in an entire of the area to be inspected, based on the first inspection irradiation; when it is determined that a second inspection irradiation is to be performed, performing the inspection irradiation on at least one portion in the area to be inspected of the semiconductor device to which the test signal is being input, the portion of the second inspection irradiation is different from the portion of the first inspection irradiation; and outputting second information indicating presence or absence of a defective portion in the entire of the area to be inspected, based on the second inspection irradiation.

Abstract: A spectroscopic unit includes a housing, a light incident portion provided in the housing, a Fabry-Perot interference filter arranged in the housing and having a first mirror and a second mirror, a distance between the first mirror and the second mirror being variable. The light incident portion includes an aperture portion in which an aperture is formed and a band pass filter arranged between the aperture and the Fabry-Perot interference filter. The aperture portion is configured so that a value obtained by dividing a length of the aperture in a facing direction of the first mirror and the second mirror by a width of the aperture in a direction perpendicular to the facing direction is equal to or more than 0.5 and the entirety of light passing through the aperture is incident on the band pass filter.

Abstract: Provided is a nonhuman animal model that is obtained by modifying a gene encoding thioredoxin and useful as a disease model of aging, kidney diseases, cardiovascular diseases, hypertension, aortic dissection, chronic obstructive lung disease, age-dependent epilepsy, abnormality of lipid metabolism, anemia, osteoporosis, abnormal immunity, etc. These variety of phenotypes are caused by the fact that a modification of a gene encoding thioredoxin induces hypofunction of thioredoxin expressed in multiple organs throughout the body. The gene encoding thioredoxin is a gene selected from among TXN, TRX, TRX1, RRDX, Txn1, Txn, Trx1 and ADF.

Abstract: A reflective dynamic metasurface of an embodiment comprises a structure enabling phase modulation in each of pixels constituting at least a one-dimensional array. The metasurface includes: a laminated structure body having a transparent conductive layer and a dielectric layer; a first metal film on one surface of the laminated structure body; a second metal film on the other surface of the laminated structure body; and a drive circuit controlling voltage applied between the first and second metal films. The first and second metal films are arranged to sandwich the pixels. The first metal film is arranged to expose a pair of window regions in one pixel, and the second metal film includes partial metal films defining the shape of each pixel and separated from each other. The drive circuit individually controls the potential of each partial metal film, thereby modulating the phase of the input light for each pixel.

Abstract: A scanning microscope unit includes: a light source for outputting irradiation light; a photodetector; a MEMS mirror for scanning an irradiation light over an observation object, and for guiding an observation light toward the photodetector; a scanning lens for guiding the irradiation light scanned by the MEMS mirror, to a microscope optical system, and for guiding the observation light imaged by the microscope optical system, to the MEMS mirror; and a frame member formed in a frame shape to define an opening, and disposed on a side of the microscope optical system with respect to the scanning lens such that the irradiation light and the observation light pass through the opening. The frame member includes a calibration portion provided in a side portion defining the opening, and for generating calibration light including a sensitivity wavelength of the photodetector in response to an incidence of the irradiation light.

Abstract: The mass spectrometer includes a sample stage, an irradiation unit that irradiates the sample with an energy beam and ionizes a component of the sample, an extraction electrode that extracts the ionized sample from the surface of the sample by a potential difference from the sample stage, an MCP that emits electrons in accordance with the ionized sample, an imaging part that acquires an image based on the electrons emitted by the MCP, and a control unit that controls operations of the irradiation unit, the extraction electrode, and the imaging part. The control unit changes the potential of the extraction electrode at a timing in accordance with the detection target component after the irradiation of the energy beam by the irradiation unit, and causes the imaging part to acquire an image as an analysis target in a period in accordance with the detection target component.

Abstract: A light sheet microscope includes an irradiation optical system, a detection optical system, and a photodetector. The irradiation optical system includes a wavelength sweep light source which outputs light of which a wavelength changes with time as excitation light, a spectroscopic element on which the excitation light output from the wavelength sweep light source is incident and which emits the excitation light at an emission angle corresponding to a wavelength of the excitation light, a relay optical system which includes a cylindrical lens on which the excitation light emitted from the spectroscopic element is incident at an incident angle corresponding to the emission angle, and a first objective lens which condenses the excitation light guided by the relay optical system and irradiates the sample with the excitation light having a sheet shape.

Abstract: A semiconductor apparatus examination method includes a step of detecting light from a plurality of positions in a semiconductor apparatus (D) and acquiring a waveform corresponding to each of the plurality of positions, a step of extracting a waveform corresponding to a specific timing from the waveform corresponding to each of the plurality of positions and generating an image corresponding to the specific timing based on the extracted waveform, and a step of extracting a feature point based on a brightness distribution correlation value in the image corresponding to the specific timing and identifying a position of a drive element in the semiconductor apparatus based on the feature point.

Abstract: A film thickness measuring apparatus measures a film thickness of a sample during a manufacturing step. The film thickness measuring apparatus includes a lens focusing light (plasma light) generated in the manufacturing step and reflected by one surface of the sample, an inclined dichroic mirror having a transmissivity and a reflectivity changing in accordance with a wavelength in a predetermined wavelength region and separating light focused by the lens through transmission and reflection, an area sensor capturing an image of light separated by the inclined dichroic mirror, and a control apparatus estimating the film thickness of the sample on the basis of a signal from the area sensor capturing an image of light and obtaining a film thickness distribution on the one surface of the sample. Light reflected by the sample includes light having a wavelength included in the predetermined wavelength region of the inclined dichroic mirror.